PRELIMINARY DATA SHEET FreeStar Transceiver Module ZFSM-101-3 N O T FO R R EC N O EW M M D EN ES D IG ED N Integrated Transceiver Module for ZigBee®/IEEE 802.15.4 DESCRIPTION California Eastern Laboratories (CEL)'s FreeStar Module is a small, fully-integrated, drop-in RF transmission solution that is ideal for ZigBee and other low cost, low power IEEE 802.15.4 RF transmission applications. FreeStar incorporates the MC13202 transceiver IC and MC9S08GT60 microprocessor from Freescale with a power amplifier and an Inverted-F PCB antenna. It delivers up to 4,000 feet of range and features a streamlined communications protocol that results in the lowest power consumption in transmit mode of any Module on the market. The FreeStar is also FCC and CE Certified, which eliminates the need for a costly and time-consuming approval process when incorporated into your design. FreeStar ZFSM-101-3 • Transmit Power: 100 mW • Receive Sensitivity: -91 dBm • RF Data Rate: 250 kbps • Based on the Freescale MC13202 transceiver IC • 8-bit HCS08-based MCU APPLICATIONS FEATURES • Communication Modes: Point-to-Point, Point-to Multipoint, Mesh Networking • 4,000+ feet Line of Sight Performance • Small Form Factor: 1.4” x 1.0” • Integrated PCB Trace Antenna • FCC, IC and CE Certified • RoHS Compliance • Direct Sequence Spread Spectrum • CSMA-CA Residential and Commercial Automation Health Care • Patient Monitoring • Fitness Monitoring • Wireless Boot Loader • Flash-Based/Upgradable Industrial Controls • Asset Tracking and Monitoring • Lighting Control • Homeland Security • Security • Process Management • Access Control • Environmental Monitoring • Heating, Ventilation, and Control Air-Conditioning (HVAC) • Heating, Ventilation, • Automated Meter Reading (AMR) Air-Conditioning (HVAC) • Automated Meter Reading (AMR) • 10 Bit A/D (2 inputs) • General Purpose I/O (8 ports) • Microsoft® Windows® -Based Configuration and Test Tool • Simple Serial UART Interface • Over 65,000 Network Addresses Consumer • Human Interface Devices (keyboard, mice, etc.) • Remote Control • Wireless Toys ORDERING INFORMATION Part Number Order Number FreeStar ZFSM-101-3 ZFSM-101-3 Description FreeStar 100mW transceiver module PCB Trace Antenna with / Freescale MC13202 The information in this document is subject to change without notice, please confirm data is current Document No: 0001-00-07-01-000 Date Published: December 14, 2012 Mins/Mults Status 200 pcs / 200 pcs Not Recommended For New Designs FreeStar ZFSM-101-3 TABLE OF CONTENTS Introduction and Overview 1 Features.................................................................................................................................................................................................. 1 Applications............................................................................................................................................................................................ 1 Ordering Information............................................................................................................................................................................. 1 Module Block Diagram........................................................................................................................................................................... 3 Development Kit..................................................................................................................................................................................... 3 N O T FO R R EC N O EW M M D EN ES D IG ED N Description.............................................................................................................................................................................................. System Level Function Transceiver IC......................................................................................................................................................................................... 3 Electrical Specification Antenna................................................................................................................................................................................................... 4 Absolute Maximum Ratings................................................................................................................................................................... 4 Recommended Operating Conditions................................................................................................................................................... 4 Electrical Characteristics....................................................................................................................................................................... 5 Typical Transmit Power vs. Power Setting.......................................................................................................................................... 5 Pin Signal & Interfaces Pin Definitions........................................................................................................................................................................................ 6 Connector Legend.................................................................................................................................................................................. 7 Connector Configuration....................................................................................................................................................................... 7 Radiation Patterns.................................................................................................................................................................................. 8 Example Interface Diagrams.................................................................................................................................................................. 9 Module Dimensions................................................................................................................................................................................ 10 Module Keepouts.................................................................................................................................................................................... 11 Processing......................................................................................................................................................................................... 12 Shipment, Storage and Handling............................................................................................................................................. 13 Quality.................................................................................................................................................................................................. 13 Agency Certifications................................................................................................................................................................... 14 References and Revision History............................................................................................................................................ 16 Page 2 FreeStar ZFSM-101-3 MODULE BLOCK DIAGRAM FreeStar Module 16MHz XTAL PA Enable PA LPF N O T FO R R EC N O EW M M D EN ES D IG ED N Balun ANT MCU Radio Balun BUS DEVELOPMENT KIT No Longer Available. TRANSCEIVER IC The Freestar ZFSM-101-3 Module replaces the ZFSM-101-2 Module. The difference between the two modules is the replacement of the power amplifier. The design was optimized to provide similar output power between the two designs so that there are no perceived changes by existing customers or designs. The ZFSM-101-3 can use the firmware for the ZFSM-101-2. The power shaping restrictions for FCC/IC and ETSI compliance are listed in the table below for reference. The power setting restrictions must be adhered to. Certification FCC/IC ETSI RF Channel 11 thru 23 24 25 26 11-26 Valid TX Power Steps 0-30 0-18 0-14 0-6 6 Typical Output Power 20 dBm 16.8 dBm 10.8 dBm 2.7 dBm 2.7 dBm Page 3 FreeStar ZFSM-101-3 ANTENNA FreeStar Modules include an integrated PCB trace antenna. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern. To maximize antenna efficiency, an adequate ground plane must be provided on the host PCB. The following will significantly contribute to antenna performance: • The position of the module on the host board • The position of the ground plane on the host board under the module • Overall design of product enclosure N O T FO R R EC N O EW M M D EN ES D IG ED N Poor design affects radiation patterns and can result in reflection, diffraction and/or scattering of the transmitted signal. The following are a few design guidelines to help ensure antenna performance: • • • • • Never place the ground plane or route copper traces directly underneath the antenna portion of the module Never place the antenna close to metallic objects In the overall design, ensure that wiring and other components are not placed near the antenna Do not place the antenna in a metallic or metallized plastic enclosure Keep plastic enclosures 1cm or more from the antenna in any direction ABSOLUTE MAXIMUM RATINGS Rating Power Supply Voltage RF Input Power Storage Temperature Range Value Unit 3.6 Vdc +10 dBm -55 to 125 ºC RECOMMENDED OPERATING CONDITIONS Characteristic Power Supply Voltage (Vdd) Input Frequency Ambient Temperature Range Min Typ 2.1 3.3 2405 -40 25 Max Unit 3.6 Vdc 2480 MHz 85 ºC Logic Input Low Voltage 0 30% Vdd V Logic Input High Voltage 70% Vdd Vdd V Page 4 FreeStar ZFSM-101-3 ELECTRICAL CHARACTERISTICS Parameter Min RF Frequency Range Output Power (software controlled) Receiver Sensitivity @ 1% PER RF Data Rate Host Data Rate Voltage Operating Range General Purpose Digital I/O (8 Pins) RF Channels (Channels 24, 25, and 26 are set at reduced power levels) 2400 1 2.1 -91 250 19.2 Max Unit 2483.5 100 3.6 8 16 MHz mW dBm kbps kbps V Pins Channels 55 15 Vdd 20% Vdd mA mA uA V V N O T FO R R EC N O EW M M D EN ES D IG ED N General Characteristics Typ DC Electrical Characteristics Transmit Mode 100mW Receive Mode Standby Mode Output High Voltage (all digital outputs) Output Low Voltage (all digital outputs) 170 50 Power Supply Current (Vdd) = 3.3V, @ 25°C AC Electrical Characteristics 80% Vdd 0 Sensitivity for 1% packet error rate (-40 to +85ºC) – -91 Sensitivity for 1% packet error rate (25ºC) – -91 dBm -89 dBm Saturation (maximum input level) 10 dBm Nominal Output Power 20 dBm Output Power Control Range (+20 to 0 dBm) 20 Error Vector Magnitude (RMS EVM) Over the Air Data Rate 35 250 dB % kbps On-board Antenna Gain (peak) 0.8 dBi On-board Antenna Gain (average) -3.1 dBi Typical Transmit Power vs. Power Setting Power Setting Output Power >= 30 19.8 dBm 28 19.8 dBm 26 19.8 dBm 24 19.2 dBm 22 17.6 dBm 20 17.2 dBm 18 16.8 dBm 16 16.3 dBm 14 10.8 dBm 12 10.4 dBm 10 9.8 dBm 8 9.2 dBm 6 2.7 dBm 4 2.3 dBm 2 1.9 dBm 0 1.5 dBm Page 5 FreeStar ZFSM-101-3 PIN DEFINITIONS Signal Name PIN TYPE ANT2 AO/AI ANT2 AO/AI TPRF1 GND GND GROUND GND GND GROUND GND GND GROUND GND GND GROUND 5 DI/DO PTD3 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE, PORT D , BIT 3 6 DI/DO PTD4 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE, PORT D , BIT 4 7 AI PTB0 ANALOG TO DIGITAL CONVERTER INPUT, PORT B , INPUT 0 AI PTB1 ANALOG TO DIGITAL CONVERTER INPUT, PORT B , INPUT 1 9 PI VCC PRIMARY POWER INPUT: VCC = 2.4 TO 3.6 VDC 10 GND GND GROUND DI MODE0 FCC / PRODUCTION TEST MODE INPUT WORD, BIT 0 DI MODE1 FCC / PRODUCTION TEST MODE INPUT WORD, BIT 1 DI MODE2 FCC / PRODUCTION TEST MODE INPUT WORD, BIT 2 14 DI/DO PTA4 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 4, KBI1P4 (KEYBOARD INTERRUPT) 15 DI/DO PTA5 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 5, KBI1P5 (KEYBOARD INTERRUPT) 16 DI/DO PTA6 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 6, KBI1P6 (KEYBOARD INTERRUPT) 17 DI PTA7 DIGITAL INPUT CONFIGURED TO INTERRUPT ON RISING EDGE OF SIGNAL TO WAKE UP MODULE FROM SLEEP MODE. PORT A, BIT 7, KBI1P7 (KEYBOARD INTERRUPT) 18 DI/DO PTGO 19 PORT G, BIT 0, BKGD/MS (BACKGROUND/MODE SELECT, FOR PROGRAMMING AND FIRMWARE DEBUG) DI/DO /RESET1 20 DI/DO PTC0 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT C, BIT 0, SCI2 TXD2 (SERIAL COMMUNICATION INTERFACE 2, TRANSMIT DATA) 21 DI/DO PTC1 22 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT C, BIT 1, SCI2 RXD2 (SERIAL COMMUNICATION INTERFACE 2, RECEIVE DATA) DI/DO PTC5 RESERVED TPRF1 1 2 INTEGRATED PBC F-ANTENNA COAXIAL RF TEST POINT – 50 OHMS N O T FO R R EC N O EW M M D EN ES D IG ED N 3 Electrical Description 4 8 11 12 13 23 24 25 26 27 28 29 30 Note: MASTER RESET, ACTIVE LOW DO TXD APPLICATION TRANSMIT DATA OUTPUT (SCI1, TXD1) DI RXD APPLICATION RECEIVE DATA INPUT (SCI1, RXD1) GND GND GROUND GND GND GROUND GND GND GROUND GND GND GROUND GND GND GROUND GND GND GROUND Use an Open Collector Output to Drive the Reset pin or put a 1k Ohm resistor in series with the driving source. Normally the reset pin is an output; however, under brown out and other reset conditions the Freescale microcontroller will drive the pin low. 1 Page 6 FreeStar ZFSM-101-3 CONNECTOR LEGEND DEFINITION DI DIGITAL INPUT DO DIGITAL OUTPUT AI ANALOG INPUT AO ANALOG OUTPUT PI POWER INPUT GND GROUND LOGIC INPUT HIGH 0.7 (VCC) < VIH < (VCC) N O T FO R R EC N O EW M M D EN ES D IG ED N TYPE LOGIC INPUT LOW 0 < VIL < 0.3 (VCC) LOGIC OUTPUT HIGH (VCC – 0.8) < VOH < VCC LOGIC OUTPUT LOW 0 < VOL < 0.2 (VCC) CONNECTOR CONFIGURATION SHD1 GND GND GND GND GND GND GND GND PDT3 GND PDT4 GND PDB0 RXD PDB1 TXD /RESET PTG0 PTA7 PTC0 PTA6 MODE0 PTA5 PTC1 PTA4 GND MODE2 PTC5 MODE1 VCC Note: The PIN Numbering begins at top left-hand side with pin number 1 and follows counter-clockwise about the perimeter of the module. Page 7 FreeStar ZFSM-101-3 RADIATION PATTERNS FreeStar Rev B 2440 MHz Device Orientation Polarization (V) Vertical Gain (dB) Max Avg 0.60 -1.72 Horizontal -7.27 -12.37 Vertical -4.00 -10.91 (H) Horizontal 0.02 -5.90 (F) Vertical -6.62 -13.52 (F) Horizontal 0.85 -4.67 N O T FO R R EC N O EW M M D EN ES D IG ED N (V) (H) Total Average Gain (dB) -3.15 Vertical Horizontal Flat Page 8 FreeStar ZFSM-101-3 EXAMPLE INTERFACE DIAGRAMS N O T FO R R EC N O EW M M D EN ES D IG ED N Sample Connection Diagram when Using Serial Interface Sample Connection Diagram when Using Host Processor Interface Page 9 FreeStar ZFSM-101-3 Module dimensions N O T FO R R EC N O EW M M D EN ES D IG ED N Note: Unless otherwise specified, dimensions are in inches. PCB FOOTPRINT Note: Unless otherwise specified, dimensions are in inches. TOP VIEW PCB COPPER PATTERN FOR REFERENCE ONLY 0.047” 0.047” Recommended Host PCB Board Edge 1 30 1.115” 0.098” (2.5mm) Pitch Throughout 0.060” TYP 30 Places 0.090” TYP 30 Places 0.098” (2.5mm) Pitch Throughout 0.068” 0.068” 0.885” Page 10 FreeStar ZFSM-101-3 Module KEEPOUTS Note: Unless otherwise specified, dimensions are in inches. Module - Dimensions and Keepouts TOP VIEW N O T FO R R EC N O EW M M D EN ES D IG ED N 0.975” COPPER AND COMPONENT KEEPOUT COPPER AND COMPONENT KEEPOUT 0.265” COPPER KEEPOUT 1.425” 30 2 29 3 28 4 27 5 26 6 25 MODULE TOP VIEW 7 24 8 23 9 22 10 21 11 RECOMMENDED MODULE EXTENSION OVER EDGE OF HOST PCB HOST PCB EDGE 1 12 13 14 15 16 17 18 19 20 0.100” PRIMETER AROUND MODULE COMPONENT KEEPOUT COPPER AND COMPONENT KEEPOUT AREA • NO COPPER/TRACES ALLOWED ON ANY LAYER OF HOST PCB IN THIS AREA • NO COMPONENTS ON EITHER TOP OR BOTTOM SIDES OF HOST PCB ALLOWED WITHIN 0.100” OF MODULE COMPONENT KEEPOUT - NO HOST BOARD PERIPHERAL COMPONENTS ALLOWED WITHIN 0.100” OF MODULE IF OVER HANG METHOD OF MOUNTING IS NOT USED • NO COMPONENTS ON EITHER TOP OR BOTTOM SIDES OF HOST PCB ALLOWED IN THIS AREA • NO COPPER/TRACES ALLOWED ON ANY LAYER OF HOST PCB IN THIS AREA Page 11 FreeStar ZFSM-101-3 PROCESSING Recommended Reflow Profile Parameters Values 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 250ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp Down Rate 6ºC/sec max N O T FO R R EC N O EW M M D EN ES D IG ED N Ramp Up Rate (from Tsoakmax to Tpeak) Pb-Free Solder Paste Use of “No Clean” solder paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section. Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step. Optical Inspection After soldering the module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads or vias. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Wave Soldering If a wave soldering process is required on the host boards due to the presence of thru hole components, only a single wave soldering process is encouraged. Page 12 FreeStar ZFSM-101-3 PROCESSING (Continued) Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711). Rework The module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250 ºC. N O T FO R R EC N O EW M M D EN ES D IG ED N Caution If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock. Avoid overheating. Warning Never attempt a rework on the module itself, (e.g., replacing individual components). Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. SHIPMENT, HANDLING AND STORAGE Shipment The modules are delivered in trays of 50. Handling The modules are designed and packaged to be processed in an automated assembly line. Warning The modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033. Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity. QUALITY CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610 specification, Class II. Our modules go through JESD22 qualification processes which includes high temperature operating life tests, mechanical shock, temperature cycling, humidity and reflow testing. CEL modules are 100% factory tested for RF and DC performance. In addition, every production lot is sample tested for compliance with CEL’s high quality and performance standards. CEL builds quality into our products giving our customers the confidence when integrating our products into their systems. Page 13 FreeStar ZFSM-101-3 AGENCY CERTIFICATIONS FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference 2. This device must accept any interference received, including interference that may cause undesired operation N O T FO R R EC N O EW M M D EN ES D IG ED N Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC Rules and Regulations The FreeStar Module has been certified per FCC Part 15 rules for integration into products without further testing or certification. To fulfill the FCC certification requirements, the OEM of the FreeStar Module must ensure that the information provided on the FreeStar Label is placed on the outside of the final product. The FreeStar Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: TFB-FREESTAR3” or “Contains FCC ID: TFBFREESTAR3” The OEM of the FreeStar Module must only use the approved antenna, that has been certified with this module. The OEM of the FreeStar Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules. IC Certification — Industry Canada Statement The term "IC" before the Certification/Registration number only signifies that the Industry Canada technical specifications were met. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Certification IC - Déclaration d'Industrie Canada Le terme "IC" devant le numéro de certification/d'enregistrement signifie seulement que les spécifications techniques Industrie Canada ont été respectées.- Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement Page 14 FreeStar ZFSM-101-3 AGENCY CERTIFICATIONS (Continued) Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php L'article 14 du CNR-210 N O T FO R R EC N O EW M M D EN ES D IG ED N Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php EMC Certification FCC Part 15.247 Module Certified (Portable) EN 300 328 1 Certified / CE Approved The FreeStar Module has been tested and certified for the European Union. OEM Responsibility to the European Union Compliance Rules If the FreeStar Module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage/Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing. OEM Labeling Requirements The `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials “CE” with the following form: • If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to • The CE mark must be a minimum of 5mm in height • If the use of the module is subject to restrictions in the end application, the CE marking on the OEM product should also include the alert sign as shown in the picture to the right Australia Certification Number: AS/NZS 4268 Page 15 FreeStar ZFSM-101-3 REFERENCES & REVISION HISTORY Previous Versions 0001-00-07-01-000 (Issue ES) October 10, 2011 0001-00-07-01-000 (Issue ES) October 26, 2011 0001-00-07-01-000 Initial preliminary datasheet. Updated electrical characteristics, software revisions. Rolled part number to -3, updated power amplifier section Page(s) N/A 1, 4, 6 1, 2, 3, 5 N O T FO R R EC N O EW M M D EN ES D IG ED N October 18, 2012 Changes to Current Version 0001-00-07-01-000 December 14, 2012 Updated FCC information 3, 14 Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. Page 16