DATA SHEET
MeshConnect™ EM357 Module
ZICM357P2
Ember EM357 Transceiver Based Module
Integrated Transceiver Modules for ZigBee
DESCRIPTION
MeshConnect™ EM357 Module
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CEL’s MeshConnect™ EM357 Module combines a high
performance RF solution with the market's premier ZigBee®
stack. The addition of on board memory enables Over-the-Air
(OTA) programming without the need for additional in system
memory. The integrated Power Amplifier (PA) maximizes
range and performance. The small module footprint makes
it suitable for a wide range of ZigBee applications. The
MeshConnect EM357 Module is certified and qualified,
enabling customers to accelerate time to market by greatly
reducing the design and certification phases of development.
CEL’s MeshConnect™ EM357 Module (ZICM357P2) is
based on the Ember EM357 Zigbee® compliant System
on Chip (SoC) IC. The IC is a single-chip solution compliant
with ZigBee specifications and IEEE 802.15.4, a complete
wireless solution for all ZigBee applications. The IC consists
of an RF transceiver with the baseband modem, a hardwired
MAC and an embedded 32-bit ARM® Cortex™-M3
microcontroller with internal RAM (12 kB) and Flash (192 kB)
memory. The device provides numerous general-purpose
I/O pins and peripheral functions such as timers and UARTs.
The MeshConnect EM357 Module adds a PA to increase
range, provide more reliable transmission, and reduce the
number of nodes in a network. It is useful for open outdoor
applications where the nodes are physically far apart or
for indoor areas where the nodes have to operate in a
noisy RF environment. The module’s outstanding 120 dB
link budget ensures high quality connections even in such
harsh environments.
The MeshConnect EM357 module also integrates an
optional 1MB Flash memory for OTA program updates,
making this device ready for Smart Energy Applications.
• FLASH Memory:
192 kB (EM357 Internal)
1MB (on Module Board - Optional)
• 12 kB SRAM
• 32-bit ARM® Cortex™-M3
• Up to 23 GPIO Pins
• SPI (Master/Slave), TWI, UART
• Timers, Serial Wire/JTAG Interface
• 5-Channel 14-Bit ADC
• Transmit Power +20dBm
• 1MB Additional Flash for OTA Programming (Optional)
• +120 dB RF Link Budget
FEATURES
•High RF Performance:
•Antenna Options:
Up to 120 dB RF Link Budget
RX Sensitivity: -100 dBm
1) Integrated PCB Trace Antenna
or
RF TX Power: +20 dBm
2) U.FL Connector for External Antenna
•Data Rate: 250 kbps
•16 RF Channels
•Small Footprint: 1” x 1.41” •AES Encryption
(25.4 mm x 35.9 mm)
•FCC, CE and IC Certifications
•Advanced Power Management Scheme with Deep Sleep Mode
•ROHS Compliant
APPLICATIONS
• Smart Energy/Grid Markets
Smart Meters
• Building Automation and Control
• General ZigBee Wireless
Sensor Networking
• Home Automation and Control
Thermostats
Displays
Energy Management
Security Devices
HVAC Control
Lighting Control
Flash Memory
• 192 kB (EM357 Internal)
• 1MB Additional Flash for OTA Programming (Optional)
Note: The EM357 Module without additional Flash
memory is recommended for applications where the module is used with an external host processor (Network Co-Processor mode)
ORDERING INFORMATION
Part Number
MeshConnect
EM357 Module
Order Number
Description
Min/Multiple
ZICM357P2-2
+20 dBm Output Power, PCB Trace Antenna and 1MB Additional Flash
140/140
ZICM357P2-2C
+20 dBm Output Power with U.FL Connector for External Antenna,
1MB Additional Flash
140/140
ZICM357P2-1-NF
+20 dBm Output Power, PCB Trace Antenna (No Additional Flash Memory)
140/140
ZICM357P2-1C-NF
+20 dBm Output Power with U.FL Connector for External Antenna
(No Additional Flash Memory)
140/140
The information in this document is subject to change without notice, please confirm data is current
Document No: 0008-00-07-00-000 (Issue D)
Date Published: January 14, 2013
MeshConnect™ EM357 Module
Module BLOCK DIAGRAMS
EM357 Module (ZICM357P2-x)
Flash
1MB
24 MHz
XTAL
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PWR
Reg
Castellation Edge
Connector
SPI
Bus
ANT
Ember EM357
Micro
processor
Radio
Balun
PA
Balun
EM357 Module (ZICM357P2-1-NF)
24 MHz
XTAL
PWR
Reg
Castellation Edge
Connector
ANT
Ember EM357
Micro
processor
Radio
Balun
PA
Balun
Page 2
MeshConnect™ EM357 Module
TABLE OF CONTENTS
Introduction and Overview
1
Features..................................................................................................................................................................................................
1
Applications............................................................................................................................................................................................
1
Ordering Information.............................................................................................................................................................................
1
Module Block Diagrams.........................................................................................................................................................................
2
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Description..............................................................................................................................................................................................
System Level Function
Transceiver IC.........................................................................................................................................................................................
4
Additional Flash Memory.......................................................................................................................................................................
4
Antenna...................................................................................................................................................................................................
4
Power Amplifier.......................................................................................................................................................................................
5
Software/Firmware.................................................................................................................................................................................
5
Electrical Specification
Absolute Maximum Ratings...................................................................................................................................................................
6
Recommended (Operating Condition)..................................................................................................................................................
6
DC Characteristics..................................................................................................................................................................................
6
RF Characteristics..................................................................................................................................................................................
6
Pin Signal and Interfaces
Pin Signals I/O Configuration................................................................................................................................................................
7
I/O Pin Assignment.................................................................................................................................................................................
7
Module Dimensions................................................................................................................................................................................
10
Module Footprint....................................................................................................................................................................................
11
Processing.........................................................................................................................................................................................
12
Agency Certifications...................................................................................................................................................................
13
Shipment, Storage and Handling.............................................................................................................................................
15
Quality..................................................................................................................................................................................................
15
References and Revision History............................................................................................................................................
16
Page 3
MeshConnect™ EM357 Module
TRANSCEIVER IC
The MeshConnect EM357 Module uses the Ember EM357 transceiver IC. This IC incorporates the RF transceiver
with the baseband modem, a hardwired MAC and an embedded ARM® Cortex™-M3 microcontroller, offering an
excellent low cost high performance solution for all IEEE 802.15.4/ZigBee applications.
For more information about the Silicon Laboratories EM357 IC, visit http://www.silabs.com
ADDITIONAL FLASH MEMORY
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The MeshConnect EM357 Modules (ZICM357P2-2 and ZICM357P2-2C) incorporates an optional additional 1MB
external Flash memory for OTA program updates. The Flash memory communicates over the EM357’s second
serial controller using SPI. The Flash memory is wired to the following castellation pins:
GPIO Name
Function
EM357 Module
Pin Number
PA0
SC2MOSI
3
PA1
SC2MISO
4
PA2
SC2SCLK
5
PA3
SC2nSSEL
6
WP
Flash memory Write Protect line (has internal pull-up
resistor, but not connected to the EM357)
2
The instruction set for the Flash memory is similar to the Micron M25PE80. Note: In order to achieve the specified
sleep current for the module, it is necessary to send a Deep Power-Down command to the Flash memory.
See http://www.micron.com for more information on the instruction set.
ANTENNA
The MeshConnect EM357 Module includes an integrated Printed Circuit Board (PCB) trace antenna. An optional
U.FL connector can be specified, providing connection to a 50-ohm external antenna of the user’s choice. However,
use of an external antenna is not covered by the module's certification; see Ordering Information on Page 1.
For optimum antenna performance, the MeshConnect EM357 Module should be mounted with the PCB trace
antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed
on the host board under the module up to the antenna. The installation of an uninterrupted ground plane on a
layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance
with your PCB layout.
The PCB antenna employs an Inverted F-Antenna topology that is compact and highly efficient. To maximize
range, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on
the host PCB will contribute significantly to the antenna performance; it should not be directly under the Inverted
F-Antenna. The position of the module on the host board and overall design of the product enclosure contribute
to antenna performance. Poor design affects radiation patterns and can result in reflection, diffraction and/or
scattering of the transmitted signal.
A few design guidelines to help ensure antenna performance:
•
•
•
•
•
Never place the ground plane or route copper traces directly underneath the antenna portion of the module
Never place the antenna close to metallic objects
In the overall design, ensure that wiring and other components are not placed near the antenna
Do not place the antenna in a metallic or metalized plastic enclosure
Keep plastic enclosures 1cm or more away from the antenna in any direction
Page 4
MeshConnect™ EM357 Module
POWER AMPLIFIER
The MeshConnect EM357 Module includes a PA. This PA delivers high efficiency, high gain and high output
power (Pout = +20.0 dBm TYP) to provide an extended range and reliable transmission for fewer nodes in a
network.
The PA is connected to the alternate EM357 IC TX output, so EM357 TX Power Modes 2 or 3 must be used to
achieve the specified output power.
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SOFTWARE/FIRMWARE The MeshConnect EM357 Module is an ideal platform for the EmberZNet PRO™, the industry’s most deployed
and field proven ZigBee compliant stack supporting the ZigBee PRO feature set. EmberZNet PRO is a complete
ZigBee protocol software package containing all the elements required for mesh networking applications. For
more information regarding the software development for this IC, visit http://www.silabs.com
CEL provides reference software that runs multiple functions and executes various commands. The firmware
allows the execution of IEEE 802.15.4 communication, validation and manufacturing tests. For example, users
can set up a simple ZigBee Point-to-Point Network to perform Range and Packet Error Rate (PER) tests. The
software can also place the module in various operating modes, which allows for setting and/or testing various
parameters.
Page 5
MeshConnect™ EM357 Module
ABSOLUTE MAXIMUM RATINGS
Description
MeshConnect EM357 Module
Unit
Min
Max
Power Supply Voltage (VDD)
-0.3
3.6
VDC
Voltage on any I/O Line
-0.3
VDD + 0.3
VDC
–
15
dBm
-40
125
°C
–
260
°C
RF Input Power
Storage Temperature Range
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Reflow Soldering Temperature
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description
Power Supply Voltage (VDD)
Input Frequency
Ambient Temperature Range
MeshConnect EM357 Module
Unit
Min
Typ
Max
2.7
3.3
3.6
V
2405
–
2480
MHz
-40
25
85
°C
DC CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM357P2 TX Power Mode 2, unless otherwise noted)
Description
MeshConnect EM357 Module
Unit
Min
Typ
Max
Transmit Mode Current
–
170
–
mA
Receive Mode Current
–
28
–
mA
Sleep Mode Current
–
6
–
µA
RF CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM357P2 TX Power Mode 2, unless otherwise noted)
Description
MeshConnect EM357 Module
Min
Unit
Typ
Max
2405
–
2480
MHz
11
–
26
–
-96.2
–
96.2
kHz
General Characteristics
RF Frequency Range
RF Channels
Frequency Error Tolerance
Transmitter
Maximum Output Power
–
20
–
dBm
Minimum Output Power
–
-40
–
dBm
Offset Error Vector Magnitude
–
15
35
%
Sensitivity (1% PER, Boost Mode)
–
-100
-94
dBm
Sensitivity (1% PER, Normal Mode)
–
-98
-92
dBm
Saturation (Maximum Input Level)
0
–
–
dBm
Receiver
Page 6
MeshConnect™ EM357 Module
PIN SIGNALS I/O PORT CONFIGURATION
MeshConnect Module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module
Dimensions shows the layout of the 56 edge castellations.
MeshConnect I/O PIN ASSIGNMENTS
CEL MeshConnect
EM357 Module PIN
Number
Ember EM357
IC Pin Number
Name
1
49
GROUND
2
N/C
WP
3
21
PA0*
Digital I/O
TIM2C1 - Timer 2 Channel 1 input/output
SC2MOSI - SPI master data out/slave data in of Serial Controller 2
PA1*
Digital I/O
TIM2C3 - Timer 2 Channel 3 input/output
SC2SDA - TWI data of Serial Controller 2
SC2MISO - SPI master data in/slave data out of Serial Controller 2
PA2*
Digital I/O
TIM2C4 - Timer 2 Channel 4 input/output
SC2SCL - TWI clock of Serial Controller 2
SC2SCLK - SPI master/slave clock of Serial Controller 2
25
PA3*
Digital I/O
TIM2C2 - Timer 2 channel 2 input/output
SC2nSSEL - SPI slave select of Serial Controller 2
TRACECLK - Synchronous CPU trace clock
7
49
GROUND
8
16, 23, 28, 37
VCC
9
12
RESET
10
13
PC6
Digital I/O
OSC32B - 32.768 kHz crystal oscillator
nTX_ACTIVE - Inverted TX_ACTIVE signal
11
14
PC7
Digital I/O
OSC32A - 32.768 kHz crystal oscillator
OSC32_EXT - Digital 32.768 kHz clock input source
PA7
Digital I/O
TIM1C4 - Timer 1 Channel 4 output
TIM1C4 - Timer 1 Channel 4 input
REG_EN - External regulator open drain output
PB3
Digital I/O
TIM2C3 - Timer 2 channel 3 output
TIM2C3 - Timer 2 channel 3 input
SC1nCTS - UART CTS handshake of Serial Controller 1
SC1SCLK - SPI master/slave clock of Serial Controller 1
PB4
Digital I/O
TIM2C4 - Timer 2 channel 4 output
TIM2C4 - Timer 2 channel 4 input
SC1nRTS - UART RTS handshake of Serial Controller 1
SC1nSSEL - SPI slave select of Serial Controller 1
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Notes
4
5
6
12
13
14
22
24
18
19
20
ZICM357P2-2 and ZICM357P2-2C: Flash memory write protect (internal
pull-up) ZICM357P2-1-NF & ZICM357P2-1C-NF: N/C
Active Low (Input)
*Dedicated as SC2 SPI bus for ZICM357P2-2 and ZICM357P2-2C due to Flash memory.
Page 7
MeshConnect™ EM357 Module
CEL MeshConnect
EM357 Module PIN
Number
15
Ember EM357
IC Pin Number
26
Name
PA4
Notes
Digital I/O
ADC4 - ADC Input 4
PTI_EN - Frame signal of Packet Trace Interface (PTI)
TRACEDATA2 - Synchronous CPU trace data bit 2
27
PA5
17
29
PA6
Digital I/O
TIM1C3 - Timer 1 channel 3 output
TIM1C3 - Timer 1 channel 3 input
Digital I/O
SC1MISO - SPI slave data out of Serial Controller 1
SC1MOSI - SPI master data out of Serial Controller 1 SC1SDA - TWI data
of Serial Controller 1
SC1TXD - UART transmit data of Serial Controller 1
TIM2C1 - Timer 2 channel 1 output
TIM2C1 - Timer 2 channel 1 input
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16
Digital I/O
ADC5 - ADC Input 5
PTI_DATA - Data signal of Packet Trace Interface (PTI)
nBOOTMODE - Embedded serial bootloader activation out of rest
TRACEDATA3 - Synchronous CPU trace data bit 3
18
30
PB1
19
49
GROUND
20
49
GROUND
21
49
GROUND
Digital I/O
SCIMISO - SPI master data in of Serial Controller 1
SC1MOSI - SPI slave data in of Serial Controller 1
SC1SCL - TWI clock of Serial Controller 1
SC1RXD - UART receive data of Serial Controller 1
TIM2C2 - Timer 2 channel 2 output
TIM2C2 - Timer 2 channel 2 input
22
31
PB2
23
32
JTCK
JTAG clock input from debugger
SWCLK - Serial Wire clock input/output with debugger
24
33
PC2
Digital I/O
JTDO - JTAG data out to debugger
SWO - Serial Wire Output asynchronous trace output to debugger
NC
No connect
25
26
34
PC3
Digital I/O
JTDI - JTAG data in from debugger
27
35
PC4
Digital I/O
JTMS - JTAG mode select from debugger
SWDIO - Serial Wire bidirectional data to/from debugger
28
49
GROUND
29
30
36
38
PB0
Digital I/O
VREF - ADC reference output
VREF - ADC reference input
IRQA - External interrupt source A
TRACECLK - Synchronous CPU trace clock
TIM1CLK - Timer 1 external clock input
TIM2MSK - Timer 2 external clock mask input
PC1
Digital I/O
ADC3 - ADC Input 3
SWO - Serial Wire Output asynchronous trace output to debugger
TRACEDATA0 - Synchronous CPU trace data bit 0
Page 8
MeshConnect™ EM357 Module
CEL MeshConnect
EM357 Module PIN
Number
31
Ember EM357
IC Pin Number
40
Notes
PC0
Digital I/O
JRST - JTAG reset input from debugger
IRQD - Default external interrupt source D
TRACEDATA1 - Synchronous CPU trace data bit 1
NC
No connect
PB7
Digital I/O
ADC2 - ADC Input 2
IRQC - Default external interrupt source C
TIM1C2 - Timer 1 channel 2 output
TIM1C2 - Timer 1 channel 2 input
PB6
Digital I/O
ADC1 - ADC Input 1
IRQB - External interrupt source B
TIM1C1 - Timer 1 channel 1 output
TIM1C1 - Timer 1 channel 1 input
Digital I/O
ADC0 - ADC Input 0
TIM2CLK - Timer 2 external clock input
TIM1MSK - Timer 1 external clock mask input
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32
Name
33
34
41
42
35
43
PB5
36
49
GROUND
37
49
GROUND
38
49
GROUND
39
NC
No connect
40
NC
No connect
41
NC
No connect
42
NC
No connect
43
NC
No connect
44
NC
No connect
45
49
GROUND
46
49
GROUND
47
49
GROUND
48
49
GROUND
49
49
GROUND
50
49
GROUND
51
49
GROUND
52
49
GROUND
53
49
GROUND
54
49
GROUND
55
49
GROUND
56
49
GROUND
Note: PC5 does not come out to a castellation pin since it is required to control the PA.
For additional Pin-out details please reference Silicon Laboratories EM357 IC Data Sheet.
Page 9
MeshConnect™ EM357 Module
Module DIMENSIONS
MeshConnect EM357 Module with PCB Trace Antenna
EM357 Module
RF Shield
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ZICM357P2 0000000000000
Pin 1
U1
C6A C1
L6
C6B
C6
R2
C9
C2
R4
C16
ARM
R9
R6
R5
C4A
C17
EM357
Series
C10
C22
R8
C5B
1.413”
C14
L2
R7
C24
R11 C23
0.903”
R1
R10
L5
C11
L3
C13
L4
C20
C20
Pin 56
C21
C7
C7B
XTAL1
C15
Pin 38
Pin 19
0.062”
1.000”
0.195”
MeshConnect EM357 Module with U.FL Connector for external antenna
0.120”
EM357 Module
RF Shield
ZICM357P2 0000000000000
Pin 1
R1
C14
L2
R7
U1
C9
C24
C5B
C6A C1
L6
C6B
C6
R2
C4A
ARM
R6
EM357
Series
C10
R9
C22
R8
L5
C11
L3
C13
L4
R11 C23
C17
R5
C2
R4
1.413”
R10
0.903”
C7B
C20
Pin 56
C21
C7
C16
XTAL1
C15
Pin 38
Pin 19
1.000”
0.062”
0.195”
For layout recommendations for optimum antenna performance, refer to the Antenna Section in this document.
Page 10
MeshConnect™ EM357 Module
Module Land footprint
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Note: Unless otherwise specified, dimensions are in inches [mm].
Page 11
MeshConnect™ EM357 Module
PROCESSING
Recommended Reflow Profile
Parameters Values
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
200ºC
Soak Time
60-120 sec
TLiquidus
217ºC
Time above TL
60-150 sec
Tpeak
250ºC
Time within 5º of Tpeak
20-30 sec
Time from 25º to Tpeak
8 min max
Ramp Down Rate
6ºC/sec max
N
O
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N O
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N
Ramp Up Rate (from Tsoakmax to Tpeak)
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet
the appropriate IPC Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated
Terminations Section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be
easily removed with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any
stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads
• Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Page 12
MeshConnect™ EM357 Module
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a
single wave soldering process is encouraged.
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC7711).
N
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Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250ºC.
Caution
If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to
thermal shock. Avoid overheating.
Warning
Never attempt a rework on the module itself, (e.g. replacing individual components). Such actions will
terminate warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield
cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient
for optimum immunity to external RF interference.
AGENCY CERTIFICATIONS
FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Warning (Part 15.21)
Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for
this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not
be co-located or operating in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC Rules and Regulations
The MeshConnect Module has been certified per FCC Part 15 Rules for integration into products without further
testing or certification. To fulfill the FCC Certification requirements, the OEM of the MeshConnect Module must
Page 13
MeshConnect™ EM357 Module
ensure that the information provided on the MeshConnect Label is placed on the outside of the final product. The
MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is
installed inside another device, then the outside of the device into which the module is installed must also display
a label referring to the enclosed module. The exterior label can use wording such as the following:
• Contains Transmitter Module FCC ID: W7Z-ZICM357P2
• Contains FCC ID: W7Z-ZICM357P2
N
O
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N
The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been
certified with this module. The OEM of the MeshConnect Module must test their final product configuration to
comply with Unintentional Radiator Limits before declaring FCC Compliance per Part 15 of the FCC Rules.
IC Certification — Industry Canada Statement
The term "IC" before the Certification/Registration Number only signifies that the Industry Canada technical
specifications were met.
Certification IC - Déclaration d'Industrie Canada
Le terme "IC" devant le numéro de Certification/D'enregistrement signifie seulement que les spécifications
techniques Industrie Canada ont été respectées.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field
in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php
L'article 14 du CNR-210
Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de
telle sorte qu'il ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale.
Consulter le Code de sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/
pubs/radiation/radio_guide-lignes_direct-eng.php
CE Certification — Europe
The MeshConnect RF t has been tested and certified for use in the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect Module is to be incorporated into a product, the OEM must verify compliance of the final
product to the European Harmonized EMC and Low-Voltage/Safety Standards. A Declaration of Conformity must
be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the User Guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required
to make a submission to the notified body for compliance testing.
OEM Labeling Requirements
The CE mark must be placed on the OEM product in a visible location.The CE mark shall consist of the initials
CE with the following form:
• If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be adhered to.
• The CE mark must be a minimum of 5 mm in height.
• The CE marking must be affixed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz
band is not harmonized by a few countries throughout Europe, the Restriction sign must be
placed to the right of the CE marking as shown in the picture.
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MeshConnect™ EM357 Module
Software Compliance
The ZICM357P2 Module requires software restrictions to meet agency certification requirements. These
restrictions have been implemented in the sample application included with the Software Development Kit.
If a customer is not starting with the CEL Software Development Kit, they must implement these output power
restrictions to use the ZICM357P2 FCC, IC or ETSI Certification:
RF Channel
Valid TX Power Steps
11 - 23
-43 to 8
24
-43 to -9
25
-43 to -20
26
Disabled
11 - 26
-43 to -14
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Certification
FCC/IC
ETSI
Note: The Software Development Kit does not implement the ETSI restrictions.
SHIPMENT, HANDLING, AND STORAGE
Shipment
The MeshConnect Modules are delivered in trays of 28.
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warnings
The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD
protection may destroy or damage the module permanently.
The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are
summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at < 40°C and < 90% relative humidity.
QUALITY
CEL's MeshConnect Modules offer the highest quality at competitive prices. Our modules are manufactured in
compliance with the IPC-A-610 specification, Class II. Our modules go through JESD22 qualification processes
which includes high temperature operating life tests, mechanical shock, temperature cycling, humidity and reflow
testing. CEL conducts RF and DC factory testing on 100% of all production parts.
CEL builds the quality into our products, giving our customers confidence when integrating our products into their systems.
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MeshConnect™ EM357 Module
REFERENCES & REVISION HISTORY
References
Reference Documents
EM35x Datasheet - Silicon Laboratories
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Revision History
Previous Versions
Changes to Current Version
Page(s)
0008-00-07-00-000
(Issue ES) October 14, 2010
Initial preliminary datasheet.
N/A
0008-00-07-00-000
(Issue A) January 21, 2011
Updated RF Channels to 15 for FCC Certification. Updated Pin out table.
Updated processing guidelines.
1, 5
0008-00-07-00-000
(Issue B) April 8, 2011
Added Software Compliance section, Quality and references to the sleep current
variance Errata.
0008-00-07-00-000
(Issue B) June 3, 2011
Updated Software Compliance section.
0008-00-07-00-000
(Issue C) February 24, 2012
Added Companion Kit information, added Block Diagram for ZICM357P2-1-NF.
0008-00-07-00-000
(Issue D) January 14, 2013
5, 14, 15
14
1, 2, 4
Removed Development Kit information.
All
Disclaimer
The information in this document is current as of the published date. The information is subject to change without notice. For
actual design-in, refer to the latest publications of CEL Data Sheets or Data Books, etc., for the most up-to-date specifications
of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL
assumes no responsibility for any errors that may appear in this document.
CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or
arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license,
express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in
semiconductor product operation and application examples. The incorporation of these circuits, software and information in the
design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for
any losses incurred by customers or third parties arising from the use of these circuits, software and information.
While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the
possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to
persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
For More Information
For more information about CEL MeshConnect products and solutions, visit our website at www.cel.com/MeshConnect.
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