EM MICROELECTRONIC - MARIN SA
EM4124
EPC C-1 G-2 / ISO 18000-6C RFID IC
Description
Features
TM
EM4124 is a certified EPC Class-1 Generation-2 (Gen2)
IC and compliant with ISO/IEC 18000-6:2010 Type C.
ISO 18000-6C compliant
EPC Class-1 Gen-2 certified
Supports Multi-vendor Chip-based Serialization
96-bit EPC / UII encodings are supported
64-bit manufacturer-programmed & locked Unique
Identifier (TID / UID)
-19 dBm (-21 dBm) typical IC (tag) read sensitivity
32-bit password-protected Kill command
32-bit password-protected Access command
Extended temperature range (–40C to +85C)
Each chip is manufactured with a 64-bit Unique Identifier
to ensure full traceability. The EM4124 has 176 bits of
non-volatile memory (16 bit PC Word, 96 bit EPC Code,
32 bit Kill Password, and 32 bit Access Password),
enabling the support of ISO or EPC data structures. Each
chip is delivered with a 96-bit EPC encoding with preencoded support for Multi-vendor Chip-based Serialization
(MCS).
Typical Operating Configuration
Dipole antenna
EM4124 achieves a typical read sensitivity of -19 dBm at
the chip level, which translates into a typical -21 dBm
sensitivity at the tag level for a dipole-like antenna with 2
dBi gain (25us TARI, 250 kHz BLF).
EPC is a trademark of EPCglobal Inc.
A
VSS
EM4124
Fig. 1 Typical Operating Configuration
Applications
Supply chain management
Tracking and tracing
Container identification
Access control
Asset control
IC Block Diagram
A
Demodulator
Rectifier
Power
management
Logic
Modulator
EEPROM
VSS
EM4124
Fig. 2 IC Block Diagram
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4124-DS.doc, Version 5.0, 25-Apr-13
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EM4124
Table of Contents
Description .............................................................................................................................................................................. 1
Applications ............................................................................................................................................................................ 1
Features ................................................................................................................................................................................... 1
Typical Operating Configuration ............................................................................................................................................ 1
IC Block Diagram ................................................................................................................................................................... 1
Absolute Maximum Ratings ................................................................................................................................................... 3
Operating Conditions .............................................................................................................................................................. 3
Handling Procedures ............................................................................................................................................................... 3
Electrical Characteristics......................................................................................................................................................... 3
Functional Description ............................................................................................................................................................ 4
Memory Organization ............................................................................................................................................................. 4
Delivery State ......................................................................................................................................................................... 5
Commands .............................................................................................................................................................................. 5
Command codes .................................................................................................................................................................. 5
Custom Commands and Features ............................................................................................................................................ 6
GetUID................................................................................................................................................................................ 6
Floor Plan and Pin Description ............................................................................................................................................... 6
Ordering Information .............................................................................................................................................................. 7
Standard Versions & Samples: ............................................................................................................................................... 7
Product Support ...................................................................................................................................................................... 7
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EM4124
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Unit
Storage
temperature
TSTORE
-50
125
°C
RF power at
1)
pad A
PA_ABS
30
dBm
Stresses above these listed maximum ratings may cause
permanent damages to the device. Exposure beyond
specified operating conditions may affect device reliability
or cause malfunction.
Operating Conditions
Voltage on pad
A
VA_ABS
VSS-0.2
VSS+2.0
V
Voltage on pad
TST1, TST3
VTST_ABS
VSS-0.2
VSS+2.0
V
ESD hardness
pad ANT,
TST2 and
2)
TST3
VESD
-2000
Parameter
Symbol
Operating
temperature
TOP
3)
PA
RF carrier frequency
fA
RF power at pad A
Min.
Max.
Unit
-40
+85
°C
20
dBm
960
MHz
860
Table 2: Operating conditions
2000
V
Note 3: IC impedance matched to antenna at read sensitivity
Handling Procedures
Table 1: Absolute maximum ratings
Note 1: IC impedance matched to antenna at read sensitivity
Note 2: Human Body Model
This device has built-in protection against high static
voltages or electric fields; however, anti-static precautions
must be taken as for any other CMOS component. Unless
otherwise specified, proper operation can only occur when
all terminal voltages are kept within the voltage range.
Electrical Characteristics
Parameter
Incoming RF carrier modulation
Symbol
KM
Read sensitivity for power matching
(complex-conjugate matching)
Write sensitivity for power matching
(complex-conjugate matching)
Min.
Typ.
65
Max.
Unit
100
%
PDUT= -17dBm
T = 25°C
Input impedance (between A and VSS)
above activation threshold
Resistive load (between A and VSS)
when modulator is on
Conditions
ZA
fA = 866MHz
fA = 915MHz
fA = 953MHz
1mA into pad A
T = 25°C
RA_ON
25 – j276
22 – j261
20 – j251
50
PRD
T = 25°C
fA=866MHz
fA=915MHz
fA = 953MHz
-19
4)
-19
4)
-19
dBm
dBm
dBm
PWR
T = 25°C
fA=866MHz
fA=915MHz
fA = 953MHz
-8
-8
-8
dBm
dBm
dBm
4)
Table 3: Electrical characteristics
Note 4: 25 us TARI, 250 kHz BLF
Timing Characteristics
Parameter
Symbol
Erase / write endurance
TCYC
Retention
TRET
Conditions
TOP = 55ºC
Min.
Typ.
Max.
Unit
10k
Cycles
10
Years
Table 4: Timing characteristics
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EM4124
Functional Description
The EM4124 is used in passive UHF transponder applications operating at 860 MHz - 960 MHz. It is powered by the RF
energy transmitted by the reader, which is received and rectified to generate a supply voltage for the IC. This device is in
TM
full compliance with ISO/IEC 18000-6C and is EPC Class-1 Generation-2 certified according to the following documents:
"ISO/IEC 18000-6:2010 Information technology – Radio frequency identification for item management – Part 6:
Parameters for air interface communications at 860 MHz to 960 MHz”
"EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at
860 Mhz - 960 MHz, Version 1.1.0” from EPCglobal Inc.
"EPCglobal Tag Data Standards, Version 1.6" from EPCglobal Inc.
Memory Organization
EM4124 memory is allocated to three memory banks: Reserved, TID, and EPC. The 64-bit TID / UID is programmed and
write permalocked at wafer test and before customer delivery. This guarantees the uniqueness of each device on the
market. The custom command GetUID allows fast access of the UID and provides more confidence in the uniqueness.
Memory name
Memory
bank
RESERVED
002
TID
102
EPC
012
Word
Address
0
1
2
3
0
1
2
3
0
1
2
3
4
5
6
7
Contents
Memory type
Kill password
Access
password
TID
SN
CRC-16
PC
EPC
NVM
ROM or
mapped
RAM
NVM
Table 5: Memory map.
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EM4124
Word
0
Bits
(MSB first)
15 14 13 12 11 10 9
8
1
7
6
5
4
3
2
1
0 15 14 13 12 11 10 9
8
6
5
4
3
2
1
0
ISO/IEC 15963
Allocation Class
Tag mask-designer identifier
Tag model number
111000102 (ROM)
0000000010112 (ROM)
See definition of Tag Model Number
Content
Word
2
Bits
(MSB first)
7
15 14 13 12 11 10 9
8
3
7
6
5
4
Content
3
2
1
0 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
32-bit serial number (SN)
Table 6: TID / UID memory map for class identifier E2h; standard version
Tag Model Number
Bits
(MSB first)
Content
11
10
9
8
7
6
0000102
5
4
3
Customer Number (default = 0002)
2
1
0
0002
Table 7: Definition of Tag Model Number
Delivery State
The delivery state has the following default product configuration:
Access Password and Kill Password are readable/writeable with a value 0000'0000'0000'0000h
Unique Identification number (UID / TID) is programmed and write-permalocked
EPC memory is unlocked with a default 96-bit EPC Code value 0000'0000'0000'0020'nnnn'nnnnh where
nnnn’nnnn is the 32-bit serial number found in the TID memory
Commands
Three sets of commands are defined:
Mandatory
Optional
Custom
Command codes
The table below shows all implemented commands in EM4124. For the description of all mandatory and optional
commands, please refer to the EPCglobal Class-1 Gen-2 standard. More detailed information on custom commands is
given below.
Command code
Type
'00'
'01'
'1000'
'1001'
'1010'
'11000000'
'11000001'
'11000010'
'11000011'
'11000100'
'11000101'
'11000110'
‘11100000 00000000’
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
Optional
Custom
Function
QueryRep
ACK
Query
QueryAdjust
Select
NAK
Req_RN
Read
Write
Kill
Lock
Access
GetUID
Table 8: Command codes
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EM4124
Custom Commands and Features
GetUID
GetUID
Command code
RN
16
16
11100000 00000000
Prior RN16 or handle
Table 9: GetUID Command
# of bits
Description
The custom command GetUID is implemented as in Table 9. It allows an interrogator to read the tag's 64-bit TID / UID with
a single command. A tag in Reply, Acknowledged, Open or Secured state backscatters {'0', TID / UID, RN16, CRC-16}
upon a GetUID command with a valid RN16 or handle (see Table 10). The state transition and link timing is the same as for
the ACK command. The tag reply is analogous to the tag reply upon a Read command. A link timing example is shown in
Figure 3.
Header
1
0
# of bits
Description
Select
UID
64
TID / UID
CW
Query
RN
16
RN16 (prior RN16 or handle)
Table 10: GetUID backscatter format
GetUID
CW
T1
Next
command
CW
’0'+UID+RN16+CRC-16
RN16
T4
CRC-16
16
CRC-16('0'+TID+RN16)
T2
T1
T2
Fig. 3: GetUID backscatter timing diagram
Floor Plan and Pin Description
80
80
3
4
2
636
443.77
EM4124
353.03
443.77
389.84
389.77
1
96.15
5
0.07
96.08
Y
582
X
All dimensions in m
Pad size : 68 X 68
Fig. 4: Chip dimensions and pins location
Pin
1
2
3
4
5
Name
VSS
TST1
TST2
TST3
ANT
Pad Type
Bumped
Un-bumped
Bumped
Bumped
Bumped
Description
Antenna N/A - Test purpose only
N/A - Test purpose only
N/A - Test purpose only
Antenna +
Table 11: Pin description. Pins TST2, TST3, VSS can be shorted to ease inlay assembly.
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EM4124
Ordering Information
The following charts show the general offering. For detailed Part Number to order, please see the table “Standard
Versions” below.
Die form
EM4124
WS 6
U - %%%
Circuit Nb:
EM4124
Customer Version:
%%% = only for Custom specific version
Bumping:
U = with Gold Bumps & Polyimide
Die form:
WW = Wafer
WS = Sawn Wafer/Frame
Thickness:
6 = 6 mils (152um)
7 = 7 mils (178um)
11 = 11 mils (280um)
Fig. 5: Ordering information
Remarks:
For ordering, please, use table of “Standard Version” table below.
For specifications of Delivery Form, including gold bumps, tape and bulk, as well as possible other delivery form or
packages, please, contact EM Microelectronic-Marin S.A.
Standard Versions & Samples:
The versions below are considered standards and should be readily available. For other versions or other delivery form,
please contact EM Microelectronic-Marin S.A. For samples, please, order exclusively from the standard version.
Part Number
EM4124WS6U
EM4124VXYYY-%%%
Protocol
Package/Die Form
Delivery Form
EPC Gen2 / ISO 18000-6C Sawn wafer / bumped die – thickness of 6 mils Wafer sawn on frame
Custom
custom
Custom
Table 12: Standard EM4124 versions readily available
Product Support
Check our website at www.emmicroelectronic.com under Products/RF Identification section. Questions can be submitted to
[email protected] .
EM Microelectronic-Marin SA (“EM”) makes no warranties for the use of EM products, other than those expressly contained in EM's
applicable General Terms of Sale, located at http://www.emmicroelectronic.com. EM assumes no responsibility for any errors which may
have crept into this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does
not make any commitment to update the information contained herein.
No licenses to patents or other intellectual property rights of EM are granted in connection with the sale of EM products, neither expressly
nor implicitly.
In respect of the intended use of EM products by customer, customer is solely responsible for observing existing patents and other
intellectual property rights of third parties and for obtaining, as the case may be, the necessary licenses.
Important note: The use of EM products as components in medical devices and/or medical applications, including but not limited
to, safety and life supporting systems, where malfunction of such EM products might result in damage to and/or injury or death
of persons is expressly prohibited, as EM products are neither destined nor qualified for use as components in such medical
devices and/or medical applications. The prohibited use of EM products in such medical devices and/or medical applications is
exclusively at the risk of the customer.
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