January 21, 2010 Radiation Performance Data Package MUX8503-S MUX8503-S DSCC SMD Part Number: 5962-0323403KXC 48 channel, analog multiplexer, high impedance analog input with ESD protection Prepared by: Aeroflex Plainview, Inc. 35 South Service Road Plainview, NY 11803 1. MUX8503-S: 1.1 1.1.1 1.2 Part Description 48 channel, analog multiplexer, high impedance analog input with ESD protection. Applicable Documents 1.2.1 Appendix A: Data Sheet: SCD8503 48-Channel Analog Multiplexer Module, Radiation Tolerant & ESD Protected 1.2.2 Appendix B: DSCC SMD: 5962-95630 RADIATION HARDENED, SINGLE 16 CHANNEL ANALOG MUX DIE 1.2.3 Appendix C: DSCC SMD: 5962-03234 MICROCIRCUIT, HYBRID, LINEAR, 48 CHANNEL, ANALOG MULTIPLEXER 2. Radiation Performance 2.1 2.1.1 2.1.2 2.1.3 2.2 2.2.1 2.2.2 2.3 2.3.1 2.3.2 2.3.3 Total Dose: 300 krads(Si), Dose rate = 50 - 300 rads(Si)/s Per analog multiplexer IC manufacturer's DSCC SMD Specification. See Appendix B: DSCC SMD: 5962-95630, sheet 4, Section 1.5 Radiation features. Every wafer lot is subjected to RLAT testing at the stated total dose and dose rate. SEU: Immune up to 120 MeV-cm2/mg Per analog multiplexer IC manufacturer's DSCC SMD Specification See Appendix B: DSCC SMD: 5962-95630, sheet 4, Section 1.5 Radiation features. SEL: Immune, guaranteed by process design Per analog multiplexer IC manufacturer's DSCC SMD Specification See Appendix B: DSCC SMD: 5962-95630, sheet 4, Section 1.5 Radiation features. See Appendix B: DSCC SMD: 5962-95630, sheet 4, note 3/. PAGE 2 of 2 Standard Products ACT8503 48-Channel Analog Multiplexer Module Radiation Tolerant & ESD Protected www.aeroflex.com/mux November 17, 2008 FEATURES ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ 48 Channels provided by three 16-channel multiplexers Radiation performance - Total dose: 300 krads(Si), Dose rate = 50 - 300 rads(Si)/s - SEU: Immune up to 120 MeV-cm2/mg - SEL: Immune by process design Full military temperature range Low power consumption < 45mW Address Bus (A0-3), and three enable lines afford flexible organization All channel inputs are protected by ±20V nominal Transorbs Fast access time 1500ns typical Break-Before-Make switching High analog input impedance (with power on or off) Designed for aerospace and high reliability space applications Packaging – Hermetic ceramic - 96 Leads, 1.32"Sq x .20"Ht quad flat pack - Typical Weight 15 grams Available on DSCC SMD 5962-03234 NOTE: Aeroflex Plainview does not currently have a DSCC Certified Radiation Hardened Assurance Program GENERAL DESCRIPTION Aeroflex’s ACT8503 is a radiation tolerant, 48 channel multiplexer MCM (multi-chip module) with electrostatic discharge (ESD) protection on all channel inputs. The ACT8503 has been specifically designed to meet exposure to radiation environments. It is available in a 96 lead High Temperature Co-Fired Ceramic (HTCC) Quad Flatpack (CQFP). It is guaranteed operational from -55°C to +125°C. The ACT8503 is ideal for demanding military and space applications. ORGANIZATION AND APPLICATION The ACT8503 consists of three 16 channel multiplexers arranged as shown in the Block Diagram. The Address Bus and three Enable lines provide for 48 channels addressable by bus A0~A3, in three 16 channel blocks, each block enabled separately. Each block connects the addressed channel to one output. SCD8503 Rev E SCD8503 Rev E 11/17/08 2 Aeroflex Plainview +VEE A0 A1 A2 A3 EN 0-15 CH 15 • • • CH 0 16 VR 16 MUX 1 -VEE EN 16-31 CH 31 16 VR 16 MUX 2 OUTPUT 16-31 GND VREF EN 32-47 CH 47 • • • CH 32 16 ACT8503 48 – CHANNEL ANALOG MUX BLOCK DIAGRAM OUTPUT 0-15 • • • CH 16 VR 16 MUX 3 OUTPUT 32-47 ABSOLUTE MAXIMUM RATINGS 1/ Parameter Range Units Case Operating Temperature Range -55 to +125 °C Storage Temperature Range -55 to +150 °C +20 -20 +20 V V V < VR +4 > GND -4 V V ±18 V Supply Voltage +VEE (Pin 44) -VEE (Pin 46) VREF (Pin 48) Digital Input Overvoltage VEN (Pins 5, 6, 91, 92), VA (Pins 1, 3, 95, 96) Analog Input Over Voltage VS Notes: 1/ All measurements are made with respect to ground. NOTICE: Stresses above those listed under "Absolute Maximums Rating" may cause permanent damage to the device. These are stress rating only; functional operation beyond the "Operation Conditions" is not recommended and extended exposure beyond the "Operation Conditions" may effect device reliability. RECOMMENDED OPERATING CONDITIONS 1/ Symbol Parameter Typical Units +VEE +15V Power Supply Voltage +15.0 V -VEE -15V Power Supply Voltage -15.0 V VREF Reference Voltage +5.00 V VAL Logic Low Level +0.8 V VAH Logic High Level +4.0 V Notes: 1/ Power Supply turn-on sequence shall be as follows: +VEE, -VEE, followed by VREF. DC ELECTRICAL PERFORMANCE CHARACTERISTICS 1/ (Tc = -55°C to +125°C, +VEE = +15V, -VEE = -15V, VREF = +5.0V, Unless otherwise specified) Parameter Supply Current Symbol +IEE Conditions VEN(0-47) = VA(0-3) = 0 -IEE +ISBY VEN(0-47) = 4V, VA(0-3) = 0 6/ -ISBY Address Input Current Enable Input Current Min Max Units 0.3 1.5 mA -1.5 -0.3 mA 0.3 1.5 mA -1.5 -0.3 mA IAL(0-3) VA = 0V 1/ -3 3 μA IAH(0-3) VA = 5V 1/ -3 3 μA IENL(0-15) VEN(0-15) = 0V -1 1 μA IENH(0-15) VEN(0-15) = 5V -1 1 μA IENL(16-31) VEN(16-31) = 0V -1 1 μA IENH(16-31) VEN(16-31) = 5V -1 1 μA IENL(32-47) VEN(32-47) = 0V -1 1 μA IENH(32-47) VEN(32-47) = 5V -1 1 μA Aeroflex Plainview SCD8503 Rev E 11/17/08 3 DC ELECTRICAL PERFORMANCE CHARACTERISTICS 1/ (con’t) (Tc = -55°C to +125°C, +VEE = +15V, -VEE = -15V, VREF = +5.0V, Unless otherwise specified) Parameter Positive Input Leakage Current CH0-CH47 Symbol Conditions Min Max Units +ISOFFOUTPUT VIN = +10V, VEN = 4V, output and all unused MUX inputs under test = +10V 2/, 3/ -100 +700 nA -100 +700 nA +ISOFFCURRENT Negative Input Leakage Current CH0-CH47 Output Leakage Current OUTPUTS (pins 25, 68 & 70) Output Leakage Current OUTPUTS (pins 25, 68 & 70) -ISOFFOUTPUT -ISOFFCURRENT +IDOFFOUTPUT +IDOFFCURRENT -IDOFFOUTPUT -IDOFFCURRENT VIN = -10V, VEN = 4V, output and all unused MUX inputs under test = -10V 2/, 3/ -100 +700 nA -100 +700 nA -100 +100 nA -100 +100 nA -100 +100 nA -100 +100 nA +25°C +125°C -55°C 18.0 18.0 17.5 23.0 23.5 22.5 V V V +25°C +125°C -55°C -23.0 -23.5 -22.5 -18.0 -18.0 -17.5 V V V VOUT = +10V, VEN = 4V, output and all unused MUX inputs under test = -10V 3/, 4/ VOUT = -10V, VEN = 4V, output and all unused MUX inputs under test = +10V 3/, 4/ Input Clamped Voltage CH0 - CH47 +VCLMP(0-47) Input Clamped Voltage CH0 - CH47 -VCLMP(0-47) Switch ON Resistance OUTPUTS (pins 25, 68 & 70) RDS(ON)(0-47)A VIN = +15V, VEN = 0.8V, IOUT = -1mA 2/, 3/, 5/ 500 3000 Ω RDS(ON)(0-47)B VIN = +5V, VEN = 0.8V, IOUT = -1mA 2/, 3/, 5/ 500 3000 Ω RDS(ON)(0-47)C VIN = -5V, VEN = 0.8V, IOUT = +1mA 2/, 3/, 5/ 500 3000 Ω VEN = 4V, all unused MUX inputs under test are open. 3/ Notes: 1/ Measure inputs sequentially. Ground all unused inputs of the MUX under test. VA is the applied input voltage to the MUX address lines A(0-3). 2/ VIN is the applied input voltage to the MUX input channel CH0-CH47. 3/ VEN is the applied input voltage to the MUX enable line En(0-15), En(16-31) and En(32-47). 4/ VOUT is the applied input voltage to the MUX output line OUTPUT(0-15), OUTPUT(16-31) and OUTPUT(32-47). 5/ Negative current is the current flowing out of each of the MUX pins. Positive current is the current flowing into each MUX pin. 6/ If not tested, shall be guaranteed to the specified limits. SWITCHING CHARACTERISTICS (Tc = -55°C to +125°C, +VEE = +15V, -VEE = -15V, VREF = +5.0V, Unless otherwise specified) Parameter Symbol Switching Test MUX tAHL Conditions Min Max Units RL = 10KΩ, CL = 50pF 10 1500 ns tALH RL = 10KΩ, CL = 50pF Tc = +25°C, +125°C Tc = -55°C 10 10 2000 5000 ns ns tONEN RL = 1KΩ, CL = 50pF 10 1500 ns 10 1000 ns tOFFEN Aeroflex Plainview SCD8503 Rev E 11/17/08 4 TRUTH TABLE (CH0 – CH15) TRUTH TABLE (CH16 – CH31) A3 A2 A1 A0 EN(0-15) "ON" CHANNEL 1/ A3 A2 A1 A0 EN(16-31) "ON" CHANNEL 1/ X X X X H NONE X X X X H NONE L L L L L CH0 L L L L L CH16 L L L H L CH1 L L L H L CH17 L L H L L CH2 L L H L L CH18 L L H H L CH3 L L H H L CH19 L H L L L CH4 L H L L L CH20 L H L H L CH5 L H L H L CH21 L H H L L CH6 L H H L L CH22 L H H H L CH7 L H H H L CH23 H L L L L CH8 H L L L L CH24 H L L H L CH9 H L L H L CH25 H L H L L CH10 H L H L L CH26 H L H H L CH11 H L H H L CH27 H H L L L CH12 H H L L L CH28 H H L H L CH13 H H L H L CH29 H H H L L CH14 H H H L L CH30 H H H H L CH15 H H H H L CH31 1/ Between CH0-15 and OUTPUT (0-15) 1/ Between CH16-31 and OUTPUT (16-31) TRUTH TABLE (CH32 – CH47) A3 A2 A1 A0 EN(32-47) "ON" CHANNEL 1/ X X X X H NONE L L L L L CH32 L L L H L CH33 L L H L L CH34 L L H H L CH35 L H L L L CH36 L H L H L CH37 L H H L L CH38 L H H H L CH39 H L L L L CH40 H L L H L CH41 H L H L L CH42 H L H H L CH43 H H L L L CH44 H H L H L CH45 H H H L L CH46 H H H H L CH47 1/ Between CH32-47 and OUTPUT (32-47) Aeroflex Plainview SCD8503 Rev E 11/17/08 5 Address Lines (A0 - A3) 4.0V 50% 0.8V 11.6V MIN 50% MUX Output 0V t AHL Definition of t AHL Address Lines (A0 - A3) 4.0V 50% 0.8V 11.6V MIN MUX Output 50% 0V t ALH Definition of t ALH 4.0V EN Lines 50% 0.8V ~3V to 10.0V MUX Output 50% 0V tONEN tOFFEN Definition of tONEN and tOFFEN NOTE: f = 10KHz, Duty cycle = 50%. ACT8503 SWITCHING DIAGRAMS Aeroflex Plainview SCD8503 Rev E 11/17/08 6 LEAD NUMBERS & FUNCTIONS ACT8503 – 96 Leads Ceramic QUAD Flat Pack Pin # Function Pin # Function Pin # Function 1 A2 33 CH11 65 CH33 2 NC 34 NC 66 CH32 3 A3 35 CH12 67 NC 4 NC 36 NC 68 Output V(32-47) 5 EN 0-15 37 CH13 69 NC 6 NC 38 NC 70 Output V(16-31) 7 CH0 39 CH14 71 GND 8 NC 40 NC 72 GND 9 CH1 41 CH15 73 CH31 10 NC 42 NC 74 CH30 11 CH2 43 NC 75 CH29 12 NC 44 +VEE 76 CH28 13 CH3 45 NC 77 CH27 14 NC 46 -VEE 78 CH26 15 CH4 47 NC 79 CH25 16 NC 48 VREF 80 CH24 17 CH5 49 NC 81 CH23 18 NC 50 CASE GND 82 CH22 19 CH6 51 CH47 83 CH21 20 NC 52 CH46 84 CH20 21 CH7 53 CH45 85 CH19 22 NC 54 CH44 86 CH18 23 GND 55 CH43 87 CH17 24 GND 56 CH42 88 CH16 25 Output V(0-15) 57 CH41 89 GND 26 NC 58 CH40 90 GND 27 CH8 59 CH39 91 EN 32-47 28 NC 60 CH38 92 EN 16-31 29 CH9 61 CH37 93 A0 30 NC 62 CH36 94 NC 31 CH10 63 CH35 95 A1 32 NC 64 CH34 96 NC NOTE: It is recommended that all "NC or "no connect pin" be grounded. This eliminates or minimizes any ESD or static buildup. Aeroflex Plainview SCD8503 Rev E 11/17/08 7 ORDERING INFORMATION Model Number Screening DSCC SMD # Package ACT8503-S Military Temperature, -55°C to +125°C, Compliant to MIL-PRF-38534 Class K 5962-0323403KXC QUAD Flat Pack ACT8503-7 Commercial Flow, +25°C testing only - FLAT PACKAGE OUTLINE 1.150 ±.005 (23 Spaces at .050) Tol Non-Cum 4 Sides Pin 1 Pin 12 .200 MAX Pin 85 Pin 84 Pin 13 .0165 ±.003 1.320 SQ MAX Pin 36 .400 Pin 61 Pin 60 Pin 37 .006 ±.001 Note: Outside ceramic tie bars not shown for clarity. Contact factory for details. EXPORT CONTROL: EXPORT WARNING: This product is controlled for export under the International Traffic in Arms Regulations (ITAR). A license from the U.S. Department of State is required prior to the export of this product from the United States. Aeroflex’s military and space products are controlled for export under the International Traffic in Arms Regulations (ITAR) and may not be sold or proposed or offered for sale to certain countries. (See ITAR 126.1 for complete information.) PLAINVIEW, NEW YORK Toll Free: 800-THE-1553 Fax: 516-694-6715 INTERNATIONAL Tel: 805-778-9229 Fax: 805-778-1980 NORTHEAST Tel: 603-888-3975 Fax: 603-888-4585 SE AND MID-ATLANTIC Tel: 321-951-4164 Fax: 321-951-4254 WEST COAST Tel: 949-362-2260 Fax: 949-362-2266 CENTRAL Tel: 719-594-8017 Fax: 719-594-8468 www.aeroflex.com [email protected] Aeroflex Microelectronic Solutions reserves the right to change at any time without notice the specifications, design, function, or form of its products described herein. All parameters must be validated for each customer's application by engineering. No liability is assumed as a result of use of this product. No patent licenses are implied. Our passion for performance is defined by three attributes represented by these three icons: solution-minded, performance-driven and customer-focused SCD8503 Rev E 11/17/08 8 REVISIONS LTR DATE (YR-MO-DA) APPROVED A Add device type 02. Add appendix A for device type 02 only. Make editorial changes throughout. DESCRIPTION 97-04-09 R. MONNIN B Make change to 1.4, 30.2.1, IS(OFF) overvoltage and ID(OFF) overvoltage tests. - ro 97-09-12 R. MONNIN C Make change to boilerplate and add device class T for device type 02. - ro 98-12-02 R. MONNIN D Add level P to table I. Make change to 1.5 and glassivation as specified under APPENDIX A. - ro 99-04-22 R. MONNIN E Make change to enable delay waveform as specified on figure 6 - ro 00-04-14 R. MONNIN F Make changes to supply voltage and VREF to GND limits as specified under 1.3. Make clarification to paragraphs 4.4.4.2 and 4.4.4.3. - ro 04-06-25 R. MONNIN 06-02-24 R. MONNIN Under 1.5, move footnote 3/ to the latch up parameter. Make correction to the G RL value under the tON(A), tOFF(A) test as specified in table I. - ro REV SHEET REV G G G G G G G G G G G G SHEET 15 16 17 18 19 20 21 22 23 24 25 26 G G G G G G G G G 1 2 3 4 5 6 7 8 9 REV STATUS REV OF SHEETS SHEET PMIC N/A PREPARED BY RAJESH PITHADIA STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DRAWING APPROVAL DATE 95-08-23 REVISION LEVEL G G G G 10 11 12 13 14 MICROCIRCUIT, DIGITAL-LINEAR, RADIATION HARDENED, SINGLE 16CHANNEL ANALOG MUX / DEMUX WITH OVERVOLTAGE PROTECTION, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 G DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY RAJESH PITHADIA APPROVED BY MICHAEL FRYE G 1 OF 5962-95630 26 5962-E254-06 1. SCOPE 1.1 Scope. This drawing documents three product assurance class levels consisting of high reliability (device classes Q and M), space application (device class V) and for appropriate satellite and similar applications (device class T). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class T, the user is encouraged to review the manufacturer’s Quality Management (QM) plan as part of their evaluation of these parts and their acceptability in the intended application. 1.2 PIN. The PIN is as shown in the following example: 5962 ⏐ ⏐ ⏐ Federal stock class designator \ R ⏐ ⏐ ⏐ RHA designator (see 1.2.1) 95630 01 ⏐ ⏐ ⏐ Device type (see 1.2.2) V ⏐ ⏐ ⏐ Device class designator (see 1.2.3) / X ⏐ ⏐ ⏐ Case outline (see 1.2.4) C ⏐ ⏐ ⏐ Lead finish (see 1.2.5) \/ Drawing number 1.2.1 RHA designator. Device classes Q, T and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 HS-1840RH Radiation hardened DI single 16-channel analog MUX / DEMUX with high impedance analog input overvoltage protection 02 HS-1840ARH Radiation hardened DI single 16-channel analog MUX / DEMUX with high impedance analog input overvoltage protection 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q, V Certification and qualification to MIL-PRF-38535 T Certification and qualification to MIL-PRF-38535 with performance as specified in the device manufacturers approved quality management plan. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Descriptive designator CDIP2-T28 CDFP3-F28 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Terminals Package style 28 28 Dual-in-line Flat pack SIZE 5962-95630 A REVISION LEVEL G SHEET 2 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, T and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage between V+ and V- : Device type 01 ........................................................................... Device type 02 ........................................................................... Supply voltage between V+ and GND : Device type 01 ........................................................................... Device type 02 ........................................................................... Supply voltage between V- and GND : Device type 01 ........................................................................... Device type 02 ........................................................................... VREF to GND : Device type 01 ........................................................................... Device type 02 ........................................................................... Digital input overvoltage range ...................................................... Analog input overvoltage range (power on/off): Device type 01 ........................................................................... +40 V +33 V +20 V +16.5 V -20 V -16.5 V +20 V +16.5 V ((GND) - 4 V) ≤ VA ≤ ((VREF) + 4 V) -25 V ≤ VS ≤ +25 V Device type 02 ........................................................................... -35 V ≤ VS ≤ +35 V Storage temperature range ............................................................ -65°C to +150°C Maximum package power dissipation (PD): 2/ Case X ..................................................................................... 1600 mW Case Y ..................................................................................... 1400 mW Lead temperature (soldering, 10 seconds) .................................... +275°C Thermal resistance, junction-to-case (θJC) .................................... See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA): Case X ..................................................................................... 83.1°C/W Case Y ..................................................................................... 49.1°C/W 1.4 Recommended operating conditions. Positive supply voltage (V+) ........................................................... +15 V Negative supply voltage (V-)........................................................... -15 V VREF .............................................................................................. 5 V dc VAH ................................................................................................ 4.0 V dc VAL ................................................................................................ 0.8 V dc VEN ................................................................................................ 0.8 V dc Ambient operating temperature range (TA) ................................... -55°C to +125°C ____ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ The derating factor for case X shall be 20.4 mW/°C, above TA = +95°C, and for case Y shall be 18.5 mW/°C above TA = +95°C. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 3 1.5 Radiation features. SEP effective let no upsets: 2 Device type 01 ............................................................................ 110 MeV/cm /mg Device type 02 ............................................................................ Maximum total dose available: (dose rate = 50 – 300 rad(Si)/s) Device classes M, Q, and V: Device type 01 .......................................................................... Device type 02 .......................................................................... Device class T: Device type 02 .......................................................................... Dose rate upset: Device type 01 ............................................................................ Device type 02 ............................................................................ Latch up ......................................................................................... 2 120 MeV/cm /mg 200 Krads (Si) 300 Krads (Si) 100 Krads (Si) 8 >1 x 10 rad(Si)/s Not tested None 3/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _____ 3/ Guaranteed by process design, but not tested, unless specified in table I herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 4 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level devices and as specified herein. 3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q, T and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q, T and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q, T and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q, T and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q, T and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q, T and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 82 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 5 TABLE I. Electrical performance characteristics. Test Input leakage current, 2/ address or enable pins Symbol IAH Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Measure inputs sequentially, ground all used pins. IAL M, D, P, L, R, F Leakage current into the source terminal of an off switch IS(OFF) M, D, P, L, R, F 4/ VS = +10 V, all unused inputs and output equal -10 V, see figure 5 M, D, P, L, R, F 4/ Leakage current into the source terminal of an off switch with power off IS(OFF) power off M, D, P, L, R, F Leakage current into the source terminal of an off switch with overvoltage applied IS(OFF) overvoltage -1.0 1.0 1 3/ -1.0 1.0 1,2,3 -1.0 1.0 1 3/ -1.0 1.0 -10 +10 2,3 -100 +100 1 3/ -100 +100 1 -10 +10 2,3 -100 +100 1 3/ -100 +100 -50 +50 2,3 -100 +100 1 3/ -100 +100 -1 +1 1 VS = +25 V, VA = 0 V, VEN = 0 V, V- = 0 V, V+ = 0 V, VREF = 0 V, all unused inputs tied to GND, see figure 5 Unit Max 1 VS = -10 V, all unused inputs and output equal +10 V, see figure 5 Limits Min 1,2,3 M, D, P, L, R, F Device type 01,02 01,02 01,02 VD = 0 V, all unused inputs tied to GND, see figure 5 1,2,3 M, D, P, L, R, F 4/ 1 3/ -1.5 +1.5 VD = 0 V, all unused inputs tied to GND, see figure 5 1,2,3 -1 +1 M, D, P, L, R, F 4/ 1 3/ -1.5 +1.5 5/ 6/ 01,02 µA µA nA nA nA µA µA See footnotes at end table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Leakage current into the drain terminal of an off switch with overvoltage applied Symbol ID(OFF) overvoltage Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified ID(OFF) ID(ON) -1 +1 +1 VD = 0 V, all unused inputs tied to GND, see figure 5 1,2,3 -1 +1 M, D, P, L, R, F 4/ 1 3/ -1 +1 -10 +10 2,3 -100 +100 1 3/ -100 +100 -10 +10 2,3 -100 +100 1 3/ -100 +100 -10 +10 2,3 -100 +100 1 3/ -100 +100 1 -10 +10 2,3 -100 +100 1 3/ -100 +100 1 1 VD = +10 V, all unused inputs = -10 V, see figure 5 1 VS = +10 V, VD = +10 V, VEN = 0.8 V, all unused input = -10 V, see figure 5 M, D, P, L, R, F 7/ VS = -10 V, VD = -10 V, VEN = 0.8 V, all unused input = +10 V, see figure 5 M, D, P, L, R, F 7/ STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Max -1 M, D, P, L, R, F 4/ Leakage current from an on driver into the switch (drain and source) Min 1 3/ M, D, P, L, R, F 4/ Leakage current into the drain terminal of an off switch Unit M, D, P, L, R, F 4/ VD = -10 V, all unused inputs = +10 V, see figure 5 01,02 Limits 1,2,3 6/ ID(OFF) Device type VD = 0 V, all unused inputs tied to GND, see figure 5 5/ Leakage current into the drain terminal of an off switch Group A subgroups 01,02 01,02 01,02 µA µA nA nA nA nA SIZE 5962-95630 A REVISION LEVEL G SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Positive supply current Symbol I+ Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups M, D, P, L, R, F 7/ Negative power supply I- VA = 0 V, VEN = 0.8 V M, D, P, L, R, F 7/ Positive standby supply current +ISBY M, D, P, L, R, F 4/ Negative standby power supply -ISBY VA = 0 V, VEN = 4.0 V M, D, P, L, R, F 4/ Switch on resistance RDS(ON) 0.05 0.5 1 3/ 0.05 0.5 1,2,3 0.05 0.5 1 3/ 0.05 0.5 0.05 0.5 1 3/ 0.05 0.5 1,2,3 0.05 0.5 1 3/ 0.05 0.5 01 --- 1.0 02 0.5 3.0 01 --- 1.0 02 0.5 3.0 01 --- 4.0 02 0.5 3.0 01 --- 4.0 02 0.5 3.0 01 --- 2.5 02 0.5 3.0 01 --- 2.5 02 0.5 3.0 1,2,3 VS = +15 V, ID = -1 mA, VEN = 0.8 V, see figure 5 1 3/ M, D, P, L, R, F 7/ 1,2,3 VS = -5 V, ID = +1 mA, VEN = 0.8 V, see figure 5 1 3/ M, D, P, L, R, F 7/ 1,2,3 VS = +5 V, ID = -1 mA, VEN = 0.8 V, see figure 5 1 3/ M, D, P, L, R, F 7/ Unit Max 1,2,3 VA = 0 V, VEN = 4.0 V Limits Min 1,2,3 VA = 0 V, VEN = 0.8 V Device type 01,02 01,02 mA mA mA mA kΩ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Capacitance: digital input CA V+ = V- = 0 V, f = 1 MHz, TA = +25°C, see 4.4.1c 4 01,02 7 pF Capacitance: channel input CS(OFF) V+ = V- = 0 V, f = 1 MHz, TA = +25°C, see 4.4.1c 4 01,02 5 pF Capacitance: channel output CD(OFF) V+ = V- = 0 V, f = 1 MHz, TA = +25°C, see 4.4.1c 4 01,02 50 pF Off isolation input or output VISO VEN = 4.0 V, f = 200 kHz, CL = 7 pF, RL = 1 kΩ, VS = 3 VRMS, TA = +25°C, see 4.4.1c 4 01,02 7,8A,8B 01,02 9 01,02 Functional test Break-before-make time delay See 4.4.1d tD CL = 50 pF, RL = 1 kΩ, see figure 6 M, D, P, L, R, F 4/ 7/ 8/ Propagation delay time address inputs to I/O channels tON(A), tOFF(A) 25 ns 5 9 3/ 5 10,11 M, D, P, L, R, F 4/ 7/ 8/ dB 10,11 9 CL = 50 pF, RL = 10 kΩ, see figure 6 -45 9 3/ 01 0.6 02 1.25 01 1.0 02 1.5 01 3.0 02 1.5 µs See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 9 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Propagation delay time enable to I/O channels tON(EN), tOFF(EN) 9 CL = 50 pF, RL = 1 kΩ, see figure 6 10,11 M, D, P, L, R, F 4/ 7/ 8/ 9 3/ Unit Max 01 0.6 02 1.25 01 1.0 02 1.5 01 3.0 02 1.5 µs 1/ VAH (logic level high) = 4.0 V dc, VAL (logic level low) = 0.8 V dc, V+ = +15 V dc, V- = -15 V dc, VEN = 4.0 V unless otherwise specified, and VREF = 5.0 V dc. 2/ Input current of one node. 3/ Devices supplied to this drawing will meet all levels M, D, P, L, R, for device type 01 (device classes M, Q, and V) and levels M, D, P, L, R, F for device type 02 (device classes M, Q, or V) and levels M, D, P, L, R, for device type 02 (device class T). However, device type 01(device classes M, Q, and V) is only tested at the "R" level and device type 02 (device classes M, Q, and V) is only tested at the "F" level, and device type 02 (class T) is only tested at the “R” level. (see paragraph 1.5 herein). Pre and Post irradiation values are identical unless otherwise specified in Table I. When performing post irradiation electrical measurements for any RHA level, TA = +25°C. 4/ VEN = 4.5 V 5/ For device type 01, VS = +25 V. For device type 02, VS = +35 V. 6/ For device type 01, VS = -25 V. For device type 02, VS = -35 V. 7/ VEN = 0.5 V 8/ VAH = 4.5 V and VAL = 0.5 V STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 10 Device types 01 and 02 Case outlines X and Y Terminal number Terminal symbol 1 V+ 2 NC 3 NC 4 IN 16 5 IN 15 6 IN 14 7 IN 13 8 IN 12 9 IN 11 10 IN 10 11 IN 9 12 GND 13 VREF 14 A3 15 A2 16 A1 17 A0 18 EN 19 IN 1 20 IN 2 21 IN 3 22 IN 4 23 IN 5 24 IN 6 25 IN 7 26 IN 8 27 V- 28 OUT NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 11 Truth table A3 A2 A1 A0 EN On channel X X X X H None L L L L L 1 L L L H L 2 L L H L L 3 L L H H L 4 L H L L L 5 L H L H L 6 L H H L L 7 L H H H L 8 H L L L L 9 H L L H L 10 H L H L L 11 H L H H L 12 H H L L L 13 H H L H L 14 H H H L L 15 H H H H L 16 FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 12 FIGURE 3. Logic diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 13 FIGURE 4. Radiation exposure circuit. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 14 FIGURE 5. Test circuits for dc levels. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 15 FIGURE 6. Test circuits and waveforms for ac levels. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 16 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's (QM) plan, including screening (4.2), qualification (4.3), and conformance inspection (4.4). The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class T, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's (QM) plan, including screening, qualification, and conformance inspection. The performance envelope and reliability information shall be as specified in the manufacturer’s QM plan. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. For device class T, screening shall be in accordance with the device manufacturer’s Quality Management (QM) plan, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q, T and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. For devices classes Q, T, and V interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B or as modified in the device manufacturer’s Quality Management (QM) plan. 4.3 Qualification inspection for device classes Q, T and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Qualification inspection for device class T shall be in accordance with the device manufacturer’s Quality Management (QM) plan. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 as specified in the QM plan including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). Technology conformance inspection for class T shall be in accordance with the device manufacturer’s Quality Management (QM) plan. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 17 TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Device class Q Device class V Interim electrical parameters (see 4.2) 1,7,9 1,7,9 1,7,9 Final electrical parameters (see 4.2) 1,2,3,7,8A, 1/ 8B,9,10,11 1,2,3,7,8A, 1/ 8B,9,10,11 1,2,3, 1/ 2/ 7,8A,8B,9, 10,11 Group A test requirements (see 4.4) 1,2,3,4,7,8A,8B,9, 10,11 1,2,3,4,7,8A, 8B,9,10,11 1,2,3,4,7, 2/ 8A,8B,9,10, 11 Group C end-point electrical parameters (see 4.4) 1,2,3,7,8A,8B, 9,10,11 1,2,3,7,8A,8B, 9,10,11 1,2,3,7,8A, 8B,9,10,11 Group D end-point electrical parameters (see 4.4) 1,7,9 1,7,9 1,7,9 Group E end-point electrical parameters (see 4.4) 1,7,9 1,7,9 1,7,9 Device class T As specified in QM plan 1/PDA applies to subgroup 1. For class V, 1, 7, and ∆. 2/Delta limits (see table IIB) shall be required and the delta values shall be computed with reference to the zero hour electrical parameters (see table I). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CA, CS, CD, and VISO measurments) should be measured for initial qualification and after any process or design changes which may affect input or output capacitance. d. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 18 TABLE IIB. Burn-in delta parameters (+25°C) and group C delta parameters. Parameters Input leakage current, address, or enable pins Leakage current into the source terminal of an "Off" switch Symbol Conditions Delta limits IAH Measure inputs sequentially, ground all unbiased pins ±100 nA +IS(OFF) VS = +10 V, all unused and ±20 nA output = -10 V, VEN = 4.0 V -IS(OFF) ±20 nA VS = -10 V, all unused inputs and outputs = +10 V, VEN = 4.0 V Leakage current into the drain terminal of an "Off" switch +ID(OFF) ±20 nA VD = +10 V, all unused inputs = -10 V, VEN = 4.0 V -ID(OFF) ±20 nA VD = -10 V, all unused inputs = +10 V, VEN = 4.0 V Leakage current from an "On" driver into the switch (drain and source) +ID(ON) ±20 nA VS = +10 V, all unused inputs = -10 V, VEN = 0.8 V, VD = +10 V -ID(ON) ±20 nA VS = -10 V, all unused inputs = +10 V, VD = -10 V, VEN = 0.8 V Switch on resistance R(ON) ±150 Ω VS = +15 V, ID = -1 mA, VEN = 0.8 V ±250 Ω VS = -5 V, ID = +1 mA, VEN = 0.8 V Positive supply current I+ VEN = 0.8 V ±50 µA Negative supply current I- VEN = 0.8 V ±50 µA Positive standby supply current +ISBY VEN = 4.0 V ±50 µA Negative standby supply current -ISBY VEN = 4.0 V ±50 µA STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 19 4.4.2.2 Additional criteria for device classes Q, T and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). RHA levels for device classes M, Q and V shall be as specified in MIL-PRF-38535. End-point electrical parameters shall be as specified in table IIA herein. For device class T, the RHA requirements shall be in accordance with the Class T radiation requirements of MIL-PRF-38535. The end-point electrical parameters for class T devices shall be as specified in Table I, Group A subgroups, or as modified in the QM plan. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019 condition A and as specified herein. For device class T, the total dose requirements shall be in accordance with the class T radiation requirements of MIL-PRF-38535 ( see 1.5 herein ). 4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall be performed on all devices requiring a RHA level greater than 5k rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the preirradiation end-point electrical parameter limit at 25°C ±5°C. Testing shall be performed at initial qualification and after any design or process changes which may affect the RHA response of the device. 4.4.4.2 Dose rate induced latchup testing. When specified in the purchase order or contract, dose rate induced latchup testing shall be performed in accordance with test method 1020 of MIL-STD-883 and as specified herein (see 1.5 herein). Tests shall be performed on devices, SEC, or approved test structures at technology qualification and after any design or process changes which may effect the RHA capability of the process. 4.4.4.3 Dose rate upset testing. When specified in the purchase order or contract, dose rate upset testing shall be performed in accordance with test method 1021 of MIL-STD-883 and herein (see 1.5 herein). a. Transient dose rate upset testing shall be performed at initial qualification and after any design or process changes which may affect the RHA performance of the devices. Test 10 devices with 0 defects unless otherwise specified. b. Transient dose rate upset testing for class Q, T, and V devices shall be performed as specified by a TRB approved radiation hardness assurance plan and MIL-PRF-38535. 4.4.4.4 Single event phenomena (SEP). When specified in the purchase order or contract, SEP testing shall be required on class T and V devices (see 1.5 herein). SEP testing shall be performed on a technology process on the Standard Evaluation Circuit (SEC) or alternate SEP test vehicle as approved by the qualifying activity at initial qualification and after any design or process changes which may affect the upset or latchup characteristics. The recommended test conditions for SEP are as follows: a. The ion beam angle of incidence shall be between normal to the die surface and 60° to the normal, inclusive (i.e. 0° ≤ angle ≤ 60°). No shadowing of the ion beam due to fixturing or package related effects is allowed. 6 2 b. The fluence shall be ≥ 100 errors or ≥ 10 ions/cm . 2 5 2 c. The flux shall be between 10 and 10 ions/cm /s. The cross-section shall be verified to be flux independent by measuring the cross-section at two flux rates which differ by at least an order of magnitude. d. The particle range shall be ≥ 20 micron in silicon. e. The test temperature shall be +25°C and the maximum rated operating temperature ±10°C. f. Bias conditions shall be defined by the manufacturer for the latchup measurements. g. Test four devices with zero failures. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 20 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q, T and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q, T and V. Sources of supply for device classes Q, T and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 21 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95630 A.1 SCOPE A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QML plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. A.1.2 PIN. The PIN is as shown in the following example: 5962 ⏐ ⏐ ⏐ Federal stock class designator \ F ⏐ ⏐ ⏐ RHA designator (see 10.2.1) 95630 02 ⏐ ⏐ ⏐ Device type (see 10.2.2) / V ⏐ ⏐ ⏐ Device class designator (see 10.2.3) 9 ⏐ ⏐ ⏐ Die code A ⏐ ⏐ ⏐ Die Details (see 10.2.4) \/ Drawing number A.1.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. A.1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number 02 HS-1840ARH Circuit function Radiation hardened DI single 16-channel analog MUX / DEMUX with high impedance analog input overvoltage protection A.1.2.3 Device class designator. Device class Q or V Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 22 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95630 A.1.2.4. Die Details. The die details designation shall be a unique letter which designates the die’s physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. A.1.2.4.1 Die physical dimensions. Die type Figure number 02 A-1 A.1.2.4.2. Die bonding pad locations and electrical functions. Die type Figure number 02 A-1 A.1.2.4.3. Interface materials. Die type Figure number 02 A-1 A.1.2.4.4. Assembly related information. Die type Figure number 02 A-1 A.1.3. Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details. A.1.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details. A.2. APPLICABLE DOCUMENTS. A.2.1 Government specifications, standards, and handbooks. Unless otherwise specified, the following specification, standard, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. DEPARTMENT OF DEFENSE HANDBOOK MIL-HDBK-103 - List of Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 23 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95630 A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. A.3 REQUIREMENTS A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit or function as described herein. A.3.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as specified in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V. A.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in A.1.2.4.1 and on figure A-1. A.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in A.1.2.4.2 and on figure A-1. A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.4.3 and on figure A-1. A.3.2.4 Assembly related information. The assembly related information shall be as specified in A.1.2.4.4 and figure A-1. A.3.2.5 Truth table. The truth table shall be as defined within paragraph 3.2.3 of the body of this document. A.3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.5 herein. A.3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table I of the body of this document. A.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. 30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in A.1.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535. A.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML38535 listed manufacturer in order to supply to the requirements of this drawing (see A.6.4 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. A.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 24 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95630 A.4 VERIFICATION A.4.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM plan shall not effect the form, fit or function as described herein. A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer’s QM plan. As a minimum it shall consist of: a) Wafer lot acceptance for Class V product using the criteria defined within MIL-STD-883 test method 5007. b) 100% wafer probe (see paragraph A.3.4). c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 test method 2010 or the alternate procedures allowed within MIL-STD-883 test method 5004. A.4.3 Conformance inspection. A.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see A.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs 4.4.4.1, 4.4.4.1.1, 4.4.4.2, 4.4.4.3, and 4.4.4.4. A.5 DIE CARRIER A.5.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. A.6 NOTES A.6.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes. A.6.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43218-3990 or telephone (614)-692-0547. A.6.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined within MIL-PRF-38535 and MIL-STD-1331. A.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see A.3.6 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 25 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95630 NOTE: Pad numbers reflect terminal numbers when placed in case outlines X and Y (see figure 1). Die physical dimensions. Die size: 4080 microns x 2820 microns. Die thickness: 19 ± 1 mils. Interface materials. Top metallization: Al Si Cu 16.0 kÅ ±2 kÅ Backside metallization: None Glassivation. Type: PSG Thickness: 8.0 kÅ ±1.0 kÅ Substrate: DI (dielectric isolation) Assembly related information. Substrate potential: Unbiased Special assembly instructions: None FIGURE A-1. Die bonding pad locations and electrical functions. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95630 A REVISION LEVEL G SHEET 26 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 06-02-24 Approved sources of supply for SMD 5962-95630 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962R9563001VXC 3/ HS1-1840RH-Q 5962R9563001VYC 3/ HS9-1840RH-Q 5962R9563001QXC 3/ HS1-1840RH-8 5962R9563001QYC 3/ HS9-1840RH-8 5962F9563002VXC 34371 HS1-1840ARH-Q 5962F9563002VYC 34371 HS9-1840ARH-Q 5962F9563002QXC 34371 HS1-1840ARH-8 5962F9563002QYC 34371 HS9-1840ARH-8 5962F9563002V9A 34371 HS0-1840ARH-Q 5962R9563002TXC 34371 HS1-1840ARH-T 5962R9563002TYC 3/ HS9-1840ARH-T 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ No longer available from an approved source of supply. 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued Vendor CAGE number Vendor name and address 34371 Intersil Corporation 2401 Palm Bay Blvd. P.O. Box 883 Melbourne, FL 32902-0883 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device type 02. Updated drawing to the reflect current requirements. -sld 06-01-05 Raymond Monnin B Added device type 03. -sld 08-02-20 Robert M. Heber REV SHEET REV B B B B B B B SHEET 15 16 17 18 19 20 21 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg Cecil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 CHECKED BY Greg Cecil http://www.dscc.dla.mil/ APPROVED BY Raymond Monnin MICROCIRCUIT, HYBRID, LINEAR, 48 CHANNEL, ANALOG MULTIPLEXER DRAWING APPROVAL DATE 03-03-13 REVISION LEVEL B SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-03234 21 5962-E206-08 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 ⏐ ⏐ ⏐ Federal stock class designator \ ⏐ ⏐ ⏐ RHA designator (see 1.2.1) 03234 01 ⏐ ⏐ ⏐ Device type (see 1.2.2) / K ⏐ ⏐ ⏐ Device class designator (see 1.2.3) X ⏐ ⏐ ⏐ Case outline (see 1.2.4) C ⏐ ⏐ ⏐ Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 ACT8502 02 ACT8506 03 ACT8503 Circuit function 48 channel, voltage and current analog multiplexer, high impedance analog input with ESD protection 48 channel, voltage and current analog multiplexer, high impedance analog input 48 channel, analog multiplexer, high impedance analog input with ESD protection 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator X Terminals See figure 1 Package style 96 Ceramic quad flat pack 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Positive supply voltage between +VCC and GND ....................... Negative supply voltage between -VEE and GND ....................... VREF to GND............................................................................... Digital input overvoltage range: VEN (pins 5, 6, 91, and 92)...................................................... VA (pins 1, 3, 93, and 95)........................................................ VB (pins 2, 4, 94, and 96)........................................................ Analog input overvoltage range: Device types 01and 03 ........................................................... Device type 02........................................................................ Power dissipation (PD): Device types 01 and 02 .......................................................... Device type 03........................................................................ Thermal resistance junction-to-case (θJC) .................................. Storage temperature .................................................................. Lead temperature (soldering, 10 seconds)................................. +20 V dc -20 V dc +20 V dc (< VREF + 4)V, (> GND - 4)V (< VREF + 4)V, (> GND - 4)V (< VREF + 4)V, (> GND - 4)V -18 V dc ≤ VS ≤ +18 V dc -25 V dc ≤ VS ≤ +25 V dc 120 mW 60 mW 10°C/W 2/ -55°C to +150°C +300°C 1.4 Recommended operating conditions. Positive supply voltage (+VCC) 3/ ............................................... Negative supply voltage (-VEE) 3/............................................... VREF 3/........................................................................................ Logic low level voltage (VAL) ...................................................... Logic high level voltage (VAH) .................................................... Case operating temperature range (TC)..................................... +15 V dc -15 V dc +5 V dc +0.8 V dc +4.0 V dc -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. 1/ 2/ 3/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Based on the maximum power dissipation spread over the multiplexer die. Supply voltages must be applied simultaneously or with the +5 V reference supply first and then the ±15 V supplies. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 3 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.2.4 Switching waveform(s). The switching waveform(s) shall be as specified on figure 4. 3.2.5 Block diagram. The block diagram shall be as specified on figure 5. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Supply currents +ICC -ICC +ISBY -ISBY Address input currents IAL(0-3) IAH(0-3) Enable input current IENL(0-15) IENH(0-15) IENL(16-31) IENH(16-31) IENL(32-47) IENH(32-47) Conditions 1/ 2/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups VEN(0-63) = VA(0-3)A = VA(0-3)B = 0 1,2,3 VEN(0-63) = VA(0-3)A = VA(0-3)B = 0 1,2,3 VEN(0-63) = 4 V, VA(0-3)A = VA(0-3)B = 0 3/ 1,2,3 VEN(0-63) = 4 V, VA(0-3)A = VA(0-3)B = 0 3/ 1,2,3 VA = 0 V 2/ 1,2,3 VA = 5 V 2/ 1,2,3 VEN(0-15) = 0 V 1,2,3 VEN(0-15) = 5 V 1,2,3 VEN16-31) = 0 V 1,2,3 VEN(16-31) = 5 V 1,2,3 VEN(32-47) = 0 V 1,2,3 VEN(32-47) = 5 V 1,2,3 Limits Device type Unit Min Max 01,02 0.3 3 03 0.3 1.5 01,02 -3 -0.3 03 -1.5 -0.3 01,02 0.3 3 03 0.3 1.5 01,02 -3.0 -0.3 03 -1.5 -0.3 01,02 -6 6 03 -3 3 01,02 -6 6 03 -3 3 01,02 -2 2 03 -1 1 01,02 -2 2 03 -1 1 01,02 -2 2 03 -1 1 01,02 -2 2 03 -1 1 01,02 -2 2 03 -1 1 01,02 -2 2 03 -1 1 mA mA mA mA μA μA μA μA μA μA μA μA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Positive input leakage current (CH0-CH47) +ISOFFOUTPUT(ALL) Conditions 1/ 2/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups VIN = +10 V, VEN = 4 V, output and all unused inputs = -10 V 4/ 5/ 1,2,3 1 VIN = +10 V, VEN = 4 V, output and all unused inputs = -10 V 4/ 5/ Max 01,03 -100 +700 02 -20 +20 -200 +200 1,2,3 01,03 -100 +700 1 02 -20 +20 -200 +200 2,3 Negative input leakage current (CH0-CH47) -ISOFFOUTPUT(ALL) VIN = -10 V, VEN = 4 V, output and all unused inputs = +10 V 4/ 5/ 1,2,3 01,03 -100 +700 1 02 -20 +20 -200 +200 2,3 -ISOFFCURRENT(ALL) VIN = -10 V, VEN = 4 V, output and all unused inputs = +10 V 4/ 5/ 1,2,3 01,03 -100 +700 1 02 -20 +20 -200 +200 2,3 Output leakage current outputs (pins 25, 68 and 70) Currents (pins 26, 67, and 69) Unit Min 2,3 +ISOFFCURRENT(ALL) Limits Device type nA nA nA nA +IDOFFOUTPUT(ALL) VIN = +10 V, VEN = 4 V, output and all unused inputs = -10 V 5/ 6/ 1,2,3 All -100 +100 nA +IDOFFCURRENT(ALL) VIN = +10 V, VEN = 4 V, output and all unused inputs = -10 V 5/ 6/ 1,2,3 All -100 +100 nA -IDOFFOUTPUT(ALL) VIN = -10 V, VEN = 4 V, output and all unused inputs = +10 V 5/ 6/ 1,2,3 All -100 +100 nA -IDOFFCURRENT(ALL) VIN = -10 V, VEN = 4 V, output and all unused inputs = +10 V 5/ 6/ 1,2,3 All -100 +100 nA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Input clamped voltage (CH0-CH47) +VCLMP(0-47) -VCLMP(0-47) Switch ON resistance outputs (pins 25, 68, and 70) Switch ON resistance outputs (pins 26,67 and 69) Switching tests Conditions 1/ 2/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups VEN = 4 V, all unused inputs are open 5/ Unit Min Max 18.0 23.0 2 18.0 23.5 3 17.5 22.5 -23.0 -18.0 2 -23.5 -18.0 3 -22.5 -17.5 01,03 1 VEN = 4 V, all unused inputs are open 5/ Limits Device type 01,03 1 V V RDS(ON)(0-47)A VIN = +15 V, VEN = 0.8 V, IOUT = -1 mA 4/ 5/ 7/ 1,2,3 All 500 3000 Ω RDS(ON)(0-47)B VIN = +5 V, VEN = 0.8 V, IOUT = -1 mA 4/ 5/ 7/ 1,2,3 All 500 3000 Ω RDS(ON)(0-47)C VIN = -5 V, VEN = 0.8 V, IOUT = +1 mA 4/ 5/ 7/ 1,2,3 All 500 3000 Ω RDS(ON)(0-47)A VIN = +15 V, VEN = 0.8 V, IOUT = -1 mA 4/ 5/ 7/ 1,2,3 01,02 500 3000 Ω RDS(ON)(0-47)B VIN = +5 V, VEN = 0.8 V, IOUT = -1 mA 4/ 5/ 7/ 1,2,3 01,02 500 3000 Ω RDS(ON)(0-47)C VIN = -5 V, VEN = 0.8 V, IOUT = +1 mA 4/ 5/ 7/ 1,2,3 01,02 500 3000 Ω tONA RL = 10 kΩ, CL = 50 pF, See figure 4. 9,10,11 All 10 1500 ns tOFFA RL = 10 kΩ, CL = 50 pF, See figure 4. 9,10 All 10 2000 ns 10 5000 11 tONEN RL = 1 kΩ, CL = 50 pF, See figure 4. 9,10,11 All 10 1500 ns tOFFEN RL = 1 kΩ, CL = 50 pF, See figure 4. 9,10,11 All 10 1000 ns See footnotes at top of next page. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 7 TABLE I. Electrical performance characteristics - Continued. 1/ +VCC = +15 V dc, -VEE = -15 V dc, and VREF = +5 V dc, unless otherwise specified. 2/ Measure inputs sequentially. Ground all unused inputs. 3/ If not tested, shall be guaranteed to the limits specified in table I. 4/ VIN is the applied input voltage to the input channels (CH0-CH47). 5/ VEN is the applied input voltage to the enable lines EN(0-15), EN(16-31), and EN(32-47). 6/ VOUT is the applied input voltage to the output lines (OUTPUT(0-15), OUTPUT(16-31), OUTPUT(32-47) for device types 01 03 and CURRENT(0-15), CURRENT(16-31), and CURRENT(32-47) for device types 01 and 02 only. 7/ Negative current is the current flowing out of each of the pins. Positive current is the current flowing into each of the pins. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 8 Case outline X. FIGURE 1. Case outline(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 9 Case outline X - Continued. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 10 Case outline X - Continued. Inches Symbol Min Millimeters Max Min Max A .200 5.08 A1 .180 4.57 A2 .005 .011 0.13 0.28 b .0135 .0195 0.34 0.50 c .005 .008 0.13 0.20 D/E 1.287 1.313 32.69 33.35 D1 1.145 1.155 29.08 29.34 e .050 BSC 1.27 BSC F .200 TYP 5.08 TYP J .035 TYP 0.89 TYP L 2.490 2.510 L1 63.25 63.75 2.580 65.53 L2 1.700 1.740 43.18 44.20 L3 2.090 2.110 53.09 53.59 L4 .400 TYP 10.16 TYP N 96 96 S1 .030 TYP 0.76 TYP S2 .015 TYP 0.38 TYP NOTES: 1. Pin 1 is indicated by an ESD triangle on top of the package and by an index on the bottom of the package. 2. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 3. N equals 96, the total number of leads on the package. 4. Pin numbers are for reference only. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 11 Device type 01 and 02 Case outline Terminal number Terminal symbol Terminal number 1 A2 33 2 NC 3 4 5 X Terminal symbol Terminal number Terminal symbol CH 11 65 CH 33 34 NC 66 CH 32 A3 35 CH 12 67 OUTPUT I(32-47) NC 36 NC 68 OUTPUT V(32-47) EN 0-15 37 CH 13 69 OUTPUT I(16-31) 6 NC 38 NC 70 OUTPUT V(16-31) 7 CH 0 39 CH 14 71 GND 8 NC 40 NC 72 GND 9 CH 1 41 CH 15 73 CH 31 10 NC 42 NC 74 CH 30 11 CH 2 43 NC 75 CH 29 12 NC 44 +VCC 76 CH 28 13 CH 3 45 NC 77 CH 27 14 NC 46 -VEE 78 CH 26 15 CH 4 47 NC 79 CH 25 16 NC 48 VREF 80 CH 24 17 CH 5 49 NC 81 CH 23 18 NC 50 Case GND 82 CH 22 19 CH 6 51 CH 47 83 CH 21 20 NC 52 CH 46 84 CH 20 21 CH 7 53 CH 45 85 CH 19 22 NC 54 CH 44 86 CH 18 23 GND 55 CH 43 87 CH 17 24 GND 56 CH 42 88 CH 16 25 OUTPUT V(0-15) 57 CH 41 89 GND 26 OUTPUT I(0-15) 58 CH 40 90 GND 27 CH 8 59 CH 39 91 EN 32-47 28 29 30 31 32 NC CH 9 NC CH 10 NC 60 61 62 63 64 CH 38 CH 37 CH 36 CH 35 CH 34 92 93 94 95 96 EN 16-31 A0 NC A1 NC NOTE: NC is a no connect pin. NC pins should be grounded to eliminate or minimize electrostatic discharge (ESD) or static buildup. FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 12 Device type 03 Case outline Terminal number Terminal symbol Terminal number 1 A2 33 2 NC 3 4 5 X Terminal symbol Terminal number Terminal symbol CH 11 65 CH 33 34 NC 66 CH 32 A3 35 CH 12 67 NC NC 36 NC 68 OUTPUT V(32-47) EN 0-15 37 CH 13 69 NC 6 NC 38 NC 70 OUTPUT V(16-31) 7 CH 0 39 CH 14 71 GND 8 NC 40 NC 72 GND 9 CH 1 41 CH 15 73 CH 31 10 NC 42 NC 74 CH 30 11 CH 2 43 NC 75 CH 29 12 NC 44 +VCC 76 CH 28 13 CH 3 45 NC 77 CH 27 14 NC 46 -VEE 78 CH 26 15 CH 4 47 NC 79 CH 25 16 NC 48 VREF 80 CH 24 17 CH 5 49 NC 81 CH 23 18 NC 50 Case GND 82 CH 22 19 CH 6 51 CH 47 83 CH 21 20 NC 52 CH 46 84 CH 20 21 CH 7 53 CH 45 85 CH 19 22 NC 54 CH 44 86 CH 18 23 GND 55 CH 43 87 CH 17 24 GND 56 CH 42 88 CH 16 25 OUTPUT V(0-15) 57 CH 41 89 GND 26 NC 58 CH 40 90 GND 27 CH 8 59 CH 39 91 EN 32-47 28 29 30 31 32 NC CH 9 NC CH 10 NC 60 61 62 63 64 CH 38 CH 37 CH 36 CH 35 CH 34 92 93 94 95 96 EN 16-31 A0 NC A1 NC NOTE: NC is a no connect pin. NC pins should be grounded to eliminate or minimize electrostatic discharge (ESD) or static buildup. FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 13 Truth table (CH 0 - CH 15) A3 X L L L L L L L L H H H H H H H H A2 X L L L L H H H H L L L L H H H H A1 X L L H H L L H H L L H H L L H H A0 X L H L H L H L H L H L H L H L H EN (0-15) H L L L L L L L L L L L L L L L L "ON" Channel 1/ None CH 0 CH 1 CH 2 CH 3 CH 4 CH 5 CH 6 CH 7 CH 8 CH 9 CH 10 CH 11 CH 12 CH 13 CH 14 CH 15 1/ Between CH 0-15 and OUTPUT (0-15) for device types 01 - 03 and CURRENT (0-15) for device types 01 and 02 only. Truth table (CH 16 - CH 31) A3 X L L L L L L L L H H H H H H H H A2 X L L L L H H H H L L L L H H H H A1 X L L H H L L H H L L H H L L H H A0 X L H L H L H L H L H L H L H L H EN (0-15) H L L L L L L L L L L L L L L L L "ON" Channel 1/ None CH 16 CH 17 CH 18 CH 19 CH 20 CH 21 CH 22 CH 23 CH 24 CH 25 CH 26 CH 27 CH 28 CH 29 CH 30 CH 31 1/ Between CH 16-31and OUTPUT (16-31) for device types 01 - 03 and CURRENT (16-31) for device types 01 and 02 only. FIGURE 3. Truth table(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 14 Truth table (CH 32 - CH 47) A3 X L L L L L L L L H H H H H H H H A2 X L L L L H H H H L L L L H H H H A1 X L L H H L L H H L L H H L L H H A0 X L H L H L H L H L H L H L H L H EN (0-15) H L L L L L L L L L L L L L L L L "ON" Channel 1/ None CH 32 CH 33 CH 34 CH 35 CH 36 CH 37 CH 38 CH 39 CH 40 CH 41 CH 42 CH 43 CH 44 CH 45 CH 46 CH 47 1/ Between CH 32-47and OUTPUT (32-47) for device types 01 - 03 and CURRENT (32-47) for device types 01 and 02 only. FIGURE 3. Truth tale(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 15 NOTE: f = 10 kHz, duty cycle = 50%. FIGURE 4. Switching test waveform(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 16 Device type 01 FIGURE 5. Block diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 17 Device type 02 FIGURE 5. Block diagram - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 18 Device type 03 48 CHANNEL ANALOG MUX BLOCK DIAGRAM FIGURE 5. Block diagram - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 19 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1, 9 Final electrical parameters 1*, 2, 3, 9, 10, 11 Group A test requirements 1, 2, 3, 9, 10, 11 Group C end-point electrical parameters 1, 9 End-point electrical parameters for radiation hardness assurance (RHA) devices Not applicable * PDA applies to subgroup 1. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 20 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03234 A REVISION LEVEL B SHEET 21 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 08-02-20 Approved sources of supply for SMD 5962-03234 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. 1/ 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-0323401KXC 5962-0323402KXC 5962-0323403KXC 88379 88379 88379 ACT8502-S ACT8506-S ACT8503-S The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 88379 Vendor name and address Aeroflex Plainview Incorporated 35 South Service Road Plainview, NY 11803 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.