AEC-Q100G Qual Report Objective: 0.25um Copper Freescale PN: See below Part Name: Wire Qualification and X flag to Solid Flag Conversion for FSL-KLM-FM at FSL-ATMC-FAB Customer Name(s): Varies PN(s): Varies Plan or Results: Revision # & Date: Refer below Technology: Package: Refer below Design Engr: Not applicable Fab / Assembly / Final Test Sites: FSL-ATMC-Fab/ FSL-KLM-FM/ FSL-KLM -FM Maskset#: Rev#: Refer below (Signature/Date shown below may be electronic) GAO Approval (for Lim Jasmine-B18239 DIM/BOM results) 9 May 2014 Signature & Date: GAO(Global Assembly Aperation) Engr: Poh-Leng Eu-R38158, Lim Jasmine-B18239 Die Size (in mm) W x L Refer below Part Operating Temp. Grade: QUARTZ Tracking #: Refer below Product Engr: Refer below Nurazah Ahmad- R63712 NPI PRQE Approval Signature & Date: 9 May 2014 NPI PRQE: Nurazah Ahmad- R63712 LOT A (144LQFP) 8EMHA21URY00 -40C to 125C Grade 1 LOT B (144LQFP) 8EMHA21URW00 LOT C (144LQFP) 8EMHA21URX00 CAB Approval 13100530M Signature & Date: 9 May 2014 Trace/DateCode: LOT D (80 QFP)8EMHA21URZ0 0 Trace/DateCode: Customer Approval Signature & Date: May be N/A TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY This testing is performed by Freescale Reliability Lab (KLM-RAL LAB) unless otherwise noted in the Comments. Device Name: Bluefin_AUTO Technology Code: E025AFXQ Maskset: 0M23S Die Size (mm): 6.630 X 6.410 Package code/ dimension: 8259, 144 20x20 LQFP 1.4P0.5 Device Temperature: 40C to 125C PE: Tan Wei MingB37999/ Mohd Tarmizi SuhaibB48012 Quartz ID: 225213 Device Name: Bluefin_AUTO Technology Code: E025AFXQ Maskset: 0M23S Die Size (mm): 6.630 X 6.410 Package code/ dimension: 6019/ 80 14x14 QFP Device Temperature: 40C to 125C PE: Tan Wei MingB37999/ Mohd Tarmizi SuhaibB48012 Quartz ID: 225243 GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS Stress Test Reference JESD22A113 J-STD-020 Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units including spares Results Lot ID-(#Rej/SS) NA=Not Applicable Preconditioning (PC) : PC required for SMDs only. MSL 3 @ 260°C, +5/-0°C TEST @ RH All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as required per test conditions. JESD22A101 A110 Highly Accelerated Stress Test (HAST): PC before HAST (for SMDs only): Required HAST = 110°C/85% for 264hrs Bias = Max Vdd Timed RO of 48hrs. MAX TEST @ RH 77 0 0 Pass JESD22A102 A118 Unbiased HAST (UHST): PC before UHST (for SMDs only): Required UHST = 110°C/85%RH for 264hrs Timed RO of 48hrs. MAX TEST @ R 77 3 231 77 3 231 Comments or Generic Data Lot A: 0/ 154 Lot B: 0/154 Lot C: 0/154 End Point Requirements TEST @ RH Minimum Sample Size # of Lots Total Units including spares All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as required per test conditions. Results Lot ID-(#Rej/SS) NA=Not Applicable Comments or Generic Data Lot D: 0/77 Generic Data: BLUEFIN (M23S), 144LQFP 20x20, Q225426 = 0/462 Generic Data: Kirin 2E (M23E), Q217394, LQFP 80 14x14: 0/154 MC9S08AC128 (N79A) Q210577, LQFP 80 14x14: 0/77 PC Generic Data: Kirin 2E (M23E), Q217394, LQFP 80 14x14: 0/154 MC9S08AC128 (N79A) Q210577, LQFP 80 14x14: 0/77 TEST @ RH 77 0 0 Pass Lot A: 0/77 Lot B: 0/77 Lot C: 0/77 TEST @ R 77 0 0 Not required Lot A: 0/77 Lot B: 0/77 Lot C: 0/77 TEST @ H For AEC: WBP =/> 3 grams 77 1 77 Lot D: 0/77 HAST UHST JESD22A104 AEC Q100Appendix 3 TC Temperature Cycle (TC): TEST @ H PC before TC (for SMDs only): For AEC: WBP =/> 3 grams Required TC = -65°C to 150°C for 500 cycles. For AEC only: WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used. JESD22A105 TEST @ RH Preconditioning plus Power Temperature Cycle (PC+PTC): (See AEC-Q100 for test applicability criteria) PC before PC+PTC (for SMDs only) PC= MSL @ °C, +5/-0°C PTC = °C to °C for 1000 cycles; Bias = JESD22A105 Power Temperature Cycle (PTC): (See AEC-Q100 for test applicability.) PTC = °C to °C for 1000 cycles; Bias = JESD22A103 High Temperature Storage Life (HTSL): 150°C for 1008 hrs PC + PTC PTC Post TC500, WP: Pass, > 3 grams Post TC500, WP: Pass, > 3 grams 22+3 SMD only 0 0 Not required TEST @ RH 22+3 SMD only 0 0 Not required TEST @ RH 23+3 SMDs; 45+3 non- SMD 0 0 Not required TEST @ RH 23+3 SMDs; 45+3 non- SMD 0 0 Not required TEST @ RH 77 1 77 TEST @ RH 77 0 0 Not required Minimum Sample Size # of Lots Total Units including spares Minimum Sample Size # of Lots Total Units including spares 77 0 0 Not required TEST @ RHC 77 0 0 Not required TEST @ RH 800 1 800 Lot A: 0/800 TEST @ RH 800 0 0 Pass TEST @ RHC 77 0 0 Not required TEST @ RHC 77 0 0 Not required Lot A: 0/77 Timed RO = 96hrs. MAX HTSL TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS Stress Test Reference JESD22A108 Test Conditions End Point Requirements High Temperature Operating Life TEST @ RHC (HTOL): AEC Ta = 125°C for 1000 hrs Bias = Max Vdd Results Lot ID-(#Rej/SS) NA=Not Applicable Comments or Generic Data End Point Requirements Results Lot ID-(#Rej/SS) NA=Not Applicable Comments or Generic Data Devices incorporating NVM shall receive 1X 'NVM endurance preconditioning'(W/E cycling). Test R, H, C after W/E cycling. HTOL Timed RO of 96hrs. MAX AEC Q100-008 Early Life Failure Rate (ELFR): AEC Ta = 125°C for 48 hrs Bias = Max Vdd Generic Data: Bluefin (0M23S), Q225213, LQFP 144 20X20: 0/800 Devices incorporating NVM shall receive 0.1X 'NVM endurance preconditioning'(W/E cycling). Test R, H, C after W/E cycling. ELFR Timed RO of 48 hrs MAX AEC Q100-005 NVM Endurance, Data Retention, and Operational Life (EDR): 150°C for 1008 hrs or 175°C for 504hrs Devices incorporating NVM shall receive 1X 'NVM endurance preconditioning'(W/E cycling). Test R, H, C after W/E cycling. Timed RO of 96hrs. MAX EDR TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS Stress Test Minimum Sample Size # of Lots Total Units including spares Minimum Sample Size # of Lots Total Units including spares AEC Q100-001 Wire Bond shear (WBS) Cpk = or > 1.67 30 bonds from minimum 5 units 3 15 Lot A: Cpk> 1.67 Lot B: Cpk> 1.67 Lot C: Cpk> 1.67 Cpk = or > 1.67 30 bonds from minimum 5 units 1 5 Lot D: Cpk > 1.67 MilStd8832011 Wire Bond Pull (WBP): Cond. C or D Cpk = or > 1.67 30 bonds from minimum 5 units 3 15 Lot A: Cpk> 1.67 Lot B: Cpk> 1.67 Lot C: Cpk> 1.67 Cpk = or > 1.67 30 bonds from minimum 5 units 1 5 Lot D: Cpk > 1.67 15 2 30 17ARL10115D680: Pass 17ARL10115D683: Pass >95% lead coverage of critical areas 15 2 30 17ARL10006D603: Pass 17ARL10006D600: Pass 10 2 20 17ARL10115D680: Cpk > 1.67 17ARL10115D683: Cpk > 1.67 Cpk = or > 1.67 10 2 20 17ARL10006D603: Cpk >1.67 17ARL10006D600: Cpk > 1.67 Reference Test Conditions End Point Requirements WBS WBP JESD22B102 Solderability (SD): >95% lead coverage of critical areas 8hr.(1 hr. for Au-plated leads) Steam age prior to test. If production burn-in is done, samples must also undergo burn-in prior to SD. JESD22B100 Physical Dimensions(PD): PD per FSL 98A drawing SD Cpk = or > 1.67 Results Lot ID-(#Rej/SS) NA=Not Applicable Comments or Generic Data End Point Requirements Results Lot ID-(#Rej/SS) NA=Not Applicable Comments or Generic Data PD Dimensional (DIM): GAO to verify PD results against valid 98A drawing. BOM Verification (BOM): GAO to verify qual lot ERF BOM is accurate. DIM & BOM AEC-Q100-010 SBS JESD22B105 LI DIM: Not applicable BOM: Pass Solder Ball Shear (SBS): Cpk = or >1.67 Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip). Two reflow cycles at MSL reflow temperature before shear. 10 (5 balls from a min. of 10 devices) 0 Lead Integrity (LI): Not required for surface mount devices; Only required for through-hole devices. 5 (10 leads from each of 5 parts) 0 No lead breakage or cracks 0 DIM: Not applicable BOM: Pass For solder ball mounted packages only; NOT for Flip Chips. 0 Cpk = or >1.67 10 (5 balls from a min. of 10 devices) 0 0 No lead breakage or cracks 5 (10 leads from each of 5 parts) 0 0 Minimum Sample Size # of Lots Total Units including spares For solder ball mounted packages only; NOT for Flip Chips. TEST GROUP D - DIE FABRICATION RELIABILITY TESTS Stress Test Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units including spares Results Lot ID-(#Rej/SS) NA=Not Applicable Comments End Point Requirements Results Lot ID-(#Rej/SS) NA=Not Applicable Comments Electro Migration (EM) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. Time Dependent Dielectric Breakdown (TDDB) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. Hot Carrier Injection (HCI) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. Stress Migration (SM) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. Negative Bias Temperature Instability (NBTI) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. EM TDDB HCI SM NBTI TEST GROUP E - ELECTRICAL VERIFICATION TESTS Stress Test Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units including spares Results Lot ID-(#Rej/SS) NA=Not Applicable Freescale 48A Pre- and Post Functional / Parametrics (TEST): For AEC, test software shall meet requirements of AEC-Q100-007. Testing performed to the limits of device specification in temperature and limit value. 0 Fails All All All See Results Summary ElectroStatic Discharge/ TEST @ RH Human Body Model Classification 2KV min. (HBM): Test @ 500/1000/1500/2000 Volts For AEC, see AEC-Q100-002 for classification levels. 3 units per Voltage level 1 12 Lot A: 500V: 0/3 1000V: 0/3 1500V: 0/3 2000V: 0/3 AEC-Q100-003 or JESD22 ElectroStatic Discharge/ Machine Model Classification m(MM): Test @ 200 Volts For AEC, see AEC-Q100-003 for classification levels. TEST @ RH 200V only 3 units per Voltage level 0 0 AEC-Q100-011 ElectroStatic Discharge/ Charged Device Model Classification (CDM): Test @ 250/500/750 Volts For AEC, see AEC-Q100-011 for classification levels. Timed RO of 96hrs MAX. TEST @ RH All pins =/> 500V For AEC, Corner pins =/> 750V; 3 units per Voltage level 0 JESD78 plus AEC-Q100004 for AEC Latch-up (LU): Test per JEDEC JESD78 with the AEC-Q100-004 requirements for AEC. Ta= Maximum operating temperature Vsupply = Maximum operating voltage Electrical Distribution (ED) TEST @ RH 6 30units TEST AEC-Q100-002 / JESD22-A114E Jan 2007 HBM MM Comments or Generic Data End Point Requirements Minimum Sample Size # of Lots Total Units including spares Results Lot ID-(#Rej/SS) NA=Not Applicable Comments or Generic Data This action refers to Final Testing of all qualification units. 0 Fails All All All See Results Summary This action refers to Final Testing of all qualification units. TEST @ RH 2KV min. 3 units per Voltage level 0 0 Not required Not required TEST @ RH 200V only 3 units per Voltage level 0 0 Not required 0 Not required TEST @ RH All pins =/> 500V For AEC, Corner pins =/> 750V; 3 units per Voltage level 0 0 Not required 0 0 Not required TEST @ RH 6 0 0 Not required 1 +1 30 + 30 Pass Cpk > 1.67 5 units 0 0 Not required CDM LU AEC-Q100-009, Freescale 48A spec TEST @ RHC For AEC, Cpk target > 1.67 Comparision between Copper TEST @ RHC Wire and Gold Wire performance at T0. For AEC, Cpk target > 1.67 ED FORMPPAP004XLS 1 of 2 Freescale Rev T Freescale PN: See below Part Name: Customer Name(s): Varies PN(s): Varies For AEC, AEC-Q100-007 Fault Grading (FG) Plan or Results: Revision # & Date: FG shall be = or > 90% for qual units FG%= No Change FG For AEC, AEC-Q003 Characterization (CHAR): Ony performed on new technologies and part families per AEC Q003. Refer below Production Test requirement: FG shall be = or > 90% for 98% w/o Iddq qual units 95% w/Iddq 100% TYPE2 faults detection FG%= No Change Not required Production Test requirement: 98% w/o Iddq 95% w/Iddq 100% TYPE2 faults detection Not required CHAR Identify the speed pattern that drifts TEST @ RHC the most and create guardband if needed. (Two rdpts - TimeZero and final NBTI readpoint). Serialized units. 1lot: 77 3lot: 25 0 6 0 Not required TEST @ RHC Not required TEST @ R 1lot: 77 3lot: 25 0 6 0 Not required NBTI For AEC, AEC-Q100-006 Electro-Thermally Induced Gate Leakage (GL): 155°C, 2.0 min, +400/-400 V Per AEC Q100 Rev G, this test is performed for information only. Timed RO of 96 hrs MAX. For all failures, perform unbiased bake (4hrs/125°C, or 2hrs/150°C) and retest; recovered units are GL failures. TEST @ R 0 0 Not required GL (for information only) BOM: Logic Part Fab/Mask set WAFER TECH CD Assembly Site PACK DESCRIPTION DIE SIZE(mmxmm) MOLD COMPOUND EPOXY DESCRIPTION BLUEFIN FSL-ATMC-FAB/ M23S E025AFXQ FSL-KLM-FM 144 20x20 LQFP 6.630 X 6.410 CEL-9200HF10M-CW CRM-1064MBL 23um/ 0.9mil, Cu Solid BLUEFIN FSL-ATMC-FAB/ M23S E025AFXQ FSL-KLM-FM 80 14x14 QFP 6.630 X 6.410 CEL-9200HF10M-CW CRM-1064MBL 23um/ 0.9mil, Cu Wire Lead Frame Flag Type Solid Logic Part Package Qualification Generic Data Fab/Mask set/Wafer Tech CD Assembly Site PACK DESCRIPTION DIE SIZE(mmxmm) MOLD COMPOUND EPOXY DESCRIPTION Wire Description CAB 217316 S08AC128 TSMC3/ N79A/ E025FXXQ FSL-KLM-FM 80LQFP 14x14 3.395 x 3.583 HITACHI 9200HF10M CRM-1064MBL 25um/ 1.0mil, Cu 11443313M 217394 Quartz KIRIN2E (MCF52230) TSMC11/ M23E/ E025AFXQ FSL-KLM-FM LQFP 80 14x14 7.150 x 6.940 HITACHI 9200HF10M CRM-1064MBL 25um/ 1.0mil, Cu 11443313M Logic Part Package Description/Code Mask set FAB Wafer Tech Die Size Assembly Site MOLD COMPOUND Epoxy DZ60 BLUEFIN_AUTO BONITO BONITO RAZORFISH RAZORFISH YELLOWFIN_AUTO YELLOWFIN_AUTO YELLOWFIN_AUTO BARRACUDA4 BARRACUDA4 GOLDFISH KOI MARLIN2 MARLIN2 STURGEON STURGEON TORPEDO TORPEDO 100 14x14 LQFP/ 8264 M78G M23S M42E M42E M80F M80F M84E M84E M84E L01Y L01Y M34C M66G L59W L59W M65G M65G M89C M89C FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB FSL-ATMC-FAB E025FXXQ E025AFXQ E025AFX5 E025AFX5 E025AFX5 E025AFX5 E025AFX5 E025AFX5 E025AFX5 E025AFXT E025AFXT E025AFXQ E025AFXT E025AFXT E025AFXT E025AFXT E025AFXT E025AFXT E025AFXT 3.922X3.982 6.630 X 6.410 4.452 X 4.122 4.452 X 4.122 5.932 X 6.175 5.932 X 6.175 5.292 X 5.102 5.292 X 5.102 5.292 X 5.102 5.506X5.974 5.506X5.974 3.906X3.189 4.234X4.234 5.181X5.427 5.181X5.427 4.713X4.280 4.713X4.280 4.400X4.700 4.400X4.700 FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM FS-KLM-FM CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CEL-9200HF10M-CW CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL CRM-1064MBL Qualification By Similarity: 144 20x20 LQFP/ 8259 112 20x20 LQFP/ 8255 80 14x14 QFP/ 6019 112 20x20 LQFP/ 8255 144 20x20 LQFP/ 8259 112 20x20 LQFP/ 8255 144 20x20 LQFP/ 8259 80 14x14 QFP/ 6019 80 14x14 QFP/ 6019 112 20x20 LQFP/ 8255 80 14x14 QFP/ 6019 80 14x14 QFP/ 6019 80 14x14 QFP/ 6019 112 20x20 LQFP/ 8255 80 14x14 QFP/ 6019 112 20x20 LQFP/ 8255 80 14x14 QFP/ 6019 112 20x20 LQFP/ 8255 Revision Date Comments Author Rev 0 08-May-14 Final Qualification Report Nurazah Ahmad FORMPPAP004XLS 2 of 2 Wire Description 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu 23um/ 0.9mil, Cu Freescale Rev T