UPD5731T6M

CMOS INTEGRATED CIRCUIT
PD5731T6M
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WIDE BAND SP4T SWITCH
communications and another RF switching applications.
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DESCRIPTION
The PD5731T6M is a CMOS MMIC SP4T switch which was developed for mobile communications, wireless
This device can operate frequency from 0.01 to 2.0 GHz, having the low insertion loss and high isolation.
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This device is housed in a 12-pin plastic TSQFN (Thin Small Quad Flat Non-leaded) (T6M) package. And this
package is able to high-density surface mounting.
FEATURES
: VDD = 1.5 to 3.6 V (2.8 V TYP.)
• Switch control voltage
: Vcont (H) = 1.5 to 3.6 V (2.8 V TYP.)
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• Supply voltage
: Vcont (L) = 0.2 to +0.4 V (0 V TYP.)
• Low insertion loss
: Lins1 = 0.7dB TYP. @ f = 0.01 to 0.05 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
: Lins2 = 1.0 dB TYP. @ f = 0.05 to 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
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: Lins3 = 1.4 dB TYP. @ f = 1.0 to 2.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High isolation
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: ISL1 = 60 dB TYP. @ f = 0.01 to 0.05 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0
: ISL2 = 35 dB TYP. @ f = 0.05 to 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
: ISL3 = 26 dB TYP. @ f = 1.0 to 2.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• Handling power
: Pin (1 dB) = +20 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
: Pin (0.1 dB) = +17 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High-density surface mounting : 12-pin plastic TSQFN (T6M) package (2.0  2.0  0.37 mm)
APPLICATIONS
• Mobile communications
• Wireless communications
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• Another RF switching applications
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
PD5731T6M-E2
PD5731T6M-E2-A
12-pin plastic TSQFN
5731
 Embossed tape 8 mm wide
 Pin 10, 11, 12 face the perforation side of the tape
 Qty 3 kpcs/reel
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(T6M) (Pb-Free)
Supplying Form
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: PD5731T6M-A
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
Document No. PU10717EJ03V0DS (3rd edition)
Date Published December 2008 NS
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
PD5731T6M
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin Name
1
NC
2
GND
3
OUTPUT1
4
OUTPUT2
5
GND
6
OUTPUT3
7
OUTPUT4
8
GND
9
Vcont1
10
Vcont2
11
INPUT
12
VDD
TRUTH TABLE
Vcont1
Vcont2
INPUTOUTPUT1
Low
Low
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ON-state
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Pin No.
INPUTOUTPUT2
Low
High
INPUTOUTPUT3
High
Low
INPUTOUTPUT4
High
High
Remark High: +2.8 V, Low: 0 V
Symbol
Ratings
Unit
VDD
0.5 to +4.6
V
Vcont
0.5 to +4.6
V
Vcont (H)
+0.5
V
Pin
+23
dBm
TA
45 to +85
C
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ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified)
Parameter
55 to +150
C
Supply Voltage
Switch Control Voltage
Voltage Difference
 VDD
Input Power
Operating Ambient Temperature
Storage Temperature
Tstg
RECOMMENDED OPERATING RANGE (T A = +25C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
VDD
+1.5
+2.8
+3.6
V
Switch Control Voltage (H)
Vcont (H)
+1.5
+2.8
+3.6
V
Switch Control Voltage (L)
Vcont (L)
0.2
0
+0.4
V
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Supply Voltage
Remark VDD  0.4 V  Vcont (H)  VDD + 0.2 V
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Data Sheet PU10717EJ03V0DS
PD5731T6M
ELECTRICAL CHARACTERISTICS
(T A = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, DC cut capacitors = 10 000 pF,
unless otherwise specified)
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
0.7
1.1
dB
Lins1
f = 0.01 to 0.05 GHz

Insertion Loss 2
Lins2
f = 0.05 to 1.0 GHz

Insertion Loss 3
Lins3
f = 1.0 to 2.0 GHz

Isolation 1
ISL1
f = 0.01 to 0.05 GHz
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Isolation 2
ISL2
f = 0.05 to 1.0 GHz
Isolation 3
ISL3
f = 1.0 to 2.0 GHz
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Input Return Loss 1
RLin1
f = 0.01 to 1.0 GHz
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Input Return Loss 2
RLin2
f = 1.0 to 2.0 GHz
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Output Return Loss 1
RLout1
f = 0.01 to 1.0 GHz
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Output Return Loss 2
RLout2
f = 1.0 to 2.0 GHz
1.4
dB
1.4
1.8
dB
60

dB
35

dB
23
26

dB
12
15

dB
10
12

dB
12
16

dB
10
14

dB
+13
+17

dBm
f = 1.0 GHz

+20

dBm
IDD
VDD = Vcont = 2.8 V, RF off

0.01
1.0
A
Switch Control Current
Icont
VDD = Vcont = 2.8 V, RF off

0.01
1.0
A
Switch Control Speed
tSW
f = 1.0 GHz

30
100
ns
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0.1 dB Loss Compression
Input Power
Note 1
1 dB Loss Compression
Input Power
Note 2
Supply Current
Pin (0.1 dB) f = 1.0 GHz
Pin (1 dB)
Notes 1. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of
linear range.
2. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of
linear range.
Caution This device is used it is necessary to use DC cut capacitors.
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The value of DC cut capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system.
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1.0
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Insertion Loss 1
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Parameter
Data Sheet PU10717EJ03V0DS
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PD5731T6M
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EVALUATION CIRCUIT
Remark C0 = 10 000 pF
Caution This IC has pull down resistance between RF line and GND, which fixes electric potential of RF
line to 0 V, then the IC cannot be used for DC switching.
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The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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Data Sheet PU10717EJ03V0DS
PD5731T6M
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
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USING THE EVALUATION BOARD
Symbol
Values
1 000 pF
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C2
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10 000 pF
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C1
Data Sheet PU10717EJ03V0DS
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PD5731T6M
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TYPICAL CHARACTERISTICS
(T A = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, DC cut capacitors = 10 000 pF,
unless otherwise specified)
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Remark The graphs indicate nominal characteristics.
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Data Sheet PU10717EJ03V0DS
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PD5731T6M
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Remark The graphs indicate nominal characteristics.
Data Sheet PU10717EJ03V0DS
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PD5731T6M
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
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12-PIN PLASTIC TSQFN (T6M) (UNIT: mm)
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Remark The mounting pad and solder mask layouts in this document are for reference only.
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Data Sheet PU10717EJ03V0DS
PD5731T6M
PACKAGE DIMENSIONS
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Remark A > 0
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12-PIN PLASTIC TSQFN (T6M) (UNIT: mm)
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( ): Reference value
Data Sheet PU10717EJ03V0DS
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PD5731T6M
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Partial Heating
Condition Symbol
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350C or below
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 3 seconds or less
: 0.2%(Wt.) or below
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Caution Do not use different soldering methods together (except for partial heating).
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IR260
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Peak temperature (package surface temperature)
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Infrared Reflow
Soldering Conditions
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Data Sheet PU10717EJ03V0DS
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