EM4237SLIC/SLIX Fact Sheet

FACT SHEET | EM4237SLIC/SLIX
Subject to change without notice
Version 1.0, 10-July-15
Copyright © 2015, EM Microelectronic-Marin SA
www.emmicroelectronic.com
1k bit R/W Memory
ISO/IEC 15693
Standard Compliant Device
Features
I ISO/IEC15693 & ISO/IEC18000-3 compliant
I Long range, low power vicinity transponder IC
I 64-bit ISO/IEC 15963-3 Unique Identifier
I 1024-bit / 2048-bit user’s free data memory
I Security features based on a 32-bit password
General Description
The EM4237SLIC/SLIX is a long range passive CMOS integrated
circuit intended for use in applications requiring a contactless read/
write memory and offering optionally a certain level of security based
on a 32-bit password authentication.
The SLIC 1k-bit / SLIX 2k-bit R/W NV memory are organized in 32/64
blocks of 4-bytes. The EM4237SLIC/SLIX offers a high level of
flexibility in terms of memory management and access conditions. A
memory block can be read/write protected and/or locked separately.
This latest generation of NV memory offers data retention of 60-years
enabling solutions for long-term asset management applications.
Chip application privacy and NV memory access conditions are
optionally protected by a 32-bit password, good trade-off for most
part of anti-theft applications. To ensure a good level of privacy, the
chip can be personalized to remain silent to any command received
from the RFID interrogator or be programmed to return a random ID
number value.
The EM4237SLIC/SLIX features are enriched with a Smart Electronic
Article Surveillance (EAS) mainly used in library applications. The
EAS is configurable and programmable providing the maximum of
efficiency and optionally protected by the IC password.
The IC supports all the ISO/IEC 15963-3 mandatory commands
and many of the optional commands. The chip command set is
completed by custom commands providing a higher degree of
differentiation in terms of security, flexibility and data protection.
I Optional Random ID for enhanced security and
privacy
I Advanced NVM management access conditions
I Smart EAS for advanced library management
systems
I Data Storage Format Identifier (DSFID)
I Application Field Identifier (AFI)
I Memory blocks/pages Locking mechanism
I Lock mechanism for AFI, DSFIS and EAS
I Password protected EAS and AFI functionality
I Destroy function to deactivate the chip forever
I Support all mandatory, most of optional ISO/
IEC15693-3 commands and an enriched set of
custom commands
I 53kbps baud rate for read multiple block command
I On-chip and accurate resonant capacitor: 23.5pF
I -40°C to +85˚C temperature range
I Bonding pads optimized for flip-chip assembly
I 60-years NVM data retention
I Wafer delivery 3 mils thickness, suitable solution
for ticketing applications
I Package option: ultra-thin DFN403 package
Applications
I Library management
I Access Control
I Industrial laundries
ITicketing
I Casino and Gaming
I Supply Chain Management
FACT SHEET | EM4237SLIC/SLIX
Subject to change without notice
Version 1.0, 10-July-15
Copyright © 2015, EM Microelectronic-Marin SA
www.emmicroelectronic.com
Ordering Information
EM4237SLIC/SLIX
For wafer from delivery, please refer to EM4237SLIC/SLIX wafer
specification document.
V1
WS
3
-
E
%%%
Circuit Nb:
Customer Version:
EM4237SLIC (1K-bit)
%%% = only for custom specific version
EM4237SLIX (1K-bit)
Bumping:
DIE FORM:
Version:
" " = Standard pads
V1 = 23.5pF resonant capacitor
E = Gold Bumps - 17.5um
Die form:
Thickness:
WW = Wafer
3 = 3 mils (75um)
WS = Sawn Wafer/Frame
6 = 6 mils (152um)
29 = 29 mils (736um)
Die Form Standard Versions
The versions below are considered standards and should be readily available. For the other delivery form, please contact EM MicroelectronicMarin S.A. Please make sure to give the complete part number when ordering.
Part Number
Package / Die Form
Delivery form / Bumping
EM4237SLIC/SLIXV1WS3E
Sawn wafer, 3 mils thickness
Gold bump
EM4237SLIC/SLIXV1WS6E
Sawn wafer, 6 mils thickness
Gold bump
EM4237SLIC/SLIXV1WW29
Un-sawn wafer, 29 mils thickness
Standard aluminium pads
EMDFN403 PACKAGE:
2 leads Plastic extremely thin small outline package; body 1.1 x 1.4 x
0.46 mm: EMDFN403
All dimensions in inches [mm].
Packing method : Loose form (Aluminum canisters)
Part Number
IC Reference
IC Resonant capacitor
Delivery format
EM4237SLIC/SLIXV1DF403C+
EM4237SLIC/SLIX
23.5pF
Loose form
EMDFN-02 PACKAGE:
A
D
E
B
I1
I2
Size
0.76
2.20
1.78
1.07
0.71
1.08
Tolerance
0.10
0. 15
0.15
0.05
0.05
0.05
All dimensions in mm.
Packing method : Loose form (Aluminum canisters)
Part Number
IC Reference
IC Resonant capacitor
Delivery format
EM4237SLIC/SLIXV1DF02C+
EM4237SLIC/SLIX
23.5pF
Loose form