PG2413T6Z Data Sheet GaAs Integrated Circuit SP3T Switch for BluetoothTM and 802.11b/g R09DS0001EJ0100 Rev.1.00 May 20, 2010 DESCRIPTION UE D The PG2413T6Z is a GaAs MMIC SP3T switch which was developed for Bluetooth, wireless LAN. This device can operate at frequencies from 0.5 to 3.0 GHz, with low insertion loss. This device is housed in a 8-pin plastic TSON (Thin Small Out-line Flat Non-leaded) package and is suitable for highdensity surface mounting. FEATURES Switch Control voltage Low insertion loss O NT IN : Vcont (H) = 3.0 V TYP., Vcont (L) = 0 V TYP. : Lins = 0.35 dB TYP. @ f = 1.0 GHz : Lins = 0.45 dB TYP. @ f = 2.0 GHz : Lins = 0.50 dB TYP. @ f = 2.5 GHz High isolation : ISL = 26 dB TYP. @ f = 1.0 GHz : ISL = 20 dB TYP. @ f = 2.0 GHz : ISL = 18 dB TYP. @ f = 2.5 GHz Handling power : Pin (0.1 dB) = +28.0 dBm TYP. @ f = 2.5 GHz, V cont (H) = 3.0 V, Vcont (L) = 0 V High-density surface mounting : 8-pin plastic TSON package (1.5 1.5 0.37 mm) APPLICATIONS Bluetooth and IEEE802.11b/g etc. ORDERING INFORMATION Part Number PG2413T6Z-E2 Order Number PG2413T6Z-E2-A Package 8-pin plastic TSON (Pb-Free) Marking G6F Supplying Form Embossed tape 8 mm wide Pin 1, 8 face the perforation side of the tape Qty 3 kpcs/reel DI SC Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: PG2413T6Z-A CAUTION Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 1 of 11 PG2413T6Z PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin Name RFC GND Vcont1 4 5 6 7 RF1 RF2 Vcont2 Vcont3 8 RF3 D Pin No. 1 2 3 TRUTH TABLE Vcont2 Low Vcont3 Low RFCRF1 ON Low Low High Low Low High OFF OFF RFCRF2 OFF RFCRF3 OFF ON OFF OFF ON O NT IN Vcont1 High UE Remark Exposed pad : GND ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified) Parameter Switch Control Voltage Input Power (Vcont (H) = 1.8 V) Input Power (Vcont (H) = 2.3 V) Input Power (Vcont (H) = 3.0 V) Input Power (Vcont (H) = 3.6 V) Operating Ambient Temperature Storage Temperature Note: Symbol Vcont Pin Pin Pin Ratings Note +6.0 +26 +28 +32 Unit V dBm dBm dBm Pin TA Tstg +34 45 to +85 55 to +150 dBm C C Vcont (H) Vcont (L) 6.0 V RECOMMENDED OPERATING RANGE (T A = +25C) Symbol f Vcont (H) Vcont (L) MIN. 0.5 1.8 0.2 TYP. 3.0 0 MAX. 3.0 3.6 0.2 Unit GHz V V Control Voltage Difference (H) Vcont (H) 0.1 0 0.1 V Control Voltage Difference (L) Vcont (L) 0.1 0 0.1 V SC Parameter Operating Frequency Switch Control Voltage (H) Switch Control Voltage (L) Note1 Note2 DI Notes: 1. Vcont (H) is a difference between the maximum and the minimum control voltages among Vcont1 (H), Vcont2 (H) and Vcont3 (H). 2. Vcont (L) is a difference between the maximum and the minimum control voltages among Vcont1 (L), Vcont2 (L) and Vcont3 (L). R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 2 of 11 PG2413T6Z ELECTRICAL CHARACTERISTICS 1 (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, Z O = 50 , DC blocking capacitors = 56 pF, unless otherwise specified) 2nd Harmonics 3rd Harmonics f ISL RFC to RF1, 2, 3 f (OFF) f f f RLC f RL1, 2, 3 f Pin (0.1 dB) RFC to RF1, 2, 3 f Pin (1 dB) = 2.5 to 3.0 GHz = 0.5 to 1.0 GHz = 1.0 to 2.0 GHz = 2.0 to 2.5 GHz = 2.5 to 3.0 GHz = 0.5 to 3.0 GHz = 0.5 to 3.0 GHz = 2.5 GHz MIN. Switch Control Current Switch Control Speed 2f0 3f0 Icont tSW TYP. 0.35 0.45 0.50 MAX. 0.60 0.70 0.75 RFC to RF1, 2, 3 f = 2.5 GHz, Vcont (H) = 2.3 V f = 2.5 GHz, Vcont (H) = 3.0 V f = 2.5 GHz, Vcont (H) = 3.6 V f = 2.5 GHz, Pin = 23 dBm f = 2.5 GHz, Pin = 23 dBm No RF input 50% CTL to 90/10% RF Unit dB dB dB 23 17 15 15 15 +25.0 0.60 26 20 18 16 20 20 +28.0 dB dB dB dB dB dB dB dBm +27.0 dBm +31.0 dBm +33.0 dBm 75 dBc 75 dBc 0.1 50 5.0 A O NT IN Return Loss (RFC) Return Loss (RF1, 2, 3) 0.1 dB Loss Compression Note 1 Input Power 1 dB Loss Compression Note 2 Input Power Pass Test Conditions RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz D Isolation Symbol Lins UE Parameter Insertion Loss ns Notes: 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. SC CAUTION DI It is necessary to use DC blocking capacitors with this device. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 3 of 11 PG2413T6Z ELECTRICAL CHARACTERISTICS 2 (TA = +25C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, ZO = 50 , DC blocking capacitors = 56 pF, unless otherwise specified) 3rd Harmonics f ISL RFC to RF1, 2, 3 f (OFF) f f f RLC f RL1, 2, 3 f Pin (0.1 dB) RFC to RF1, 2, 3 f Pin (1 dB) = 2.5 to 3.0 GHz = 0.5 to 1.0 GHz = 1.0 to 2.0 GHz = 2.0 to 2.5 GHz = 2.5 to 3.0 GHz = 0.5 to 3.0 GHz = 0.5 to 3.0 GHz = 2.5 GHz MIN. Switch Control Current Switch Control Speed 2f0 3f0 Icont tSW TYP. 0.35 0.45 0.50 MAX. 0.65 0.75 0.80 RFC to RF1, 2, 3 f = 2.5 GHz f = 2.5 GHz, Pin = 17 dBm f = 2.5 GHz, Pin = 17 dBm No RF input 50% CTL to 90/10% RF Unit dB dB dB 22.5 16.5 14.5 15 15 +19.0 0.65 25.5 19.5 17.5 15.5 20 20 +22.0 dB dB dB dB dB dB dB dBm +21.0 +25.0 dBm 75 dBc 75 dBc 0.1 50 5.0 A O NT IN Return Loss (RFC) Return Loss (RF1, 2, 3) 0.1 dB Loss Compression Note 1 Input Power 1 dB Loss Compression Note 2 Input Power 2nd Harmonics Pass Test Conditions RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz D Isolation Symbol Lins UE Parameter Insertion Loss ns Notes: 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. CAUTION DI SC It is necessary to use DC blocking capacitors with this device. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 4 of 11 PG2413T6Z UE D EVALUATION CIRCUIT The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. O NT IN APPLICATION INFORMATION DI SC CB are DC blocking capacitors external to the device. A value of 56 pF is sufficient for operation from 500 MHz to 2.5 GHz bands. The value may be tailored to provide specific electrical responses. The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 5 of 11 PG2413T6Z DI SC O NT IN UE D TYPICAL CHARACTERISTICS (TA = +25C, DC blocking capacitors = 56 pF, unless otherwise specified) Remark The graphs indicate nominal characteristics. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 6 of 11 O NT IN UE D PG2413T6Z DI SC Remark The graphs indicate nominal characteristics. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 7 of 11 PG2413T6Z MOUNTING PAD LAYOUT DIMENSIONS O NT IN UE D 8-PIN PLASTIC TSON (UNIT: mm) DI SC Remark The mounting pad layout in this document is for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 8 of 11 PG2413T6Z PACKAGE DIMENSIONS O NT IN UE D 8-PIN PLASTIC TSON (UNIT: mm) DI SC Remark A > 0 ( ): Reference value R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 9 of 11 PG2413T6Z RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below D Condition Symbol IR260 HS350 UE CAUTION : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below DI SC O NT IN Do not use different soldering methods together (except for partial heating). R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 10 of 11 PG2413T6Z Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. D 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. DI SC O NT IN UE • Do not lick the product or in any way allow it to enter the mouth. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 11 of 11 PG2413T6Z Data Sheet Revision History Date May 20, 2010 Page First edition issued DI SC O NT IN UE D Rev. 1.00 Description Summary Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. All trademarks and registered trademarks are the property of their respective owners. C-1