Down - Connor

Available at Digi-Key
www.digikey.com
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851- 4722
Fax: 630- 851- 5040
www.conwin.com
D
A
T
A
S
H
E
E
T
Bulletin
Page
Revision
Date
SG170
1 of 20
04
29 Nov 2011
125 Series Wi125
GPS Receiver
TABLE OF CONTENTS
1
INTRODUCTION------------------------------------------------------------------------ 4
2
SPECIFICATION----------------------------------------------------------------------5-6
2.1
2.2
2.3
2.4
Performance --------------------------------------------------------------------------------------------5
Recommended Ratings------------------------------------------------------------------------------6
Absolute Maximum Ratings-------------------------------------------------------------------------6
Block Diagram------------------------------------------------------------------------------------------6
3
PHYSICAL CHARACTERISTICS----------------------------------------------------7-8
3.1
3.2
3.3
Physical Interface Details----------------------------------------------------------------------------7
Wi125 Dimensions-------------------------------------------------------------------------------------8
Solder Pad Size and Placement-------------------------------------------------------------------8
4
SIGNAL DESCRIPTION------------------------------------------------------------ 9-14
4.1
4.2
4.3
4.4
4.5
Power Signals-------------------------------------------------------------------------------------------9
RF Signals--------------------------------------------------------------------------------------------- 10
Emulation/Test Signals----------------------------------------------------------------------------- 10
Control Signals--------------------------------------------------------------------------------------- 11
I/O Signals--------------------------------------------------------------------------------------------- 12
5
SPECIAL FEATURES------------------------------------------------------------------14
5.1
5.2
5.3
User Commands------------------------------------------------------------------------------------- 14
Self-Survey ------------------------------------------------------------------------------------------- 14
Wi125 Embedded Identification------------------------------------------------------------------ 14
6
TAPE AND REEL SPECIFICATIONS-------------------------------------------------15
7
SOLDER PROFILE--------------------------------------------------------------------15
8
APPLICATION HINTS-------------------------------------------------------------16-17
8.1
8.2
8.3
8.4 Power Supply----------------------------------------------------------------------------------------- 16
RF Connection---------------------------------------------------------------------------------------- 16
Grounding---------------------------------------------------------------------------------------------- 17
Battery Backup--------------------------------------------------------------------------------------- 17
ORDERING INFORMATION----------------------------------------------------------18
Wi125 Data Sheet #: SG170
Page 2 of 20
Rev: 04
Date: 11/29/11
© Copyright 2011 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice
Figure and Table Contents
List of Figures
Figure 1 Wi125 Block Diagram---------------------------------------------------------------------------------------7
Figure 2 Wi125 Form and Size---------------------------------------------------------------------------------------8
Figure 3 Wi125 Dimensions-------------------------------------------------------------------------------------------9
Figure 4 Solder Pad Size and Placement------------------------------------------------------------------------ 10
Figure 5 RF Tracking Example-------------------------------------------------------------------------------------- 17
Figure 6 Grounding the Wi125 with a ground plane----------------------------------------------------------- 18
Figure 7 Typical VBATT Supplies---------------------------------------------------------------------------------- 19
List of Tables
Table 1 Revision History------------------------------------------------------------------------------------------------2
Table 2 Additional Documentation List------------------------------------------------------------------------------3
Table 3 Wi125 Specification--------------------------------------------------------------------------------------------6
Table 4 Absolute Maximum Ratings---------------------------------------------------------------------------------7
Table 5 Absolute Maximum Ratings---------------------------------------------------------------------------------7
Table 6 Wi125 Signal List----------------------------------------------------------------------------------------------8
Table 7 RF Track & Gap Widths------------------------------------------------------------------------------------ 17
Revision History of Version 1.0
Revision
00
Date
07/20/09
Released By
Note
Keith Loiselle
New Release of Wi125 Data Sheet
01
04/13/10
Dave Jahr
Update to 1PPS (timing) Accuracy Specification
02
06/16/10
Dave Jahr
125 Series Revised
03
10/20/11
Dave Jahr
Update to 1PPS (timing) Accuracy Specification
04
11/29/11
Dave Jahr
RoHS Compliant Update
Table 1 Revision History
Other Documentation
The following additional documentation may be of use in understanding this document.
Document
Wi125 User Manual
By
Connor-Winfield
Note
Wi125 Dev Kit User Manual Connor-Winfield
Table 2 Additional Documentation List
Wi125 Data Sheet #: SG170
Page 3 of 20
© Copyright 2011 The Connor-Winfield Corp.
Rev: 04
Date: 11/29/11
All Rights Reserved Specifications subject to change without notice
1 INTRODUCTION
The 125 Series Wi125 is a small OEM surface mount GPS module specifically designed for
use in synchronization and timing in WiMax applications. This compact module has an onboard programmable NCO oscillator that outputs a synthesized frequency up to 30 MHz that
is steered by a GPS receiver. The self-survey mode of operation allows the receiver to enter
a position hold mode allowing accurate timing to be continued with only one satellite being
tracked.
Additionally, the 125 Series Wi125 has phase alignment of 1 PPS/10 MHz with a very stable
holdover. The 1 PPS/10 MHz outputs maintain phase alignment with holdover being base only
on the local oscillator, dismissing spurious GPS measurements during reacquisition. When the
receiver regains GPS lock after a period of holdover, the 1PPS and 10 MHz outputs maintain
phase alignment and are offset in frequency at the maximum rate of 100 ppb until the 1 PPS
aligns with that of the GPS solution. This slow recovery from holdover allows for uninterrupted
operation of the WiMax base station.
The Wi125 has a highly accurate output frequency, which can achieve full PRC MTIE
performance. Additionally it can track satellites and provide GPS synchronization in weak
signal areas including indoor applications, reducing the need for high antenna placement.
The Wi125 is RoHS compliant and an exceptionally small surface mount package with a
highly integrated architecture that requires a minimum of external components allowing easy
integration into host systems.
Key information includes:
• System Block Diagram
• Maximum Ratings
• Physical Characteristics
Wi125 Dimensions, castellation information
Solder Pad and placement information
• Signal Descriptions
• Special Features
• Application Information
Power supply modes
RF connections
Grounding
Battery Back-up
Over Voltage and Reverse Polarity
LED’s
Features
• 1PPS/ 10 MHz Phase alignment
• Stable Holdover
• Holdover Recovery
• 1 PPS & NCO Frequency Output
• GPS/UTC time/scale synchronization
to 25 ns RMS
• Stable proven design with long term
availability and multi-year support
• 12 channel hardware correlator
processor design
• OEM SM footprint 25 x 27 mm
• Automatic entry into holdover
• Loss-of-lock and entry-into-holdover
indication
• RoHS Compliant
The specifications in the following sections refer to the standard software builds of the Wi125 . The performance
and specification of the Wi125 can be modified with the use of customized software builds.
Wi125 Data Sheet #: SG170
Page 4 of 20
Rev: 04
Date: 11/29/11
© Copyright 2011 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice
2 SPECIFICATION 1
2.1 Performance
Physical
Module dimensions
Supply voltages
Operating Temp
Storage Temp
Humidity
Max Velocity / Altitude
Max Acceleration / Jerk
25mm (D) x 27mm (W) x 4.2mm (H)
3V3 (Digital I/O), 3V3 (RF), 1V8 (Core option), 3V (Standby Battery)
-30°C to +85°C
-40°C to +85°C 2
5% to 95% non-condensing
515ms-1 / 18,000m
4g / 1gs-1 (sustained for less than 5 seconds)
Sensitivity
Acquisition w/network assist
Tracking
Acquisition Stand Alone
-185dBW
-186dBW
-173dBW
Acquisition
Time
Hot Start with network assist
Stand Alone (Outdoor)
Outdoor: <2s
Indoor (-178dBW): <5s
Cold: <45s
Warm: <38s Hot: <5s
Reacquisition: <0.5s (90% confidence)
Accuracy Position: Outdoor / Indoor
Velocity
Latency
Raw Measurement Accuracy
Tracking
<5m rms / <50m rms
<0.05ms-1
<200ms
Pseudorange <0.3m rms, Carrier phase <5mm rms
Code and carrier coherent
Power
1 fix per second
Coma Mode Current
(RF3V3+DIG 3V3)
Standby Current (VBATT)
0.6W typically
10mA
Interfaces
Serial
Multi-function I/O
Protocols
1pps Timing Output
Event Input
Frequency Output (GPIO [0])
Receiver Type
3 UART ports, CMOS levels
1PPS and Frequency Output available on GPIO [0]
Event Counter/Timer Input
Up to 4 x GPIO (multi-function)
2 x LED Status Drive
I2C, External Clock (on special build)
Network Assist, NMEA 0183, Proprietary ASCII and binary message formats
25nS rms accuracy, <5nS resolution
User selectable pulse width
30nS rms accuracy, <10nS resolution
10 Hz to 30 MHz (Wi125 )
12 parallel channel x 32 taps up to 32 point FFT.
Channels, taps and FFT can be switched off to minimize power or simulate simpler designs.
Processor
ARM 966E-S on a 0.18µ process at up to 120 MHz.
General
1.5µA
Note: 1. The features listed above may require specific software builds and may not all be available in the initial release.
2. Please contact factory for other temperature options.
Table 3 Wi125 Specification
Wi125 Data Sheet #: SG170
Page 5 of 20
© Copyright 2011 The Connor-Winfield Corp.
Rev: 04
Date: 11/29/11
All Rights Reserved Specifications subject to change without notice
2 SPECIFICATION continued
2.2 Recommended Ratings
Symbol
Parameter
Min
Max
Units
RF_3V3
RF Supply Voltage
+3.0
+3.6
Volts
DIG_3V3
Digital Supply Voltage
+3.0
+3.6
Volts
DIG_1V8
Digital Supply Voltage
+1.65
+1.95
Volts
VBATT
Battery Backup Voltage
+2.7
+3.5
Volts
ANT_SUPPLY
Antenna Supply Voltage
+3.0
+12
Volts
Table 4 Recommended Maximum Ratings
2.3 Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
RF_3V3
RF Supply Voltage
-0.3
+6.5
Volts
DIG_1V8
Digital Supply Voltage
-0.3
+2.0
Volts
DIG_3V3
Digital Supply Voltage
-0.3
+3.7
Volts
VBATT
Battery Backup Voltage
-0.5
+7.0
Volts
ANT_SUPPLY
Antenna Supply Voltage
-15
+15
Volts
DIG_SIG_IN
Any Digital Input Signal -0.3
+5.5
Volts
RF_IN
RF Input
-15
+15
Volts
TSTORE
Storage temperature
-40
+85
°C
IOUT
Digital Signal Output Current -6
+6
mA
Table 5 Absolute Maximum Ratings
2.4 Block Diagram
ANT_SUPPLY
RF Block
RF_IN
TRIM/EXT_CLK
Front
End
Filter
RF_3V3
DIG_1V8/+1V8_OUT
Regulator
& Reset
DIG_3V3
Regulator
Control
Emulation
RF25IC
BB25IC
Comms & I/O
Clock
IF
Filter
RTC &
EEPROM
NPOR
2
IC
VBATT
Figure 1 Wi125 Block Diagram
Wi125 Data Sheet #: SG170
Page 6 of 20
Rev: 04
Date: 11/29/11
© Copyright 2011 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice
3 PHYSICAL CHARACTERISTICS
The 125 Series Wi125 is a multi-chip module (MCM) built on an FR4 fiberglass PCB. All digital and power connections to the Wi125 are via castellations on the 25 x 27 mm PCB. The RF connection is via castellations or an RF connector. The general arrangement of the Wi125 is shown in the diagram below. Dimensions are in mm (inches/1000).
.
O: . - HIROSE
H.FL CONNECTOR
PART NO: H.FL-R-SMT
Figure 2 Wi125 Form and Size
3.1 Physical Interface Details
The interface to the Wi125 is via 1mm castellations on a 2mm pitch. There are 42 connections in all. There is also
an RF connector for connecting to the GPS antenna. The details of the interface connections are given below.
Pin Function
Pin Function
Pin Function
1
TX[0]
15 NTRST
29 N2WDA
2
RX[0]
16 NPOR
30 USBP
3
TX[2]
17 RFV_OUT
31 USBN
4
RX[2]/EV2_IN
18 RF_GND
32 FREQ_OUT 3
5
TX[1]
19 RF_3V3
33 +1V8_OUT
6
RX[1]
20 TCK
34 DIG_1V8
7
EXT_CLK 21 JTAGSEL/RTCK
35 DIG_GND
8
LED_RED
22 TMS
36 DIG_3V3
9
LED_GRN
23 RF_GND
37 EVENT_IN
10 NRESET
24 RF_IN
38 1PPS
11 BOOTSEL
25 RF_GND 39 GPIO[0]/PWM_OUT
12 TRIM
26 ANT_SUPPLY
40 GPIO[1]/TIME_SYNC
13 TDO
27 VBATT
41 GPIO[2]/NEXT_INT
14 TDI
28 N2WCK
42 GPIO[3]/FREQ_IN
Note: 3. Frequency Output is available on pin 32 (FREQ_OUT) with custom software only.
Table 6 Wi125 Signal List
Wi125 Data Sheet #: SG170
Page 7 of 20
© Copyright 2011 The Connor-Winfield Corp.
Rev: 04
Date: 11/29/11
All Rights Reserved Specifications subject to change without notice
3 PHYSICAL CHARACTERISTICS continued
3.2 Wi125 Dimensions
The figure below provides the dimensions of the positioning of the Wi125 castellations. Dimensions are in mm
(inches/1000).
Figure 3 Wi125 Dimensions
3.3 Solder Pad Size and Placement
It is recommended that the footprint of the solder pad under each castellation be 2mm x 1mm, centered on the
nominal centre point of the radius of the castellation. The castellations are gold plated and so are lead free. Note
that if the RF_IN connector is being used, there should not be a pad or solder resist under the RF_IN castellation. If the RF_IN castellation is to be used, the pad should be shortened by 0.5mm underneath the Wi125 and
standard RF design practices must be observed. The diagram below shows the placement of the pads under the
castellations.
PIN 22
RF_IN
Figure 4 Solder Pad Size and Placement
Wi125 Data Sheet #: SG170
Page 8 of 20
Rev: 04
Date: 11/29/11
© Copyright 2011 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice
4 SIGNAL DESCRIPTION
The signals on the Wi125 are described in the table below.
4.1 Power Signals
RF_3V3 Type: Power Direction: Input Pin: 19
The RF Supply Input. This 3.3V ± 10% input supplies the 2.9V LDO regulator in the RF
section of the Wi125 . It is important that this supply is well filtered with no more that
50mV peak to peak noise with respect to RF_GND.
RF_GND
Type: Power
Direction: Input/Output
Pins: 18, 23, 25
The RF Input Ground. This is the return path for the RF_3V3 supply and the ground for
the antenna feed. The RF_GND must be tied to the DIG_GND externally to the Wi125 .
RFV_OUT
Type: Power
Direction: Output
Pin: 17
The output from the LDO regulator that is powered by the RF_3V3 signal. This supplies
the power to the RF subsystem of the Wi125 . This may also be used to power external
RF components but care must be taken not to inject noise onto this signal. No more than
an additional 30mA may be taken from this signal by external circuitry.
ANT_SUPPLY
Type: Power
Direction: Input
Pin: 26
The Antenna Supply Voltage. This may be used to supply power to the RF_IN signal, for
use by an active antenna. The maximum voltage should not exceed ±15V and the current
should be limited to 50mA.
DIG_3V3
Type: Power
Direction: Input
Pin: 36
The Digital Supply Input. This 3.3V ± 10% input supplies the I/O ring of the BB25IC chip
and the LDO regulator in the digital section of the Wi125 . It is important that this supply is
well filtered with no more that 50mV peak to peak noise with respect to DIG_GND.
DIG_1V8
Type: Power
Direction: Input
Pin: 34
The 1.8V ± 5% digital core supply for the BB25IC. This is normally connected directly
to the +1V8_OUT signal. However, if an external 1.8V ± 5% is available, a lower overall
system power consumption may be achieved by using an external supply.
+1V8_OUT
Type: Power
Direction: Output
Pin: 33
The 1.8V output from the LDO regulator that is powered by the DIG_3V3 signal. Normally,
this is connected to the DIG_1V8 signal. This may also be used to power external logic
but care must be taken not to inject noise onto this signal. No more than an additional
50mA may be taken from this signal by external logic.
DIG_GND
Type: Power
Direction: Input/Output
Pin: 35
The Digital Ground. This is the return path for the DIG_3V3 supply and the ground reference
for all the digital I/O. The DIG_GND must be tied to the RF_GND externally to the Wi125 .
Wi125 Data Sheet #: SG170
Page 9 of 20
© Copyright 2011 The Connor-Winfield Corp.
Rev: 04
Date: 11/29/11
All Rights Reserved Specifications subject to change without notice
4 SIGNAL DESCRIPTION continued
4.1 Power Signals cont’d
VBATT
Type: Power
Direction: Input/Output
Pin: 27
The Battery Backup Supply. The Wi125 has an on board Real Time Clock (RTC). This is
powered from the VBATT signal. A supply of typically 3v (greater than 2.5V and less than
DIG_3V3) should be applied to this signal. This signal can be left floating if not required.
The input has a blocking diode and so rechargeable batteries will need an external charging circuit. Typically, a 1K resister in series with this signal and the external battery will
provide an easy method of measuring the current consumption from VBATT during test.
4.2 RF Signals
RF_IN
Type: RF
Direction: Input
Pin: 24
The RF Input Signal. This attaches to the GPS antenna. Standard RF design rules must
be used when tracking to this signal. This signal has an RF blocked connection to the
ANT_SUPPLY signal. This is the same signal presented on the RF connector on the
Wi125 . Only one antenna connection should be made. If the RF connector is to be used,
then there should be no connection, even an unconnected pad, to this castellation.
TRIM
Type: RF
Direction: Input
Pin: 12
This signal trims the output frequency of the VCTCXO. This signal is normally left open.
When floating, this signal is biased to the control voltage of the VCTCXO. Any noise injected into this signal will severely compromise the performance of the Wi125 . This signal
should only be used in conjunction with specific application notes.
EXT_CLK
Type: RF
Direction: Input
Pin: 7
This input is the external clock input. This signal is to be used only in special builds of
the Wi125 that are not fitted with an internal VCTCXO. For the normal build, containing
the VCTCXO, do not connect this input. The external clock is a 9 MHz to 26 MHz clipped
sinewave input with an amplitude between 1V and 3V peak to peak. The return path for
this signal is RF_GND.
4.3 Emulation/Test Signals
TDI
Type: Test
Direction: Input
Pin: 14
The Test Data In Signal. This is the standard JTAG test data input. The signal return path
is DIG_GND.
TDO
Type: Test
Direction: Output
Pin: 13
The Test Data Out Signal. This is the standard JTAG test data output. The signal return
path is DIG_GND.
TCK
Type: Test
Direction: Input
Pin: 20
The Test Clock Signal. This is the standard JTAG test clock input. The signal return path is
DIG_GND.
Wi125 Data Sheet #: SG170
Page 10 of 20
Rev: 04
Date: 11/29/11
© Copyright 2011 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice
4 SIGNAL DESCRIPTION continued
4.3 Power Signals cont’d
TMS
Type: Test
Direction: Input
Pin: 22
The Test Mode Select Signal. This is the standard JTAG test mode input. The signal return
path is DIG_GND.
JTAGSEL/RTCK
Type: Test
Direction: Input/Output
Pin: 21
This is a Dual Function Signal. When the NPOR signal is asserted (low), this signal is
an input and selects the function of the JTAG interface. When high, JTAG emulation into
the embedded ARM9 processor is selected. When low, the BB25IC chip boundary scan
mode is selected. The value on this signal is latched when NPOR de-asserts (goes high).
When NPOR is de-asserted (high) and the JTAG emulation mode has been latched, this
signal provides the return clock to the ARM Multi-ICE. Because the ARM9 functions off
a single clock domain, the TCK has to be internally synchronized in the ARM9. This can
cause a variable length delay in the validity of the TDO signal. The RTCK is a synchronized version of the TCK signal. The Multi-ICE uses the RTCK output signal to indicate
when the TDO signal is valid. The signal return path is DIG_GND.
NTRST
Type: Test
Direction: Input
Pin: 15
The Test Reset Signal. This is the active low JTAG test reset signal. The signal return path
is DIG_GND.
4.4 Control Signals
NPOR
Type: Control
Direction: Input/Output
Pin: 16
The Power On Reset Signal. This active low, open collector signal is the master reset for
the Wi125 . The Wi125 can be held in reset by asserting this signal. The signal can be
used to reset external circuitry, but care must be taken to ensure no DC current is drawn
from this signal as the internal pull-up resistor value is 100K.
NRESET
Type: Control
Direction: Input/Output
Pin: 10
The System Reset Signal. This active low, open collector signal is generated by the
BB25IC chip in response to the assertion of the NPOR. It may also be driven to reset the
ARM9 processor in the BB25IC without completely re-initializing the chip.
BOOTSEL
Type: Control
Direction: Input
Pin: 11
The Boot Select Signal. The BB25IC has four boot up modes, but only two are supported
by the Wi125 . This signal is sampled when the NPOR is de-asserted. If the BOOTSEL
signal is high or left floating, then the Wi125 boots from its on-chip FLASH memory. If the
BOOTSEL signal is pulled low, the Wi125 boots from its on-chip ROM.
Wi125 Data Sheet #: SG170
Page 11 of 20
© Copyright 2011 The Connor-Winfield Corp.
Rev: 04
Date: 11/29/11
All Rights Reserved Specifications subject to change without notice
4 SIGNAL DESCRIPTION continued
4.5 I/O Signals
TX[0]
Type: I/O
Direction: Output
Pin: 1
The Transmit Signal for UART 0. This is a standard UART output signal. The signal return
path is DIG_GND.
TX[1]
Type: I/O
Direction: Output
Pin: 5
The Transmit Signal for UART 1. This is a standard UART output signal. The signal return
path is DIG_GND.
TX[2]
Type: I/O
Direction: Output
Pin: 3
The Transmit Signal for UART 2. This is a standard UART output signal. The signal return
path is DIG_GND.
RX[0]
Type: I/O
Direction: Input
Pin: 2
The Receive Signal for UART 0. This is a standard UART input signal. The signal return
path is DIG_GND.
RX[1]
Type: I/O
Direction: Input
Pin: 6
The Receive Signal for UART 1. This is a standard UART input signal. The signal return
path is DIG_GND.
RX[2]/EV2_IN
Type: I/O
Direction: Input
Pin: 4
This is a Dual Mode Signal. Normally, this is the receive signal for UART 2, a standard
UART receive signal. Under software control, it can also be used as general purpose I/O
or to detect events. It can be used to detect the timing of the leading edge of the start bit
of the incoming data stream. The signal return path is DIG_GND.
FREQ_OUT
Type: I/O
Direction: Input/Output
Pin: 32
Optional Frequency Output Signal. This is NOT the same signal as pin 39. This signal is
turned off by default. This is a complex signal which under software can provide any of
either an NCO generated output frequency, a PWM signal, a GPS aligned EPOCH pulse
or general purpose I/O signal. The signal return path is DIG_GND.
1PPS
Type: I/O
Direction: Input/Output
Pin: 38
The 1 Pulse Per Second Signal. This is normally a 1 pulse aligned with GPS time, but can
under software control also provide general purpose I/O or an additional event input. The
pulse width of the 1PPS is software selectable with a default of 100µs. The signal return
path is DIG_GND.
EVENT_IN
Type: I/O
Direction: Input/Output
Pin: 37
The Event Input Signal with internal connection to Pin 39 (GPIO[1] / Time Sync) allows
phase measurement of the Frequency Output. The signal return path is DIG_GND.
Wi125 Data Sheet #: SG170
Page 12 of 20
Rev: 04
Date: 11/29/11
© Copyright 2011 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice
4 SIGNAL DESCRIPTION continued
4.5 I/O Signals cont’d
N2WCK
Type: I/O
Direction: Input/Output
Pin: 28
The NavSync 2 Wire Clock Signal. This is the open collector I2C compatible Clock Signal
for the 2 wire serial interface. The signal return path is DIG_GND.
N2WDA
Type: I/O
Direction: Input/Output
Pin: 29
The NavSync 2 Wire Data Signal. This is the open collector I2C compatible Data Signal
for the 2 wire serial interface. The signal return path is DIG_GND.
USBP 4
Type: I/O
Direction: Input/Output
Pin: 30
The positive USB Signal. The signal return path is DIG_GND.
USBN 4
Type: I/O
Direction: Input/Output
Pin: 31
The negative USB Signal. The signal return path is DIG_GND.
LED_RED
Type: I/O
Direction: Output
Pin: 8
This is a Dual Function Signal. Normally this signal is used to drive a red LED. Standard
software builds use this signal to indicate GPS status. In special software builds, this signal can be used as GPIO. This signal has a 3.3V CMOS drive. A series limiting resistor is
required to limit output current to ±5mA. The signal return path is DIG_GND.
LED_GRN
Type: I/O
Direction: Output
Pin: 9
This is a Dual Function Signal. Normally this signal is used to drive a green LED. Standard software builds use this signal to indicate GPS status. In special software builds, this
signal can be used as GPIO. This signal has a 3.3V CMOS drive. A series limiting resistor
is required to limit output current to ±5mA. The signal return path is DIG_GND.
GPIO[0]/PWM
Type: I/O
Direction: Input/Output
Pin: 39
Normally the GPIO[0]/PWM output provides a Frequency Output that defaults to 10 MHz,
and is user configurable from 10 Hz to 30 MHz signal. The output is enabled on power-up
and is steered by the GPS solution. Custom software versions can also configure this pin
for general I/O, PWM or EPOCH output. The signal return path is DIG_GND.
GPIO[1]/TIME_SYNC Type: I/ODirection: Input/Output
Pin: 40
The GPIO[1]/TIME_SYNC pin provides a synchronization pulse generated by the onboard RTC. Custom software versions can also configure this pin for general purpose I/O,
or an additional PPS output. The signal return path is DIG_GND.
Note: 4. USB is not supported in the current software build.
Wi125 Data Sheet #: SG170
Page 13 of 20
© Copyright 2011 The Connor-Winfield Corp.
Rev: 04
Date: 11/29/11
All Rights Reserved Specifications subject to change without notice
4 SIGNAL DESCRIPTION continued
4.5 I/O Signals cont’d
GPIO[2]/NEXT_INT
Type: I/O
Direction: Input/Output
Pin: 41
The GPIO[2]/NEXT_INT output provides an active high status indicator for the Frequency
Output available on pin 39 (GPIO[0]/PWM). Custom software versions can also configure
this pin for general purpose I/O. The signal return path is DIG_GND.
GPIO[3]/FREQ_IN
Type: I/O
Direction: Input/Output
Pin: 42
The GPIO[3]/FREQ_IN output provides an active high status 3D fix indicator. This indicator can also be used to determine the validity of the pin 38 (1PPS) output. The signal
return path is DIG_GND.
5 SPECIAL FEATURES
While most of the features on the Wi125 are just a subset of the capabilities of the Wi125 and so are described in
the Wi125 Data Sheet and the Wi125 User Manual, there are some additional features specific to the Wi125 that
require explanation.
5.1 User Commands
The Wi125 can accept a number of specific user commands for setting receiver parameters such as UART baud
rate and NMEA message subset, output frequency, etc. Many of these parameters are stored in Non-Volatile
Memory (NVM) so that the settings are retained when the receiver loses power. The available commands are
defined in detail in the Wi125 User Manual.
5.2 Self Survey
To optimize timing performance, the Wi125 performs a 10-minute survey each time the receiver is powered up
and after obtaining a GPS fix. When the survey is complete, the receiver automatically enters fixed timing mode. For applications with specific timing performance requirements, it may be necessary to allow the survey to complete before using the 1PPS and frequency outputs. The status of the survey can be determined by querying the
receiver dynamics setting as described in the Wi125 User Manual.
5.3 Wi125 Embedded Identification
The hardware version number is hard coded onto the Wi125; firmware also contains a version number allowing for
easy identification of the hardware and software version in embedded applications.
Wi125 Data Sheet #: SG170
Page 14 of 20
Rev: 04
Date: 11/29/11
© Copyright 2011 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice
6 TAPE AND REEL SPECIFICATIONS
(I) Measured from center line of sprocket hole to center line of pocket.
(II) Cumulative tolerance of 10 sprocket holes is ± 0.20.
(III) Measured from center line of sprocket hole to center line of pocket.
(IV) Other material available.
ALL DIMENSIONS IN MILLIMETERS UNLESS OTHERWISE STATED
General Tolerance ±0.2
Drawing not to Scale
Figure 5 Tape and Reel
7 SOLDER PROFILE
300
Peak Temp.
245°-255°C for 15 sec Typ.
250
221°C
Temp (°C)
200
Reflow Zone
30/90 sec
(Min/Max)
150
Soaking Zone
60-90 sec Typ.
(2 min Max)
100
50
Ramp Slope not
to exceed
±3°C/sec
0
0
50
100
150
200
250
Time (sec)
Figure 6 Solder Profile
Wi125 Data Sheet #: SG170
Page 15 of 20
© Copyright 2011 The Connor-Winfield Corp.
Rev: 04
Date: 11/29/11
All Rights Reserved Specifications subject to change without notice
300
350
8 APPLICATION HINTS
The following are a list of application hints that may help in implementing system based on the Wi125 .
8.1 Power Supply
The power supply requirements of the Wi125 can all be provided from a single 3.3V supply. To simplify system
integration on-board regulators provide the correct voltage levels for the RF and oscillator (2.9V or 3.0V) and low
voltage digital core (1.8V). In power sensitive applications it is recommended that the DIG_1V8 supply is provided
from a high efficiency external 1.8V source e.g. switch mode power supply, rather than the on-board linear regulator.
If the source impedance of the power supply to the Wi125 is high due to long tracks, filtering or other causes, local
decoupling of the supply signals may be necessary. Care should be taken to ensure that the maximum supply
ripple at the pins of the Wi125 is 50mV peak to peak.
8.2 RF Connection
The RF connection to the Wi125 can be done in two ways. The preferred method is to use standard microstrip
design techniques to track from the antenna element to the RF_IN castellation. This also allows the systems
integrator the option of designing in external connectors suitable for the application. The user can easily fit an
externally mounted MCX, SMA or similar connector, provided it is placed adjacent to the RF_IN castellation. If the
tracking guidelines given below are followed, the impedance match will be acceptable. The diagram below shows
how this could be achieved. In this diagram, the centre via of the RF connector is presumed to be plated through
with a minimal pad top and bottom. The PCB material is assumed to be 1.6mm thick FR4 with a dielectric constant of
4.3. Two situations are considered; one with no ground plane and one with a ground plane on the bottom of the board,
underneath the RF connector. In both cases there is no inner layer tracking under the RF connector.
RF_IN
PIN 22
Top Tracking
Ground Plane
(if used)
SMA Connector
Figure 7 RF Tracking Example
The widths of the RF_IN track and the associated gaps are given in the table below.
Scenario
Without ground plane
Track Width (1/1000 Inch)
37
56
Gap Width (1/1000 Inch)
6
8
With ground plane
32
43
6
8
Table 7 RF Track & Gap Widths
Alternatively, the user can attach the antenna to the Hirose H.FL-R-SMT using a flying lead fitted with a suitable
plug.
Wi125 Data Sheet #: SG170
Page 16 of 20
Rev: 04
Date: 11/29/11
© Copyright 2011 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice
8 APPLICATION HINTS continued
8.3 Grounding
In connecting the Wi125 into a host system, good grounding practices should be observed. Specifically, ground
currents from the rest of the system hosting the Wi125 should not pass through the ground connections to the
Wi125 . This is most easily ensured by using a single point attachment for the ground. There must also be a good
connection between the RF_GND and the DIG_GND signals. While there is not a specific need to put a ground
plane under the Wi125 , high energy signals should not be tracked under the Wi125 . It is however recommended
that a ground plane be used under the Wi125 . In this case, the following would be an example of the pattern that
may be used
Double via to host
system ground at this
one point. Digital and
RF grounds common
at this point.
Figure 8 Grounding the Wi125 with a Ground Plane
8.4 Battery Backup
The Wi125 has an on-board real time clock (RTC). This is used to store date and time information while the Wi125
is powered down. Having a valid date and time speeds the Time To First Fix (TTFF), allowing the Wi125 to meet
its quoted TTFF specification. The Wi125 relies on an external power source to power the RTC (VBATT) when the
DIG_3V3 is not present. If the user application does not require the warm or hot fix performance, or the required
information is provided by network assistance, there is no need to provide the VBATT signal. The VBATT signal
must be greater than 2.6V and less than DIG_3V3 + 0.6V. Typically, a 3V lithium primary cell or a high capacity
“supercap” will be used. The Wi125 has an internal blocking diode, so if a “supercap” or rechargeable battery is
used, an external charging circuit will be required.
DIG_3V3
100R
VBATT
1K
CR2032 Cell
1K
0.47F Supercap
DIG_GND
DIG_GND
Figure 7 Typical VBATT Supplies
Wi125 Data Sheet #: SG170
Page 17 of 20
© Copyright 2011 The Connor-Winfield Corp.
VBATT
Rev: 04
Date: 11/29/11
All Rights Reserved Specifications subject to change without notice
125 Series Wi125
GPS Receiver
Available at Digi-Key
www.digikey.com
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851- 4722
Fax: 630- 851- 5040
www.conwin.com
Ordering Information
Wi125
-010.0M Output Frequency