SL3ICS1002/1202
UCODE G2XM and G2XL
Rev. 3.7 — 9 October 2012
139037
Product data sheet
COMPANY PUBLIC
1. General description
The UHF EPCglobal Generation 2 standard allows the commercialized provision of mass
adoption of UHF RFID technology for passive smart tags and labels. Main fields of
applications are supply chain management and logistics for worldwide use with special
consideration of European, US and Chinese frequencies to ensure that operating
distances of several meters can be realized.
The G2X is a dedicated chip for passive, intelligent tags and labels supporting the
EPCglobal Class 1 Generation 2 UHF RFID standard. It is especially suited for
applications where operating distances of several meters and high anti-collision rates are
required.
The G2X is a product out of the NXP Semiconductors UCODE product family. The entire
UCODE product family offers anti-collision and collision arbitration functionality. This
allows a reader to simultaneously operate multiple labels / tags within its antenna field.
A UCODE G2X based label/ tag requires no external power supply.
Its contact-less interface generates the power supply via the antenna circuit by
propagative energy transmission from the interrogator (reader), while the system clock is
generated by an on-chip oscillator. Data transmitted from interrogator to label/tag is
demodulated by the interface, and it also modulates the interrogator’s electromagnetic
field for data transmission from label/tag to interrogator. A label/tag can be operated
without the need for line of sight or battery, as long as it is connected to a dedicated
antenna for the targeted frequency range. When the label/tag is within the interrogator’s
operating range, the high-speed wireless interface allows data transmission in both
directions.
In addition to the EPC specifications the G2X offers an integrated EAS (Electronic Article
Surveillance) feature and read protection of the memory content. On top of the
specification of the G2XL the G2XM offers 512-bit of user memory.
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
2. Features and benefits
2.1 Key features
512-bit user memory (G2XM only)
240-bit of EPC memory
64-bit tag identifier (TID) including 32-bit unique serial number
Memory read protection
EAS (Electronic Article Surveillance) command
Calibrate command
32-bit kill password to permanently disable the tag
32-bit access password to allow a transition into the secured transmission state
Broad international operating frequency: from 840 MHz to 960 MHz
Long read/write ranges due to extremely low power design
Reliable operation of multiple tags due to advanced anti-collision
Forward link: 40-160 kbit/s
Return link: 40-640 kbit/s
2.2 Key benefits
High sensitivity provides long read range
Low Q-factor for consistent performance on different materials
Improved interference suppression for reliable operation in multi-reader environment
Large input capacitance for ease of assembly and high assembly yield
Highly advanced anti-collision resulting in highest identification speed
Reliable and robust RFID technology suitable for dense reader and noisy
environments
2.3 Custom commands
EAS Alarm
Enables the UHF RFID tag to be used as EAS tag without the need for a backend data
base.
Read Protect
Protects all memory content including CRC16 from unauthorized reading.
Calibrate
Activates permanent back-scatter in order to evaluate the tag-to-reader performance.
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3. Applications
Supply chain management
Item level tagging
Asset management
Container identification
Pallet and case tracking
Product authentication
Outside above mentioned applications, please contact NXP Semiconductors for support.
4. Ordering information
Table 1.
Ordering information G2XM
Type number
Package
Name
Description
Version
SL3ICS1002FUG/V7AF
Wafer
Bumped die on sawn wafer
-
SL3S1002FTT
TSSOP8
plastic thin shrink small outline package; SOT505-1
8 leads; body width 3 mm
SL3S1002FTB1
XSON3
plastic extremely thin small outline
package;3 terminals;
body 1 x 1.45 x 0,5 mm
Table 2.
Ordering information G2XL
Type number
139037
Product data sheet
COMPANY PUBLIC
SOT1122
Package
Name
Description
Version
SL3ICS1202FUG/V7AF
Wafer
Bumped die on sawn wafer
-
SL3S1202FTT
TSSOP8
plastic thin shrink small outline package;
8 leads; body width 3 mm
SOT505-1
SL3S1202FTB1
XSON3
plastic extremely thin small outline
package;3 terminals;
body 1 x 1.45 x 0,5 mm
SOT1122
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5. Block diagram
The SL3ICS1002/1202 IC consists of three major blocks:
- Analog RF Interface
- Digital Controller
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader for being processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
ANALOG
RF INTERFACE
DIGITAL CONTROL
EEPROM
VREG
PAD
VDD
RECT
ANTICOLLISION
DEMOD
READ/WRITE
CONTROL
data
in
ANTENNA
PAD
MEMORY
ACCESS CONTROL
MOD
data
out
EEPROM INTERFACE
CONTROL
RF INTERFACE
CONTROL
R/W
SEQUENCER
CHARGE PUMP
001aai335
Fig 1.
139037
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Block diagram of G2X IC
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6. Wafer layout and pinning information
6.1 Wafer layout
(1)
TP1
RFN
(5)
Y
(6)
(4)
X
(7)
TP2
RFP
(8)
(2)
(3)
not to scale!
001aai346
(1) X-scribe line width: 56.4 m
(2) Y-scribe line width: 56.4 m
(3) Chip step, x-length: 488.0 m
(4) Chip step, y-length: 470,0 m
(5) Bump to bump distance X (TP1 - RFN): 351,0 m
(6) Bump to bump distance Y (RFN - RFP): 333,0 m
(7) Distance bump to metal sealring X: 40,3 m
(8) Distance bump to metal sealring Y: 40,3 m
Bump size X x Y: 60 m x 60 m
Fig 2.
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Wafer layout and pinning information
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7. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
D
SOT505-1
A
E
X
c
y
HE
v M A
Z
5
8
A2
(A3)
A1
A
pin 1 index
q
Lp
L
1
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
A1
A2
1.1
0.15
0.05
0.95
0.80
A3
bp
c
D(1)
E(2)
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
e
HE
0.65
5.1
4.7
L
Lp
v
w
y
Z(1)
q
0.94
0.7
0.4
0.1
0.1
0.1
0.70
0.35
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
99-04-09
03-02-18
SOT505-1
Fig 3.
Package TSSOP8, SOT505-1
Table 3.
Pin description of TSSOP8
Symbol
139037
Product data sheet
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ISSUE DATE
Pin
Description
RFN
1
Grounded antenna connector
-
2 to 7
Not used
RFP
8
Ungrouded antenna connector
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Table 4.
139037
Product data sheet
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TSSOP8 Marking
Type
Type code (Marking)
Comment
SL3S1202FTT
SL3XL
UCODE G2XL
SL3S1002FTT
SL3XM
UCODE G2XM
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XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm
b
SOT1122
b1
1
4×
(2)
L1
3
L
e
2
e1
e1
4×
A
(2)
A1
D
type code
E
terminal 1
index area
pin 1 indication
0
1
scale
Dimensions
A(1)
Unit
mm
2 mm
max 0.50
nom
min
A1
b
b1
D
E
0.04
0.45
0.40
0.37
0.55
0.50
0.47
1.50
1.45
1.40
1.05
1.00
0.95
e
e1
L
0.35
0.55 0.425 0.30
0.27
L1
0.30
0.25
0.22
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
Outline
version
References
IEC
SOT1122
Fig 4.
sot1122_po
JEDEC
JEITA
European
projection
Issue date
09-10-09
MO-252
Package outline SOT1122
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Table 5.
Symbol
Pin
Description
RFP
1
Ungrouded antenna connector
RFN
2
Grounded antenna connector
n.c.
3
not connected
Table 6.
139037
Product data sheet
COMPANY PUBLIC
Pin description of SOT1122
SOT1122 Marking
Type
Type code (Marking)
Comment
SL3S1202FTB1
UL
UCODE G2XL
SL3S1002FTB1
UM
UCODE G2XM
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8. Mechanical specification
8.1 Wafer specification
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”.
8.1.1 Wafer
• Designation:
each wafer is scribed with batch number and
wafer number
•
•
•
•
•
•
•
•
•
Diameter:
200 mm (8”)
Thickness:
150 m ± 15 m
Number of pads
4
Pad location:
non diagonal/ placed in chip corners
Distance pad to pad RFN-RFP
333.0 µm
Distance pad to pad TP1-RFN:
351.0 µm
Process:
CMOS 0.14 µm
Batch size:
25 wafers
Dies per wafer:
120.000
8.1.2 Wafer backside
• Material:
• Treatment:
• Roughness:
Si
ground and stress release
Ra max. 0.5 m, Rt max. 5 m
8.1.3 Chip dimensions
• Die size without scribe:
• Scribe line width:
0.414 mm x 0.432 mm = 0.178 mm2
x-dimension:56.4 m (width is measured on top metal layer)
y-dimension:56.4 m (width is measured on top metal layer)
8.1.4 Passivation on front
• Type
• Material:
• Thickness:
139037
Product data sheet
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Sandwich structure
PE-Nitride (on top)
1.75 m total thickness of passivation
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8.1.5 Au bump
•
•
•
•
•
Bump material:
> 99.9% pure Au
Bump hardness:
35 – 80 HV 0.005
Bump shear strength:
> 70 MPa
Bump height:
18 m
Bump height uniformity:
– within a die:
± 2 m
– within a wafer:
± 3 m
– wafer to wafer:
± 4 m
± 1.5 m
• Bump flatness:
• Bump size:
– RFP, RFN
60 x 60 m
– TP1, TP2
60 x 60 m
– Bump size variation:
± 5 m
• Under bump metallization:
sputtered TiW
8.1.6 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”
8.1.7 Map file distribution
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”
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9. Limiting values
Table 7.
Limiting values[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134)
Voltages are referenced to RFN
Symbol
Parameter
Conditions
Min
Max
Unit
-55
+125
C
-40
+85
C
-
2
kV
Die
Tstg
storage temperature range
Toper
operating temperature
VESD
electrostatic discharge voltage
Human body model
[3]
TSSOP8, SOT1122
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Tstg
storage temperature range
-55
+125
C
Ptot
total power dissipation
-
30
mW
Toper
operating temperature
-40
+85
C
VESD
electrostatic discharge voltage
-
2
kV
Human body model
[1]
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any conditions other
than those described in the Operating Conditions and Electrical Characteristics section of this specification
is not implied.
[2]
This product includes circuitry specifically designed for the protection of its internal devices from the
damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be
taken to avoid applying greater than the rated maxima.
[3]
For ESD measurement, the die chip has been mounted into a CDIP20 package.
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10. Characteristics
10.1 Wafer characteristics
Table 8.
Wafer characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Memory characteristics
tRET
EEPROM data retention
Tamb 55 C
50
-
-
year
NWE
EEPROM write endurance
Tamb 55 C
100000 -
-
cycle
-
30
mW
Interface characteristics
Ptot
total power dissipation
foper
operating frequency
840
-
960
MHz
Pmin
minimum operating power supply
[1][2]
-
-15
-
dBm
input capacitance (parallel)
[3]
-
0.88
-
pF
Q
quality factor (Im (Zchip) / Re (Zchip))
[3]
-
9
-
-
Z
impedance (915 MHz)
-
22 - j195
-
-
modulated jammer suppression 1.0 MHz
[4]
-
-4
-
dB
-
unmodulated jammer suppression 1.0 MHz
[4]
-
-4
-
dB
Ci
[1]
Power to process a Query command
[2]
Measured with a 50 source impedance
[3]
At minimum operating power
[4]
Values measured for a 40 kHz phase reserval command under matched conditions
10.2 Package characteristics
Table 9.
Package interface characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
1.02
-
pF
-
18.6 - j171.2
-
-
1.16
-
pF
-
16 - j148
-
Interface characteristics SOT1122
[1]
Ci
input capacitance (parallel)
Z
SOT1122 impedance (915 MHz)
Interface characteristics TSSOP8
[1]
Ci
input capacitance (parallel)
Z
TSSOP8 impedance (915 MHz)
[1]
Measured with network analyzer at 915 MHz; values at 0.5 dBm after peakmax of on-set of die, measured in the center of the pads.
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11. Packing information
11.1 Wafer
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”.
11.2 TSSOP
See http://www.standardics.nxp.com/packaging/packing/pdf/sot505-2.t4.pdf.
11.3 SOT1122
Part orientation T1. For details please refer to
http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf.
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12. Functional description
12.1 Power transfer
The interrogator provides an RF field that powers the tag, equipped with a UCODE G2X.
The antenna transforms the impedance of free space to the chip input impedance in order
to get the maximum possible power for the G2X on the tag.
The RF field, which is oscillating on the operating frequency provided by the interrogator,
is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.
The antenna that is attached to the chip may use a DC connection between the two
antenna pads. Therefore the G2X also enables loop antenna design. Possible examples
of supported antenna structures can be found in the reference antenna design guide.
12.2 Data transfer
12.2.1 Reader to G2X Link
An interrogator transmits information to the UCODE G2X by modulating an RF signal in
the 840 MHz - 960 MHz frequency range. The G2X receives both information and
operating energy from this RF signal. Tags are passive, meaning that they receive all of
their operating energy from the interrogator's RF waveform.
An interrogator is using a fixed modulation and data rate for the duration of at least an
inventory round. It communicates to the G2X by modulating an RF carrier using
DSB-ASK, SSB-ASK or PR-ASK with PIE encoding.
For further details refer to Section 17, Ref. 1, section 6.3.1.2. Interrogator-to-tag (R=>T)
communications.
12.2.2 G2X to reader Link
An interrogator receives information from the UCODE G2X by transmitting a
continuous-wave RF signal to the tag; the G2X responds by modulating the reflection
coefficient of its antenna, thereby generating modulated sidebands used to backscatter an
information signal to the interrogator. The system is a reader talks first (RTF) system,
meaning that a G2X modulates its antenna reflection coefficient with an information signal
only after being directed by the interrogator.
G2X backscatter is a combination of ASK and PSK modulation depending on the tuning
and bias point. The backscattered data is either modulated with FM0 baseband or Miller
sub carrier.
For further details refer to Section 17, Ref. 1, section 6.3.1.3. tag-to-interrogator (T=>R)
communications.
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12.3 Operating distances
RFID tags based on the UCODE G2X silicon may achieve maximum operating distances
according the following formula:
(1)
2
P tag = EIRP G tag ----------
4R
(2)
2
R max =
Table 10.
EIRP G tag
---------------------------------------
2
4 P tag
Symbol description
Symbol
Description
Unit
Ptag
minimum required RF power for the tag
W
Gtag
gain of the tag antenna
-
EIRP
transmitted RF power
m
wavelength
m
Rmax
maximum achieved operating distance for a /2-dipole
m
loss factor assumed to be 0.5 considering matching and
package losses
-
R
distance
m
Table 11.
Operating distances for UCODE G2X based tags and labels in released frequency
bands
Frequency range
Region
868.4 to 868.65 MHz (UHF) Europe [1]
865.5 to 867.6 MHz (UHF)
902 to 928 MHz (UHF)
Europe [2]
America
[3]
Available
power
Calculated read distance Unit
single antenna [4]
0.5 W ERP
3.6
m
2 W ERP
7.1
m
4 W EIRP
7.5
m
[1]
CEPT/ETSI regulations [CEPT1], [ETSI1].
[2]
New CEPT/ETSI regulations. [ETSI3].
[3]
FCC 47 part 15 regulation [FCC1].
[4]
These read distances are maximum values for general tags and labels. Practical usable values may be
lower due to damping by object materials and environmental conditions. A special tag antenna design can
help achieve higher values.
The typical write range is > 50% of the read range.
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12.4 Air interface standards
The G2X is certified according EPCglobal 1.0.9 and fully supports all parts of the
"Specification for RFID Air Interface EPCglobal, EPCTM Radio-Frequency Identity
Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz 960 MHz, Version 1.1.0".
EPCglobal compliance and interoperability certification
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13. Physical layer and signaling
13.1 Reader to G2X communication
13.1.1 Physical layer
For interrogator-to-G2X link modulation refer to Section 17, Ref. 1, annex H.1 Baseband
waveforms, modulated RF, and detected waveforms.
13.1.2 Modulation
An interrogator sends information to one or more G2X by modulating an RF carrier using
double-sideband amplitude shift keying (DSB-ASK), single-sideband amplitude shift
keying (SSB-ASK) or phase-reversal amplitude shift keying (PR-ASK) using a
pulse-interval encoding (PIE) format. The G2X receives the operating energy from this
same modulated RF carrier.
Section 17, Ref. 1: Annex H, as well as chapter 6.3.1.2.2.
The G2X is capable of demodulating all three modulation types.
13.1.3 Data encoding
The R=>T link is using PIE. For the definition of the therefore relevant reference time
interval for interrogator-to-chip signaling (Tari) refer to Section 17, Ref. 1, chapter
6.3.1.2.3. The Tari is specified as the duration of a data-0.
13.1.4 Data rates
Interrogators shall communicate using Tari values between 6.25 s and 25 s, inclusive.
For interrogator compliance evaluation the preferred Tari values of 6.25 s, 12.5 s or
25 s should be used. For further details refer to Section 17, Ref. 1, chapter 6.3.1.2.4.
13.1.5 RF envelope for R=>T
A specification of the relevant RF envelope parameters can be found in Section 17,
Ref. 1, chapter 6.3.1.2.5.
13.1.6 Interrogator power-up/down waveform
For a specification of the interrogator power-up and power-down RF envelope and
waveform parameters refer to Section 17, Ref. 1, chapters 6.3.1.2.6 and 6.3.1.2.7.
13.1.7 Preamble and frame-sync
An interrogator shall begin all R=>T signaling with either a preamble or a frame-sync. A
preamble shall precede a Query command and denotes the start of an inventory round.
For a definition and explanation of the relevant R=>T preamble and frame-sync refer to
Section 17, Ref. 1, chapter 6.3.1.2.8.
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13.2 G2X to reader communication
An interrogator receives information from a G2X by transmitting an unmodulated RF
carrier and listening for a backscattered reply. The G2X backscatters by switching the
reflection coefficient of its antenna between two states in accordance with the data being
sent. For further details refer to Section 17, Ref. 1, chapter 6.3.1.3.
13.2.1 Modulation
The UCODE G2X communicates information by backscatter-modulating the amplitude
and/or phase of the RF carrier. Interrogators shall be capable of demodulating either
demodulation type.
13.2.2 Data encoding
The encoding format, selected in response to interrogator commands, is either FM0
baseband or Miller-modulated subaltern. The interrogator commands the encoding choice
13.2.2.1
FM0 baseband
FM0 inverts the baseband phase at every symbol boundary; a data-0 has an additional
mid-symbol phase inversion. For details on FM0 and generator state diagram, FM0
symbols and sequences and how FM0 transmissions should be terminated refer to
Section 17, Ref. 1, chapter 6.3.1.3.
13.2.2.2
FM0 Preamble
T=>R FM0 signaling begin with one of two defined preambles, depending on the value of
the TRext bit specified in the Query command that initiated the inventory round. For
further details refer to Section 17, Ref. 1, chapter 6.3.1.3.
13.2.2.3
Miller-modulated sub carrier
Baseband Miller inverts its phase between two data-0s in sequence. Baseband Miller also
places a phase inversion in the middle of a data-1 symbol. For details on Miller-modulated
sub carrier, generator state diagram, sub carrier sequences and terminating sub carrier
transmissions refer to Section 17, Ref. 1, chapter 6.3.1.3.
13.2.2.4
Miller sub carrier preamble
T=>R sub carrier signaling begins with one of the two defined preambles. The choice
depends on the value of the TRext bit specified in the Query command that initiated the
inventory round. For further details refer to Section 17, Ref. 1, chapter 6.3.1.3.
13.2.3 Data rates
The G2X IC supports tag to interrogator data rates and link frequencies as specified in
Section 17, Ref. 1, chapter 6.3.1.3.
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13.3 Link timing
For the interrogator interacting with a UCODE G2X equipped tag population exact link and
response timing requirements must be fulfilled, which can be found in Section 17, Ref. 1,
chapter 6.3.1.6.
13.3.1 Regeneration time
The regeneration time is the time required if a G2X is to demodulate the interrogator
signal, measured from the last falling edge of the last bit of the G2X response to the first
falling edge of the interrogator transmission. This time is referred to as T2 and can vary
between 3.0 Tpri and 20 Tpri. For a more detailed description refer to Section 17, Ref. 1,
chapter 6.3.1.6.
13.3.2 Start-up time
For a detailed description refer to Section 17, Ref. 1, chapter 6.3.1.3.4.
13.3.3 Persistence time
An interrogator chooses one of four sessions and inventories tags within that session
(denoted S0, S1, S2, and S3). The interrogator and associated UCODE G2X population
operate in one and only one session for the duration of an inventory round (defined
above). For each session, a corresponding inventoried flag is maintained. Sessions allow
tags to keep track of their inventoried status separately for each of four possible
time-interleaved inventory processes, using an independent inventoried flag for each
process. Two or more interrogators can use sessions to independently inventory a
common UCODE G2X chip population.
A session flag indicates whether a G2X may respond to an interrogator. G2X chips
maintain a separate inventoried flag for each of four sessions; each flag has symmetric A
and B values. Within any given session, interrogators typically inventory tags from A to B
followed by a re-inventory of tags from B back to A (or vice versa).
Additionally, the G2X has implemented a selected flag, SL, which an interrogator may
assert or deassert using a Select command.
For a description of Inventoried flags S0 – S3 refer to Section 17, Ref. 1 chapter 6.3.2.2
and for a description of the Selected flag refer to Section 17, Ref. 1, chapter 6.3.2.3. For
tag flags and respective persistence time refer to Section 17, Ref. 1, table 6.14.
13.4 Bit and byte ordering
The transmission order for all R=>T and T=>R communications respects the following
conventions:
• within each message, the most-significant word is transmitted first, and
• within each word, the most-significant bit (MSB) is transmitted first,
whereas one word is composed of 16 bits.
To represent memory addresses and mask lengths EBV-8 values are used. An extensible
bit vector (EBV) is a data structure with an extensible data range. For a more detailed
explanation refer to Section 17, Ref. 1, Annex A.
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13.5 Data integrity
The G2X ignores invalid commands. In general, "invalid" means a command that (1) is
incorrect given the current the G2X state, (2) is unsupported by the G2X, (3) has incorrect
parameters, (4) has a CRC error, (5) specifies an incorrect session, or (6) is in any other
way not recognized or not executable by the G2X. The actual definition of "invalid" is
state-specific and defined, for each G2X state, in n Section 17, Ref. 1 Annex B and
Annex C.
All UCODE G2X backscatter error codes are summarized in Section 17, Ref. 1 Error
codes, Annex I. For a detailed description of the individual backscatter error situations
which are command specific please refer to the Section 17, Ref. 1 individual command
description section 6.3.2.10.
13.6 CRC
A CRC-16 is a cyclic-redundancy check that an interrogator uses when protecting certain
R=>T commands, and the G2X uses when protecting certain backscattered T=>R
sequences. To generate a CRC-16 an interrogator or the G2X first generates the CRC-16
precursor shown in Section 17, Ref. 1 Table 6.11, then take the ones-complement of the
generated precursor to form the CRC-16. For a detailed description of the CRC-16
generation and handling rules refer to Section 17, Ref. 1, chapter 6.3.2.1.
The CRC-5 is only used to protect the Query command (out of the mandatory command
set). It is calculated out of X5 + X3 + 1. For a more detailed CRC-5 description refer to
Section 17, Ref. 1, table 6.12.
For exemplary schematic diagrams for CRC-5 and CRC-16 encoder/decoder refer to
Section 17, Ref. 1, Annex F.
For a CRC calculation example refer to Section 15.1, Table 29 and Table 30.
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14. TAG selection, inventory and access
This section contains all information including commands by which a reader selects,
inventories, and accesses a G2X population
An interrogator manages UCODE G2X equipped tag populations using three basic
operations. Each of these operations comprises one or more commands. The operations
are defined as follows
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Select:
The process by which an interrogator selects a tag population for inventory
and access. Interrogators may use one or more Select commands to select a
particular tag population prior to inventory.
Inventory:
The process by which an interrogator identifies UCODE G2X equipped tags.
An interrogator begins an inventory round by transmitting a Query command
in one of four sessions. One or more G2X may reply. The interrogator detects
a single G2X reply and requests the PC, EPC, and CRC-16 from the chip. An
inventory round operates in one and only one session at a time. For an
example of an interrogator inventorying and accessing a single G2X refer to
Section 17, Ref. 1, Annex E.
Access:
The process by which an interrogator transacts with (reads from or writes to)
individual G2X. An individual G2X must be uniquely identified prior to access.
Access comprises multiple commands, some of which employ one-time-pad
based cover-coding of the R=>T link.
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14.1 G2X Memory
For the general memory layout according to the standard Section 17, Ref. 1, refer to
Figure 6.17. The tag memory is logically subdivided into four distinct banks.
In accordance to the standard Section 17, Ref. 1, section 6.3.2.1. The tag memory of the
SL3ICS1002 G2XM is organized in following 4 memory sections:
Table 12.
G2X memory sections
Name
Size
Bank
Reserved memory (32 bit ACCESS and 32 bit KILL password)
64 bit
00b
EPC (excluding 16 bit CRC-16 and 16 bit PC)
240 bit
01b
TID (including unique 32 bit serial number)
64 bit
10b
User memory (G2XM only)
512 bit
11b
The logical address of all memory banks begin at zero (00h).
Addresses
3Fh
00h
TID
LS Byte
LSBit
Addresses
MS Byte
MSBit
LSBit
MSBit
3Fh
20h
LSBit
0
LSBit
1Fh
Serial Number
Bits
MSBit
14h
13h
Model Number
31
00000001h to FFFFFFFFh
Addresses
0
19h
Version Number
Bits
0
11
002h
1Fh
0
18h
006h
07h
00h
Class Identifier
11
0
E2h
7
14h
Sub Version Number
6
0000010b
08h
Mask-Designer Identifier
MSBit
0
00000b
4
Whenever the 32 bit serial
is exceeded the sub version
is incremented by 1
Sub Version Nr
UCode EPC G2XM
UCode EPC G2XL
Fig 5.
00000b
00000b
Version (Silicon) Nr
Model Nr.
0000011b
0000100b
003h
004h
Mask ID
006h
006h
G2X TID memory structure
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14.1.1 Memory map
Table 13.
Memory map
Bank
address
Memory
address
Type
Content
Initial [1]
Remark
Bank 00
00h – 1Fh
Reserved
kill password:
refer to Section 17, Ref. 1,
chapter 6.3.2.1.1
all 00h
unlocked memory
20h – 3Fh
Reserved
access password:
refer to Section 17, Ref. 1,
chapter 6.3.2.1.1
all 00h
unlocked memory
00h – 0Fh
EPC
CRC-16: refer to Section 17,
Ref. 1, chapter 6.3.2.1.2
10h – 14h
EPC
Backscatter length:
refer to Section 17, Ref. 1,
chapter 6.3.2.1.2
00110b
unlocked memory
15h
EPC
Reserved for future use:
refer to Section 17, Ref. 1,
chapter 6.3.2.1.2
0b
unlocked memory
16h
EPC
Reserved for future use:
refer to Section 17, Ref. 1,
chapter 6.3.2.1.2
0b
hardwired to 0
17h –1Fh
EPC
Numbering system indicator: 00h
refer to Section 17, Ref. 1,
chapter 6.3.2.1.2
20h - 10Fh
EPC
EPC:
refer to Section 17, Ref. 1,
chapter 6.3.2.1.2
[2]
unlocked memory
00h – 07h
TID
allocation class identifier:
refer to Section 17, Ref. 1,
chapter 6.3.2.1.3
1110 0010b
locked memory
08h – 13h
TID
tag mask designer identifier:
refer to Section 17, Ref. 1,
chapter 6.3.2.1.3
0000 0000 0110b
locked memory
14h – 1Fh
TID
tag model number:
refer to Section 17, Ref. 1,
chapter 6.3.2.1.3
TMNR
locked memory
20h – 3Fh
TID
serial number:
refer to [Section 17, Ref. 1,
chapter 6.3.2.1.3
SNR
locked memory
00h – 1FFh
User
user memory:
refer to [Section 17, Ref. 1,
chapter 6.3.2.1.4
undefined
unlocked memory
Bank 01
Bank 10
Bank 11[3]
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memory mapped
calculated CRC
[1]
This is the initial memory content when delivered by NXP Semiconductors
[2]
G2XL: HEX 3005 FB63 AC1F 3841 EC88 0467
G2XM: HEX 3005 FB63 AC1F 3681 EC88 0468
[3]
only G2XM
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14.1.1.1
User memory (only G2XM)
The User Memory bank contains a sequential block of 512 bits (32 words of 16 bit)
ranging from address 00h to 1Fh. The user memory can be accessed via Select, Read or
Write command and it may be write locked, permanently write locked, unlocked or
permanently unlocked.
In addition reading of not only of the User Memory but of the whole memory including EPC
and TID can be protected by using the custom ReadProtect command.
14.1.1.2
Special behavior of user memory address 1Fh
WRITE or SELECT of user memory address 1Fh will falsely set an error flag. This will
affect the subsequent READ or SELECT.
The following commands will falsely set an internal error flag (without actually
causing an error):
1) WRITE to user memory with WordPtr=1Fh
2) SELECT to user memory with compare mask ending at bitaddress 1FFh
(e.g. Pointer=1FEh, length=1 or Pointer=1FDh, length=2 …)
Note: The error flag is set independent of the chip state (also chips in the e.g. Ready
state are affected).
The falsely set error flag will affect the following sub sequential commands:
A) READ command with WordCount=0 falsely responds with "memory overrun" error
B) SELECT command with Length<>0 falsely assumes non existing memory location
The behavior can be avoided with:
• Turning off the RF carrier to reset the chip (This is what readers typically do!).
• Using the READ command with WordCount<>0.
• Sending other command prior to READ or SELECT (e.g. WRITE to address<>1Fh,
ReqRN) or executing READ or SELECT two times.
Remark: The WRITE operation itself is not affected by this problem i.e. data is written
properly! With commercially available readers this behavior is typically not observed.
14.1.1.3
Supported EPC types
The EPC types are defined in the EPC Tag Standards document from EPCglobal.
These standards define completely that portion of EPC tag data that is standardized,
including how that data is encoded on the EPC tag itself (i.e. the EPC Tag Encodings), as
well as how it is encoded for use in the information systems layers of the EPC Systems
Network (i.e. the EPC URI or Uniform Resource Identifier Encodings).
The EPC Tag Encodings include a Header field followed by one or more Value Fields. The
Header field indicates the length of the Values Fields and contains a numbering system
identifier (NSI). The Value Fields contain a unique EPC Identifier and optional Filter Value
when the latter is judged to be important to encode on the tag itself.
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14.2 Sessions, selected and inventoried flags
Session, Selected and Inventory Flags are according the EPCglobal standard. For a
description refer to Section 17, Ref. 1, section 6.3.2.3.
14.2.1 G2X States and slot counter
For a description refer to Section 17, Ref. 1, section 6.3.2.4.
14.2.2 G2X State Diagram
The tag state are according the EPCglobal standard please refer to: Section 17, Ref. 1,
section 6.3.2.4 Tag states and slot counter.
A detailed tag state diagram is shown in Section 17, Ref. 1, figure 6.19. Refer also to
Section 17, Ref. 1, Annex B for the associated state-transition tables and to Section 17,
Ref. 1, Annex C for the associated command-response tables.
14.3 Managing tag populations
For a detailed description on how to manage an UCODE G2X tag populations refer to
Section 17, Ref. 1, chapter 6.3.2.6.
14.4 Selecting tag populations
For a detailed description of the UCODE G2X tag population selection process refer to
Section 17, Ref. 1, section 6.3.2.7.
14.5 Inventorying tag populations
For a detailed description on accessing individual tags based on the UCODE G2X refer to
Section 17, Ref. 1, section 6.3.2.8.
14.6 Accessing individual tags
For a detailed description on accessing individual tags based on the UCODE G2X refer to
Section 17, Ref. 1, section 6.3.2.9.
An example inventory and access of a single UCODE G2X tag is shown in Section 17,
Ref. 1, Annex E.1.
14.7 Interrogator commands and tag replies
For a detailed description refer to Section 17, Ref. 1, section 6.3.2.10.
14.7.1 Commands
An overview of interrogator to tag commands is located in Section 17, Ref. 1, Table 6.16.
Note that all mandatory commands are implemented on the G2X according to the
standard. Additionally the optional command Access is supported by the G2X (for details
refer to Section 14.11 “Optional Access Command”). Besides also custom commands are
implemented on the G2X (for details refer to Section 14.12 “Custom Commands”.
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14.7.2 State transition tables
The G2X responses to interrogator commands are defined by State Annex B transition
tables in Section 17, Ref. 1. Following states are implemented on the G2X:
•
•
•
•
•
•
•
Ready, for a description refer to Section 17, Ref. 1, Annex B.1.
Arbitrate, for a description refer to Section 17, Ref. 1, Annex B.2.
Reply, for a description refer to Section 17, Ref. 1, Annex B.3.
Acknowledged, for a description refer to Section 17, Ref. 1, Annex B.4.
Open, for a description refer to Section 17, Ref. 1, Annex B.5.
Secured, for a description refer to Section 17, Ref. 1, Annex B.6.
Killed, for a description refer to Section 17, Ref. 1, Annex B.7.
14.7.3 Command response tables
The G2X responses to interrogator commands are described in following Annex C
sections of Section 17, Ref. 1:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Power-up, for a description refer to Section 17, Ref. 1, Annex C.1.
Query, for a description refer to Section 17, Ref. 1, Annex C.2.
QueryRep, for a description refer to Section 17, Ref. 1, Annex C.3.
QueryAdjust, for a description refer to Section 17, Ref. 1, Annex C.4.
ACK, for a description refer to Section 17, Ref. 1, Annex C.5.
NAK, for a description refer to Section 17, Ref. 1, Annex C.6.
Req_RN, for a description refer to Section 17, Ref. 1, Annex C.7.
Select, for a description refer to Section 17, Ref. 1, Annex C.8.
Read, for a description refer to Section 17, Ref. 1, Annex C.9.
Write, for a description refer to Section 17, Ref. 1, Annex C.10.
Kill, for a description refer to Section 17, Ref. 1, Annex C.11.
Lock, for a description refer to Section 17, Ref. 1, Annex C.12.
Access, for a description refer to Section 17, Ref. 1, Annex C.13.
T2 time-out, for a description refer to Section 17, Ref. 1, Annex C.17.
Invalid command, for a description refer to Section 17, Ref. 1, Annex C.18.
14.7.4 Example data-flow exchange
For data flow-exchange examples refer to Section 17, Ref. 1, Annex K:
• K.1 Overview of the data-flow exchange
• K.2 Tag memory contents and lock-field values
• K.3 Data-flow exchange and command sequence
14.8 Mandatory Select Commands
Select commands select a particular UCODE G2X tag population based on user-defined
criteria.
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14.8.1 Select
For a detailed description of the mandatory Select command refer to Section 17, Ref. 1,
section 6.3.2.10.
14.9 Mandatory Inventory Commands
Inventory commands are used to run the collision arbitration protocol.
14.9.1 Query
For a detailed description of the mandatory Query command refer to Section 17, Ref. 1,
section 6.3.2.10.
14.9.2 QueryAdjust
For a detailed description of the mandatory QueryAdjust command refer to Section 17,
Ref. 1, section 6.3.2.10.
14.9.3 QueryRep
For a detailed description of the mandatory QueryRep command refer to Section 17,
Ref. 1, section 6.3.2.10.
14.9.4 ACK
For a detailed description of the mandatory ACK command refer to Section 17, Ref. 1,
section 6.3.2.10.
14.9.5 NAK
For a detailed description of the mandatory NAK command refer to Section 17, Ref. 1,
section 6.3.2.10.
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14.10 Mandatory Access Commands
Access commands are used to read or write data from or to the G2X memory. For a
detailed description of the mandatory Access command refer to Section 17, Ref. 1,
section 6.3.2.10.
14.10.1 REQ_RN
Access commands are used to read or write data from or to the G2X memory. For a
detailed description of the mandatory Access command refer to Section 17, Ref. 1,
section 6.3.2.10.
14.10.2 READ
For a detailed description of the mandatory Req_RN command refer to Section 17, Ref. 1,
section 6.3.2.10.
14.10.3 WRITE
For a detailed description of the mandatory Write command refer to Section 17, Ref. 1,
section 6.3.2.10.
14.10.4 KILL
For a detailed description of the mandatory Kill command refer to Section 17, Ref. 1,
section 6.3.2.10.
14.10.5 LOCK
For a detailed description of the mandatory Lock command refer to Section 17, Ref. 1,
section 6.3.2.10.
14.11 Optional Access Command
14.11.1 Access
For a detailed description of the optional Access command refer to Section 17, Ref. 1,
section 6.3.2.10.
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14.12 Custom Commands
14.12.1 ReadProtect
The G2X ReadProtect custom command enables reliable read protection of the entire
G2X memory. Executing ReadProtect from the Secured state will set the ReadProtect-bit
to '1'. With the ReadProtect-Bit set the G2X will continue to work unaffected but fail its
content.
Following commands will be disabled: Read, Write, Kill, Lock, Access, ReadProtect,
ChangeEAS, EAS Alarm and Calibrate. The G2X will only react upon an anticollision with
Select, Query, QueryRep, QueryAdjust, ACK (no truncated reply), NAK, ReqRN but reply
with zeros as EPC and CRC-16 content (except PC/password). ACK will return zeros
except for the PC.
The read protection can be removed by executing Reset ReadProtect. The
ReadProtect-Bit will than be cleared.
Devices whose access password is zero will ignore the command. A frame-sync must be
prepended the command.
After sending the ReadProtect command an interrogator shall transmit CW for the lesser
of TReply or 20 ms, where TReply is the time between the interrogator's ReadProtect
command and the backscattered reply. An interrogator may observe three possible
responses after sending a ReadProtect, depending on the success or failure of the
operation:
• ReadProtect succeeds: After completing the ReadProtect the G2X shall backscatter
the reply shown in Table 16 comprising a header (a 0-bit), the tag's handle, and a
CRC-16 calculated over the 0-bit and handle. Immediately after this reply the G2X will
render itself to this ReadProtect mode. If the interrogator observes this reply within 20
ms then the ReadProtect completed successfully.
• The G2X encounters an error: The G2X will backscatter an error code during the CW
period rather than the reply shown in the EPCglobal Spec (see Annex I for error-code
definitions and for the reply format).
• ReadProtect does not succeed: If the interrogator does not observe a reply within
20 ms then the ReadProtect did not complete successfully. The interrogator may
issue a Req_RN command (containing the handle) to verify that the G2X is still in the
interrogation zone, and may re-initiate the ReadProtect command.
The G2X reply to the ReadProtect command will use the extended preamble shown in
EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a Tag shall reply as if
TRext=1) regardless of the TRext value in the Query that initiated the round.
Table 14.
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ReadProtect command
Command
RN
CRC-16
# of bits
16
16
16
description
11100000 00000001
handle
-
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Table 15.
Header
RN
CRC-16
# of bits
1
16
16
description
0
handle
-
Table 16.
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ReadProtect command-response table
Starting State
Condition
Response
Next State
ready
all
–
ready
arbitrate, reply,
acknowledged
all
–
arbitrate
open
all
-
open
secured
valid handle & invalid
access password
–
arbitrate
valid handle & valid
non zero access
password
Backscatter handle,
when done
secured
killed
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G2X reply to a successful ReadProtect procedure
invalid handle
–
secured
all
–
killed
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14.12.2 Reset ReadProtect
Reset ReadProtect allows an interrogator to resets the ReadProtect-bit and re-enables
reading of the G2X memory content according the EPCglobal specification.
The G2X will execute Reset ReadProtect from the Open or Secured states.
If a G2X in the Open or Secured states receives a Reset ReadProtect with a valid CRC-16
and a valid handle but an incorrect access password, it will not reply and transit to the
Arbitrate state.
If a G2X in the Open or Secured states receives a Reset ReadProtect with a valid CRC-16
and a valid handle but the ReadProtect-Bit is not set ('0'), it will not change the
ReadProtect-Bit but backscatter the reply shown in Table 19.
If a G2X in the Open or Secured receives a Reset ReadProtect with a valid CRC-16 but
an invalid handle, or it receives a Reset ReadProtect before which the immediately
preceding command was not a Req_RN, it will ignore the Reset ReadProtect and remain
in its current state.
A frame-sync must be prepended the Reset ReadProtect command.
After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of
TReply or 20 ms, where TReply is the time between the interrogator's Reset ReadProtect
command and the G2X backscattered reply. An interrogator may observe three possible
responses after sending a Reset ReadProtect, depending on the success or failure of the
operation:
• Write succeeds: After completing the Reset ReadProtect a G2X will backscatter the
reply shown in Table 19 comprising a header (a 0-bit), the handle, and a CRC-16
calculated over the 0-bit and handle. If the interrogator observes this reply within
20 ms then the Reset ReadProtect completed successfully.
• The G2X encounters an error: The G2X will backscatter an error code during the CW
period rather than the reply shown in Table 19 (see EPCglobal Spec for error-code
definitions and for the reply format).
• Write does not succeed: If the interrogator does not observe a reply within 20 ms then
the Reset ReadProtect did not complete successfully. The interrogator may issue a
Req_RN command (containing the handle) to verify that the G2X is still in the
interrogation zone, and may reissue the Reset ReadProtect command.
The G2X reply to the Reset ReadProtect command will use the extended preamble shown
in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a G2X will reply as if
TRext=1 regardless of the TRext value in the Query that initiated the round.
The Reset ReadProtect command is structured as following:
•
•
•
•
139037
Product data sheet
COMPANY PUBLIC
16 bit command
Password: 32 bit Access-Password XOR with 2 times current RN16
16 bit handle
CRC-16 calculate over the first command-code bit to the last handle bit
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UCODE G2XM and G2XL
Table 17.
Reset ReadProtect command
Command
Password
RN
CRC-16
# of bits
16
32
16
16
description
11100000
00000010
(access
password)
2*RN16
handle
-
Table 18.
G2X reply to a successful Reset ReadProtect command
Header
RN
CRC-16
# of bits
1
16
16
description
0
handle
-
Table 19.
Reset ReadProtect command-response table
Starting State
Condition
Response
Next State
ready
all
–
ready
arbitrate, reply,
acknowledged
all
–
arbitrate
open
ReadProtect bit is set,
Backscatter handle,
when done
open
valid handle & valid access password
ReadProtect bit is set,
–
arbitrate
–
open
ReadProtect bit is reset
–
open
ReadProtect bit is set,
secured
valid handle & valid access password
Backscatter handle,
when done
ReadProtect bit is set,
–
arbitrate
–
secured
ReadProtect bit is reset
–
secured
all
–
killed
valid handle & invalid access password
ReadProtect bit is set,
invalid handle
secured
valid handle & invalid access password
ReadProtect bit is set,
invalid handle
killed
139037
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14.12.3 ChangeEAS
A G2X equipped RFID tag can be enhanced by a stand-alone operating EAS alarm
feature. With an EAS-Alarm bit set to '1' the tag will reply to an EAS_Alarm command by
backscattering a 64 bit alarm code without the need of a Select or Query. The EAS is a
built-in solution so no connection to a backend database is required. As it is a custom
command no Select or Query is required to detect the EAS state enabling fast, reliable
and offline article surveillance.
ChangeEAS can be executed from the Secured state only. The command will be ignored
if the Access Password is zero, the command will also be ignored with an invalid CRC-16
or an invalid handle, the G2X will than remain in the current state. The CRC-16 is
calculated from the first command-code bit to the last handle bit. A frame-sync must be
prepended the command.
The G2X reply to a successful ChangeEAS will use the extended preamble, as
appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the
Query that initiated the round.
After sending a ChangeEAS an interrogator shall transmit CW for less than TReply or
20 ms, where TReply is the time between the interrogator's ChangeEAS command and
the G2X backscattered reply. An interrogator may observe three possible responses after
sending a ChangeEAS, depending on the success or failure of the operation
• Write succeeds: After completing the ChangeEAS a G2X will backscatter the reply
shown in Table 22 comprising a header (a 0-bit), the handle, and a CRC-16 calculated
over the 0-bit and handle. If the interrogator observes this reply within
20 ms then the ChangeEAS completed successfully.
• The G2X encounters an error: The G2X will backscatter an error code during the CW
period rather than the reply shown in Table 22 (see EPCglobal Spec for error-code
definitions and for the reply format).
• Write does not succeed: If the interrogator does not observe a reply within 20 ms then
the ChangeEAS did not complete successfully. The interrogator may issue a Req_RN
command (containing the handle) to verify that the G2X is still in the interrogator's
field, and may reissue the ChangeEAS command.
Upon receiving a valid ChangeEAS command a G2X will perform the commanded
set/reset operation of the EAS_Alarm-Bit.
If EAS-Bit is set, the EAS_Alarm command will be available after the next power up and
reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be
ignored.
Table 20.
139037
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COMPANY PUBLIC
ChangeEAS command
Command
ChangeEas
RN
CRC-16
# of bits
16
1
16
16
description
11100000
00000011
1 ... set EAS system bit
0 ... reset EAS system bit
handle
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Table 21.
Header
RN
CRC-16
# of bits
1
16
16
description
0
handle
-
Table 22.
139037
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G2X reply to a successful ChangeEAS command
ChangeEAS command-response table
Starting State
Condition
Response
Next State
ready
all
–
ready
arbitrate, reply,
acknowledged
all
–
arbitrate
open
all
–
open
secured
valid handle
Backscatter handle,
when done
secured
invalid handle
–
secured
killed
all
–
killed
Starting State
Condition
Response
Next State
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14.12.4 EAS_Alarm
EAS_Alarm is a custom command causing the G2X to immediately backscatter an
EAS-Alarmcode, when EAS ALARM bit is set without any delay caused by Select, Query
and without the need for a backend database.
The EAS feature of the G2X is available after enabling it by sending a ChangeEAS
command described in Section 14.12.3 “ChangeEAS”. With an EAS-Alarm bit set to '1' the
G2X will reply to an EAS_Alarm command by backscattering a fixed 64 bit alarm code. A
G2X will reply to an EAS_Alarm command from the ready state only.
If the EAS-Alarm bit is reset ('0') by sending a ChangeEAS command in the password
protected Secure state the G2X will not reply to an EAS_Alarm command.
The EAS_Alarm command is structured as following:
• 16 bit command
• 16 bit inverted command
• DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal Spec.
6.3.1.2.8 and Table 6.9.
• M (cycles per symbol) sets the T=>R data rate and modulation format as shown in
EPCglobal Spec. Table 6.10.
• TRext chooses whether the T=>R preamble is prepended with a pilot tone as
described in EPCglobal Spec. 6.3.1.3.
A preamble must be prepended the EAS_Alarm command according EPCglobal Spec,
6.3.1.2.8.
Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b
and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate
the CRC5 over the backscattered 64 bits received to verify the received code.
Table 23.
EAS_Alarm command
Command
Inv_Command
DR
M
16
16
1
2
1
16
description
11100000
00000100
00011111
0: DR=8
00: M=1
-
11111011
1: DR=64/3
01: M=2
0: No pilot
tone
11: M=8
Table 24.
Product data sheet
COMPANY PUBLIC
CRC-16
# of bits
10: M=4
139037
TRext
1: Use pilot
tone
G2X reply to a successful EAS_Alarm command
Header
EAS Code
# of bits
1
64
description
0
CRC5 (MSB)
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UCODE G2XM and G2XL
Table 25.
139037
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Eas_Alarm command-response table
Starting State
Condition
Response
Next State
ready
EAS-bit is set and
non-zero access
password
Backscatter Alarm
code
ready
arbitrate, reply,
acknowledged
EAS-bit is set and
non-zero access
password
–
arbitrate
open
EAS-bit is set and
non-zero access
password
open
secured
EAS-bit is set and
non-zero access
password
secured
killed
EAS-bit is set and
non-zero access
password
–
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14.12.5 Calibrate
After execution of the custom Calibrate command the G2X will continuously backscatter
the user memory content in an infinite loop. The G2XL will continuously backscatter zeros.
This command can be used for frequency spectrum measurements. Calibrate can only be
executed from the Secure state with an non-zero Access Password set otherwise the
command will be ignored.
The Calibrate command includes a CRC-16 calculated over the whole command, the
handle and a prepended frame-sync.
Table 26.
Calibrate command
Command
RN16
CRC-16
# of bits
16
16
16
description
11100000 00000101
handle
-
Table 27.
G2X reply to a successful Calibrate command
Header
Infinite repeat
# of bits
1
512 (looped)
description
0
User memory data[1]
zeros[2]
[1]
G2XM
[2]
G2XL
Table 28.
Starting State
Condition
Response
Next State
ready
all
–
ready
arbitrate, reply,
acknowledged
all
–
arbitrate
secured
nonzero access
password
Backscatter infinite
_
access password is
zero
–
secured
all
–
killed
killed
139037
Product data sheet
COMPANY PUBLIC
Calibrate command-response table
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UCODE G2XM and G2XL
15. Support information
15.1 CRC Calculation EXAMPLE
Old RN = 3D5Bh
Table 29.
Practical example of CRC calculation for a 'Req_RN' command by the reader
Second Byte of RN
First Byte of RN
Cmd Code for Req_RN
CRC Calculated @ Reader
F
F
F
F
1
F
F
F
E
1
F
F
F
C
0
E
F
D
9
0
C
F
9
3
0
8
F
0
7
0
0
E
2
F
0
1
C
5
E
1
2
8
9
9
0
5
1
3
A
0
A
2
7
4
1
4
4
E
8
1
9
9
F
1
1
3
3
E
2
1
7
7
E
5
0
E
F
C
A
1
D
F
9
4
0
A
F
0
9
1
5
E
1
2
0
B
C
2
4
1
7
8
4
8
1
E
0
B
1
0
D
1
4
3
1
A
2
8
6
1
4
5
0
C
-> ones complement:
B
A
F
3
=> Command-Sequence: C1 3D 5B BA F3 hex
139037
Product data sheet
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Table 30.
Practical example of CRC calculation for a 'Req_RN' command by the reader
Second Byte of CRC
First Byte of CRC
Second Byte of RN
First Byte of RN
Cmd Code for Req_RN
CRC Calculated @ Tag
139037
Product data sheet
COMPANY PUBLIC
F
F
F
F
1
F
F
F
E
1
F
F
F
C
0
E
F
D
9
0
C
F
9
3
0
8
F
0
7
0
0
E
2
F
0
1
C
5
E
1
2
8
9
9
0
5
1
3
A
0
A
2
7
4
1
4
4
E
8
1
9
9
F
1
1
3
3
E
2
1
7
7
E
5
0
E
F
C
A
1
D
F
9
4
0
A
F
0
9
1
5
E
1
2
0
B
C
2
4
1
7
8
4
8
1
E
0
B
1
0
D
1
4
3
1
A
2
8
6
1
4
5
0
C
1
9
A
3
9
0
2
4
5
3
1
5
8
8
7
1
A
1
2
F
1
4
2
5
E
0
8
4
B
C
1
0
9
7
8
0
1
2
F
0
1
3
5
C
1
1
7
B
A
3
1
E
7
6
7
1
C
E
C
E
0
8
D
B
D
0
0
B
5
B
1
0
6
9
7
1
1
D
0
F
-> Residue OK
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16. Abbreviations
Table 31.
139037
Product data sheet
COMPANY PUBLIC
Abbreviations
Acronym
Description
CRC
Cyclic redundancy check
CW
Continuos wave
EEPROM
Electrically Erasable Programmable Read Only Memory
EPC
Electronic Product Code (containing Header, Domain Manager, Object Class
and Serial Number)
FM0
Bi phase space modulation
G2
Generation 2
HBM
Human Body Model
IC
Integrated Circuit
LSB
Least Significant Byte/Bit
MSB
Most Significant Byte/Bit
NRZ
Non-Return to Zero coding
RF
Radio Frequency
RTF
Reader Talks First
Tari
Type A Reference Interval (ISO 18000-6)
UHF
Ultra High Frequency
Xxb
Value in binary notation
xxhex
Value in hexadecimal notation
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UCODE G2XM and G2XL
17. References
[1]
EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF
RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0
(December 17, 2005)
[2]
EPCglobal: EPC Tag Data Standards
[3]
EPCglobal (2004): FMCG RFID Physical Requirements Document (draft)
[4]
EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference
(draft)
[5]
European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 1 – Technical characteristics and test methods
[6]
European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive
[7]
[CEPT1]: CEPT REC 70-03 Annex 1
[8]
[ETSI1]: ETSI EN 330 220-1, 2
[9]
[ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility
And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment
operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1:
Technical characteristics and test methods.
[10] [FCC1]: FCC 47 Part 15 Section 247
[11] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International
Standards
[12] ISO/IEC 3309: Information technology – Telecommunications and information
exchange between systems – High-level data link control (HDLC) procedures –
Frame structure
[13] ISO/IEC 15961: Information technology, Automatic identification and data capture –
Radio frequency identification (RFID) for item management – Data protocol:
application interface
[14] ISO/IEC 15962: Information technology, Automatic identification and data capture
techniques – Radio frequency identification (RFID) for item management – Data
protocol: data encoding rules and logical memory functions
[15] ISO/IEC 15963: Information technology — Radio frequency identification for item
management — Unique identification for RF tags
[16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item
management — Part 1: Reference architecture and definition of parameters to be
standardized
[17] ISO/IEC 18000-6: Information technology automatic identification and data capture
techniques — Radio frequency identification for item management air interface —
Part 6: Parameters for air interface communications at 860–960 MHz
[18] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary
– Part 3: radio-frequency identification (RFID)
139037
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[19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:
Radio-frequency devices, U.S. Federal Communications Commission.
[20] Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**1
1.
** ... document version number
139037
Product data sheet
COMPANY PUBLIC
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18. Revision history
Table 32.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SL3ICS1002_1202 v.3.7
20121009
Product data sheet
-
139036
Modifications:
139036
Modifications:
139035
Modifications:
139034
Modifications:
139033
•
Update of the delivery form
20110310
•
•
Product data sheet
139034
Type SOT1122 added
Figure 2 “Wafer layout and pinning information”: correction of
drawing
20090721
•
139035
Section 14.1.1.2 “Special behavior of user memory address 1Fh”:
added
20091102
•
•
Product data sheet
Table 4 “TSSOP8 Marking”: added
Product data sheet
139033
Table 11 “TSSOP8 characteristics” andTable 9 “Package interface
characteristics” :removed “Memory characteristics”
20090605
Product data sheet
-
139032
139132
Modifications:
139032
Modifications:
139031
139037
Product data sheet
COMPANY PUBLIC
•
This data sheet is a combination of data sheets SL3ICS1002 and
SL3ICS1202
•
•
•
New type FCS2 Aluminum, SOT1040AB2 added
Section 8.1.6 “Fail die identification”: added
Section 11 “Packing information”: edited
20080716
Product data sheet
•
•
rephrasing of Section 2 “Features and benefits” on page 2
•
•
redesign of Figure 1 “Block diagram of G2X IC” on page 4
•
added type “FCS2 Polymer Strap - SOT1040AA1” in Section 4
“Ordering information”, Section 6 “Wafer layout and pinning
information”, Section 7 “Package outline”, Section 8 “Mechanical
specification”, Section 9 “Limiting values”, Section 10
“Characteristics”
•
added Section 11 “Handling information for Flip Chip Strap (FCS2,
SOT1040)” on page 19
•
•
•
•
added Section 11 “Packing information” on page 14
139031
added “calibrate command” in Section 2 “Features and benefits”
on page 2
merging of Fig. 2 Pinning and Fig. 3 Wafer layout - see Figure 2
“Wafer layout and pinning information” on page 5
added Table 10 “Symbol description” on page 16
correction of Table 13 “Memory map” on page 24
removed “ongoing” in 32 bit ongoing in Section 2.1 and Table 12
“G2X memory sections”
20080428
Product data sheet
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139037
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Table 32.
Revision history …continued
Document ID
Modifications:
139030
Modifications:
139011
Modifications:
139010
Release date
Product data sheet
COMPANY PUBLIC
Change notice
Supersedes
update of Table 1 “Ordering information” on page 3
•
correction of “(excluding 16 bit CRC-16 and 16 bit PC) in Table 12 “G2X memory sections”
on page 23
•
•
correction of Initials in “tag mask designer” in Table 13 “Memory map” on page 24
•
added description of ChangeEAS in Table 20 “ChangeEAS command” on page 34
added Section 7 “Package outline” on page 6
added Section 8.1.7 “Map file distribution” on page 11
added Table 9 “Limiting values TSSOP8 [1][2]” on page 14
added room temperature in Table 11 “Memory characteristics” on page 15
added Section 10.2 “TSSOP8 characteristics” on page 17
update of the “EPCglobal compliance and interoperability certification” in Section
12.4 “Air interface standards” on page 17
removed the sentence “The ChangeEAS custom command will toggle the state of the
EAS-Alarm bit located in the EEprom” in Section 14.12.3 “ChangeEAS” on page 34.
20071221
•
•
Product data sheet
•
•
-
139011
-
139010
change of product status
general update
20070910
Objective data sheet
removed double section Change EAS, EAS Alarm, Chapter 12.11.7
changed “Reader” to “Tag”
20070612
•
139037
Data sheet status
•
•
•
•
•
•
•
Objective data sheet
-
-
initial version
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19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
139037
Product data sheet
COMPANY PUBLIC
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3.7 — 9 October 2012
139037
© NXP B.V. 2012. All rights reserved.
46 of 51
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NXP Semiconductors
UCODE G2XM and G2XL
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
UCODE — is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
139037
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.7 — 9 October 2012
139037
© NXP B.V. 2012. All rights reserved.
47 of 51
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
21. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Ordering information G2XM . . . . . . . . . . . . . . . .3
Ordering information G2XL. . . . . . . . . . . . . . . . .3
Pin description of TSSOP8 . . . . . . . . . . . . . . . . .6
TSSOP8 Marking . . . . . . . . . . . . . . . . . . . . . . . .7
Pin description of SOT1122 . . . . . . . . . . . . . . . .9
SOT1122 Marking. . . . . . . . . . . . . . . . . . . . . . . .9
Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . .12
Wafer characteristics . . . . . . . . . . . . . . . . . . . .13
Package interface characteristics . . . . . . . . . . .13
Symbol description . . . . . . . . . . . . . . . . . . . . . .16
Operating distances for UCODE G2X based
tags and labels in released frequency bands . .16
Table 12. G2X memory sections . . . . . . . . . . . . . . . . . . .23
Table 13. Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . .24
Table 14. ReadProtect command . . . . . . . . . . . . . . . . . . .30
Table 15. G2X reply to a successful ReadProtect
procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Table 16. ReadProtect command-response table . . . . . .31
Table 17. Reset ReadProtect command . . . . . . . . . . . . .33
Table 18. G2X reply to a successful Reset ReadProtect
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Table 19. Reset ReadProtect command-response table .33
Table 20. ChangeEAS command . . . . . . . . . . . . . . . . . . .34
Table 21. G2X reply to a successful ChangeEAS
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Table 22. ChangeEAS command-response table . . . . . .35
Table 23. EAS_Alarm command . . . . . . . . . . . . . . . . . . .36
Table 24. G2X reply to a successful EAS_Alarm
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Table 25. Eas_Alarm command-response table . . . . . . .37
Table 26. Calibrate command . . . . . . . . . . . . . . . . . . . . .38
Table 27. G2X reply to a successful Calibrate command.38
Table 28. Calibrate command-response table . . . . . . . . .38
Table 29. Practical example of CRC calculation for a
'Req_RN' command by the reader . . . . . . . . . .39
Table 30. Practical example of CRC calculation for a
'Req_RN' command by the reader . . . . . . . . . .40
Table 31. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .41
Table 32. Revision history . . . . . . . . . . . . . . . . . . . . . . . .44
139037
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.7 — 9 October 2012
139037
© NXP B.V. 2012. All rights reserved.
48 of 51
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
22. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Block diagram of G2X IC . . . . . . . . . . . . . . . . . . . .4
Wafer layout and pinning information . . . . . . . . . .5
Package TSSOP8, SOT505-1 . . . . . . . . . . . . . . . .6
Package outline SOT1122 . . . . . . . . . . . . . . . . . . .8
G2X TID memory structure . . . . . . . . . . . . . . . . .23
139037
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.7 — 9 October 2012
139037
© NXP B.V. 2012. All rights reserved.
49 of 51
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
23. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
7
8
8.1
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.1.6
8.1.7
9
10
10.1
10.2
11
11.1
11.2
11.3
12
12.1
12.2
12.2.1
12.2.2
12.3
12.4
13
13.1
13.1.1
13.1.2
13.1.3
13.1.4
13.1.5
13.1.6
13.1.7
13.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Custom commands. . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Wafer layout and pinning information . . . . . . . 5
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mechanical specification . . . . . . . . . . . . . . . . 10
Wafer specification . . . . . . . . . . . . . . . . . . . . . 10
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Wafer backside . . . . . . . . . . . . . . . . . . . . . . . . 10
Chip dimensions . . . . . . . . . . . . . . . . . . . . . . . 10
Passivation on front . . . . . . . . . . . . . . . . . . . . 10
Au bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Fail die identification . . . . . . . . . . . . . . . . . . . 11
Map file distribution. . . . . . . . . . . . . . . . . . . . . 11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
Wafer characteristics . . . . . . . . . . . . . . . . . . . 13
Package characteristics . . . . . . . . . . . . . . . . . 13
Packing information . . . . . . . . . . . . . . . . . . . . 14
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SOT1122 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Functional description . . . . . . . . . . . . . . . . . . 15
Power transfer . . . . . . . . . . . . . . . . . . . . . . . . 15
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Reader to G2X Link . . . . . . . . . . . . . . . . . . . . 15
G2X to reader Link . . . . . . . . . . . . . . . . . . . . . 15
Operating distances . . . . . . . . . . . . . . . . . . . . 16
Air interface standards . . . . . . . . . . . . . . . . . . 17
Physical layer and signaling. . . . . . . . . . . . . . 18
Reader to G2X communication . . . . . . . . . . . 18
Physical layer . . . . . . . . . . . . . . . . . . . . . . . . . 18
Modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Data encoding. . . . . . . . . . . . . . . . . . . . . . . . . 18
Data rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
RF envelope for R=>T . . . . . . . . . . . . . . . . . . 18
Interrogator power-up/down waveform . . . . . . 18
Preamble and frame-sync . . . . . . . . . . . . . . . 18
G2X to reader communication . . . . . . . . . . . . 19
13.2.1
Modulation . . . . . . . . . . . . . . . . . . . . . . . . . . 19
13.2.2
Data encoding . . . . . . . . . . . . . . . . . . . . . . . . 19
13.2.2.1 FM0 baseband . . . . . . . . . . . . . . . . . . . . . . . . 19
13.2.2.2 FM0 Preamble . . . . . . . . . . . . . . . . . . . . . . . . 19
13.2.2.3 Miller-modulated sub carrier . . . . . . . . . . . . . 19
13.2.2.4 Miller sub carrier preamble . . . . . . . . . . . . . . 19
13.2.3
Data rates . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
13.3
Link timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
13.3.1
Regeneration time . . . . . . . . . . . . . . . . . . . . . 20
13.3.2
Start-up time. . . . . . . . . . . . . . . . . . . . . . . . . . 20
13.3.3
Persistence time . . . . . . . . . . . . . . . . . . . . . . 20
13.4
Bit and byte ordering . . . . . . . . . . . . . . . . . . . 20
13.5
Data integrity . . . . . . . . . . . . . . . . . . . . . . . . . 21
13.6
CRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
14
TAG selection, inventory and access . . . . . . 22
14.1
G2X Memory . . . . . . . . . . . . . . . . . . . . . . . . . 23
14.1.1
Memory map . . . . . . . . . . . . . . . . . . . . . . . . . 24
14.1.1.1 User memory (only G2XM) . . . . . . . . . . . . . . 25
14.1.1.2 Special behavior of user memory address 1Fh 25
14.1.1.3 Supported EPC types . . . . . . . . . . . . . . . . . . 25
14.2
Sessions, selected and inventoried flags. . . . 26
14.2.1
G2X States and slot counter . . . . . . . . . . . . . 26
14.2.2
G2X State Diagram . . . . . . . . . . . . . . . . . . . . 26
14.3
Managing tag populations . . . . . . . . . . . . . . . 26
14.4
Selecting tag populations . . . . . . . . . . . . . . . . 26
14.5
Inventorying tag populations . . . . . . . . . . . . . 26
14.6
Accessing individual tags . . . . . . . . . . . . . . . . 26
14.7
Interrogator commands and tag replies . . . . . 26
14.7.1
Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
14.7.2
State transition tables. . . . . . . . . . . . . . . . . . . 27
14.7.3
Command response tables . . . . . . . . . . . . . . 27
14.7.4
Example data-flow exchange . . . . . . . . . . . . . 27
14.8
Mandatory Select Commands . . . . . . . . . . . . 27
14.8.1
Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
14.9
Mandatory Inventory Commands. . . . . . . . . . 28
14.9.1
Query . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
14.9.2
QueryAdjust . . . . . . . . . . . . . . . . . . . . . . . . . . 28
14.9.3
QueryRep. . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
14.9.4
ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
14.9.5
NAK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
14.10
Mandatory Access Commands . . . . . . . . . . . 29
14.10.1 REQ_RN . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
14.10.2 READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
14.10.3 WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
14.10.4 KILL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
14.10.5 LOCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
14.11
Optional Access Command . . . . . . . . . . . . . . 29
14.11.1 Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
continued >>
139037
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.7 — 9 October 2012
139037
© NXP B.V. 2012. All rights reserved.
50 of 51
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
14.12
14.12.1
14.12.2
14.12.3
14.12.4
14.12.5
15
15.1
16
17
18
19
19.1
19.2
19.3
19.4
20
21
22
23
Custom Commands . . . . . . . . . . . . . . . . . . . .
ReadProtect . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset ReadProtect . . . . . . . . . . . . . . . . . . . . .
ChangeEAS . . . . . . . . . . . . . . . . . . . . . . . . . .
EAS_Alarm . . . . . . . . . . . . . . . . . . . . . . . . . .
Calibrate . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Support information . . . . . . . . . . . . . . . . . . . .
CRC Calculation EXAMPLE . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .
References . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
30
30
32
34
36
38
39
39
41
42
44
46
46
46
46
47
47
48
49
50
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 9 October 2012
139037