AEC-Q100G Qualification Results 100ld LQFP Objective: Bolero 1.5M 1M03Y AEC NPI Qualification Freescale PN: Part Name: Technology: Package: Fab / Assembly / Final Test Sites: Maskset#: Rev#: Die Size (in mm) WxLxT Part Operating Temp. Grade: Customer Name(s): PN(s): Design Engr: Phone #: Product Engr: Phone #: Prod. Package Phone #: NPI PRQE: Phone #: MPC5607B Bolero 1.5M 0.09um CMOS90 Z3 core LQFP 100ld 14x14 x 1.4 Pitch 0.5 FSL-ATMC / FSL-KLM-FM FSL-KLM-FM M03Y 1 5.082 x 5.301 x 0.3302 125°C Ta Grade 1 Trace/DateCode Summary Revision # 1.2 Date: 28th February 2013 Navin Bishnoi QUARTZ Tracking #: Colin Jackson Graham Doak Chasity Fleming 204540 (Signature/Date shown below may be electronic) PPE Approval Signature & Date: NPI PRQE Plan Approval Signature & Date: CAB Approval Signature & Date: Douglas Blackwood QAA1043A N/A Douglas Blackwood 31st January 2011 eCAB: 10383042M Neil Ross 31st January 2011 This testing is performed by Freescale FSL-EKB, FSL-KLM, and FSL-ATX where noted in the Comments GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS STRESS TEST Reference J=JESD22 Test Conditions (Surface Mount Devices Only - PC required for THB, HAST, AC, UHST, TC, PC+PTC) JESD22- Preconditioning : A113 MSL 3 @ 260°C, +5/-0°C J-STD-020 Pre and Post CSAM SS=11 units per lot per stress test PC PC before HAST required for SMDs. Highly Accelerated Stress Test, Biased: HAST = 130°C/85%RH for 96 hrs. Bias = 5.5V End Point Requirements TEST @ RHC HAST JESD22A110 AC JESD22A102 TC JESD22A104 AEC Q100Appendix 3 PC before TC required for SMDs TEST @ HC Temperature Cycle: WBP =/> 3 grams TC = -65°C to 150°C for 500 cycles. WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used. STRESS TEST Reference J=JESD22 PC + PTC JESD22A105 Test Conditions (Surface Mount Devices Only - PC required for THB, HAST, AC, UHST, TC, PC+PTC) For SMD devices only. Preconditioning plus Power Temperture Cycle: PTC JESD22A105 HTSL JESD22A103 Minimum Sample Size # of Lots Total Units All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC Results LotID-(#Rej/SS) NA=Not Applicable Pass by similarity Comments Generic Data Performed in KLM DD69779: 0/231 Bolero1.5M 100ld 0M03Y DD70001: 0/231 Bolero1.5M 100ld 0M03Y DD72457: 0/231 Bolero1.5M 100ld 0M03Y Generic Data Performed in KLM DD69563: 0/77 Bolero1.5M 100ld 0M03Y DD70003: 0/77 Bolero1.5M 100ld 0M03Y DD70001: 0/77 Bolero1.5M 100ld 0M03Y TEST @ RH 77 0 0 Pass by similarity TEST @ R 77 0 0 Pass by similarity 77 0 0 Pass by similarity Minimum Sample Size # of Lots Total Units TEST @ RH 22 SMD only 0 0 Low power device, not required. Power Temperature Cycle: PTC = ?°C to ?°C for 1000 cycles; Bias = ? TEST @ RH 23 SMDs; 45 non- SMD 0 0 Low power device, not required. High Temperature Storage Life: 150°C for 1008 hrs TEST @ RHC 77 0 0 Timed RO of 48hrs. MAX PC before AC required for SMDs. Autoclave: AC = 121°C/100%RH/15 psig for 96 hrs Timed RO of 2-48hrs. MAX End Point Requirements Results LotID-(#Rej/SS) NA=Not Applicable Pass by similarity Generic Data Performed in KLM DD69563: 0/77 Bolero1.5M 100ld 0M03Y DD70003: 0/77 Bolero1.5M 100ld 0M03Y DD70001: 0/77 Bolero1.5M 100ld 0M03Y Generic Data Performed in KLM DD69563: 0/77 Bolero1.5M 100ld 0M03Y DD70003: 0/77 Bolero1.5M 100ld 0M03Y DD70001: 0/77 Bolero1.5M 100ld 0M03Y Wirepull post 500 cycles >3g Comments Performed in KLM DD70001: 0/77 Bolero1.5M 100ld 0M03Y Timed RO = 96hrs. MAX TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS STRESS TEST Reference HTOL JESD22A108 NBTI ELFR Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not applicable High Temperature Operating Life: Ta= 125°C TEST @ RHC 77 0 0 Performed on 176ld. Pass by Generic Data: similarity Performed in EKB 0/77 Bolero 512k MPC5604B 0M27V (3024hrs) 0/77 Bolero 512k MPC5604B 1M27V (2016hrs) 0/77 Pictus 512k MPC5604P 0M36W (1008hrs) 0/154 Pictus 512k MPC5604P 0M26V (1008hrs) 0/ 77 Bolero1.5M MPC5607B 1M03Y (1008hrs) Identify the speed pattern that drifts the most and create guardband if needed. (Two readpoints Time zero and at final NBTI readpoint). Serialised units. TEST @ RHC 77 0 0 Pass by similarity TEST @ RHC 800 0 0 Pass by similarity TEST @ RHC 77 0 0 Pass by similarity Generic Data: Performed in EKB DD69563: 0/77 Bolero1.5M 176ld 0M03Y DD69368: 0/77 Bolero1.5M 176ld 0M03Y DD69999: 0/77 Bolero1.5M 176ld 0M03Y TEST @ RHC 77 0 0 Pass by similarity Generic Data: Performed in EKB DD69563: 0/77 Bolero1.5M 176ld 0M03Y DD69368: 0/77 Bolero1.5M 176ld 0M03Y DD69999: 0/77 Bolero1.5M 176ld 0M03Y AEC Q100- Early Life Failure Rate: 008 Ta = 125°C for 48 hrs; 10% of NVM cycling @125°C, as shown in EDR below, is required NVM in Checkerboard EDR Comments AEC Q100- NVM Endurance, Data Retention, 005 C-Flash: 512Kb Block @ -40°C 100K W/E for 16k block size 10K W/E for 32k block size 1K W/E for 128k block size Generic Data: Performed in EKB DD69563: 0/77 Bolero1.5M 176ld 0M03Y DD69368: 0/77 Bolero1.5M 176ld 0M03Y DD69999: 0/77 Bolero1.5M 176ld 0M03Y Generic Data: Performed in EKB/KLM DD69368: 0/800 Bolero1.5M 176ld 0M03Y DD67735: 0/908 Bolero 512k 144ld 0M27V DD67736: 0/843 Bolero 512k 144ld 0M27V DD61297: 0/685 Pictus 512k 100ld 0M26V D-Flash: 64Kb Block @ -40°C 100K W/E for 16k block size NVM in Checkerboard 504, 1008hrs, 2016hrs FIO @ 150°C NVM Endurance, Data Retention, C-Flash: 512Kb Block @ 125°C 100K W/E for 16k block size 10K W/E for 32k block size 1K W/E for 128k block size D-Flash: 64Kb Block @ 125°C 100K W/E for 16k block size NVM in Checkerboard 504, 1008hrs, 2016hrs FIO @ 150°C FORMPPAP004XLS 1 of 3 Freescale Rev U Freescale PN: MPC5607B Part Name: Bolero 1.5M Customer Name(s): PN(s): Summary Revision # 1.2 Date: 28th February 2013 TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS STRESS TEST Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not applicable Comments WBS AEC Q100- Wire Bond shear 001 Cpk = or > 1.67 30 bonds from minimum 5 units 0 0 Pass by similarity Generic Data: Performed in KLM DD69779: Cpk = 2.87 Bolero1.5M 100ld 0M03Y WBP MilStd883- Wire Bond Pull 2011 Cond. C or D Cpk = or > 1.67 30 bonds from minimum 5 units 0 0 Pass by similarity Generic Data: Performed in KLM DD69779: Cpk = 3.34 Bolero1.5M 100ld 0M03Y >95% lead coverage of critical areas 15 0 0 Standard package, generic data can be supplied on request Cpk = or > 1.67 10 0 0 Standard package, In-line data can be supplied on request Cpk = or >1.67 10 0 0 N/A, not required for leaded devices. 5 0 0 N/A, not required for SM devices. SD JESD22B102 PD JESD22B100 Solderability; 8hr. Steam age (1 hr. for Au-plated leads) prior to test. If production burn-in is done, samples must also undergo burn-in. Physical Dimensions PD per 98A drawing AEC-Q100- Solder Ball Shear; 010 Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip). Two 260°C reflow cycles before shear. JESD22- Lead Integrity B105 Not required for surface mount devices; Only required for through-hole devices. SBS LI (5 balls from a min. of 10 devices) No lead breakage or cracks (10 leads from each of 5 parts) TEST GROUP D - DIE FABRICATION RELIABILITY TESTS STRESS TEST Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not applicable Electro Migration Report available on request NBTI Negative Bias Temperature Instability Report available on request TDDB Time Dependent Dielectric Breakdown Report available on request HCI Hot Carrier Injection Report available on request SM Stress Migration Report available on request EM Comments The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. TEST GROUP E - ELECTRICAL VERIFICATION TESTS STRESS TEST Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units 0 Fails All All All TEST @ RH 2KV min. 3 units per Voltage level 0 0 Pass by similarity Generic data Performed in KLM Performed on Bolero1.5M MPC5607B 1M03Y 176ld 500V 0/3 1000V 0/3 1500V 0/3 2000V 0/3 AEC-Q100- ElectroStatic Discharge/ ESD 003 Machine Model Classification: (MM) Test @ 50 / 100 / 150 / 200/ 250 Volts CLASSIFICATION See AEC-Q100-003 for classification levels. TEST @ RH 200V min. 3 units per Voltage level 0 0 Pass by similarity Generic data Performed in KLM Performed on Bolero1.5M MPC5607B 1M03Y 176ld 50V 0/3 100V 0/3 150V 0/3 200V 0/3 AEC-Q100- ElectroStatic Discharge/ ESD 011 Charged Device Model Classification: (CDM) Test @ 250 / 500 / 750 Volts CLASSIFICATION See AEC-Q100-011 for classification levels. JESD78 Latch-up: LU plus Test per JEDEC JESD78 with the AEC-Q100-004 AEC-Q100- requirements. 004 Ta= Operating Temperature Maximum TEST @ RH Corner pins =/> 750V; All other pins =/> 500V TEST @ RH 3 units per Voltage level 1 9 Performed in KLM 6 1 6 Lot1: 250V 0/3 500V 0/3 750V 0/3 Corner pins Lot1: 0/6 30 0 0 Pass by similarity Freescale 48A Pre- and Post Functional / Parametrics Test software shall meet requirements of AECQ100-007. Testing performed to the limits of device specification in temperature and limit value. AEC-Q100- ElectroStatic Discharge/ ESD 002 Human Body Model Classification: (HBM) Test @ 500 / 1000 / 1500 / 2000Volts CLASSIFICATION See AEC-Q100-002 for classification levels. TEST ED AEC-Q100- Electrical Distribution 009, Freescale TEST @ RHC Cpk = or > 1.67 FG AEC-Q100- Fault Grading 007 AEC-Q003 Characterization: Performed on new technologies and part families. FG shall be = or > 90% for qual units AEC-Q100- Electro-Thermally Induced Gate Leakage; 006 155°C, 2.0 min, +400/-400 V Timed RO of 96 hrs MAX. TEST @ R 6 0 <40dBuV 150kHz - 1GHz 1 0 CHAR GL EMC SAE J1752/3 Radiated Emissions FORMPPAP004XLS Electromagnetic Compatibility (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/Freescale agreement) Results LotID-(#Rej/SS) NA=Not applicable Lot1 - DD77356 Pass Comments Performed in KLM Generic Data: Performed on Bolero1.5M MPC5607B 1M03Y 176ld 99.19% 2 of 3 Pass by similarity Generic Data: Performed in EKB Performed on Bolero1.5M MPC5607B 0M03Y 176ld 0 Pass by similarity Generic Data: Performed in KLM DD69779: 0/6 Bolero1.5M 100ld 0M03Y 0 Pass by similarity Generic Data Performed in ATX Performed on Bolero1.5M MPC5607B 1M03Y 176ld Freescale Rev U Freescale PN: MPC5607B Part Name: Bolero 1.5M AEC Q100- Short Circuit Characterization SC 012 Applicable to all smart power devices. This test and statistical evaluation (see section 4 of Q100012) shall be performed per agreement between user and supplier on a case-by-case basis. SER JEDEC Unaccelerated: JESD89-1 or Accelerated: JESD89-2 & JESD89-3 Soft Error Rate Applicable to devices with memory sizes 1Mbit SRAM or DRAM based cells. Either test option (unaccelerated or accelerated) can be performed, in accordance to the referenced specifications. This test and its accept criteria is performed per agreement between user and supplier on a case-bycase basis. Final test report shall include detailed test facility location and altitude data. STRESS TEST Reference Test Conditions Customer Name(s): PN(s): 10 0 0 3 0 0 Summary Revision # 1.2 Date: 28th February 2013 Not applicable to microcontroller Pass by similarity Performed on technology TEST GROUP F - DEFECT SCREENING TESTS PAT AEC Q001 Part Average Testing SBA AEC Q002 Statistical Bin Analysis Generic Quartz 163078 163099 159917 166258 173479 184817 204538 Data: Device PC5604B PC5604B PC5604P PC5604B PC5607B PC5607B PC5607B Mask 0M27V 1M27V 0M26V 1M27V 0M03Y 0M03Y 1M03Y Revision 1.0 1.1 1.2 FORMPPAP004XLS Title Bolero Bolero Pictus Bolero Bolero Bolero Bolero 512k 512k 512k 512k 1.5M 1.5M 1.5M 144ld 144ld 100ld 100ld 176ld 100ld 176ld End Point Requirements Minimum Sample Size # of Lots Total Units Has PAT been established for this part? Has SBYA been established for this part? NPI NPI NPI NPI NPI NPI NPI Revision Date 16th July 2010 31st January 2011 28th February 2013 Qual Qual Qual Qual Qual Qual Qual Fab ATMC ATMC ATMC ATMC ATMC ATMC ATMC Mould SUMITOMO EME-G700E SUMITOMO EME-G700E SUMITOMO EME-G700E SUMITOMO EME-G700E HITACHI CEL-9240 SUMITOMO EME-G700E HITACHI CEL-9240 Results LotID-(#Rej/SS) NA=Not applicable Implemented Comments Implemented Die Size 4.261 x 4.471 4.261 x 4.471 4.351 x 4.062 4.261 x 4.471 5.082 x 5.301 5.082 x 5.301 5.082 x 5.301 Description Original Plan. Added results Updated format for Web publishing x x x x x x x 0.33mm 0.33mm 0.33mm 0.33mm 0.3302 0.3302 0.3302 CAB 08462238M 08462238M 08462222M 08462239M 09412905M 09412907M 10383042M Douglas Blackwood Douglas Blackwood Douglas Blackwood 3 of 3 Freescale Rev U