AP2331 0.2A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH Description Pin Assignments NEW PRODUCT The AP2331 is a single channel current-limited integrated high-side power switcher optimized for hot-swap applications. The devices have fast short-circuit response time for improved overall system robustness and provide a complete protection solution for application subject to heavy capacitive loads and the prospect of short circuit. It offers reverse-current blocking, over-current, over-temperature and shortcircuit protection, as well as controlled rise time and under-voltage lockout functionality. (Top View) GND IN OUT The device is available in SOT23, SC59 and U-DFN2020-3 packages. SOT23 Features • • • • • • • • • • • • • • Input Voltage Range: 2.7V - 5.2V Fast Short-Circuit Response Time 0.4A Accurate Current Limiting 250mΩ On-Resistance Reverse-Current Blocking Built-In Soft-Start with 0.7ms Typical Turn-On Time Over-Current Protection Over-Voltage Protection Short-Circuit and Thermal Protection ESD Protection: 3KV HBM, 300V MM Ambient Temperature Range: -40°C to +85°C Available in “Green” Molding Compound (No Br, Sb) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) • UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified • (Top View) GND IN OUT SC59 ( Top View ) IN Applications • • • • • LCD TVs & Monitors Set-Top Boxes, Residential Gateways Laptops, Desktops, Servers Printers, Docking Stations, HUBs Smart Phones, e-Readers Notes: 1 2 GND OUT DFN2020-3 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2331 Document Number: DS35529 Rev. 5 - 2 1 of 12 www.diodes.com September 2014 © Diodes Incorporated AP2331 Typical Application Circuit Power Supply 2.7V to 5.2V IN OUT 0.1µF 0.1µF NEW PRODUCT Load GND Pin Descriptions Pin Name Pin Number GND OUT IN 1 2 3 Functionss GND Switch Output Pin Voltage Input Pin Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM ESD MM VIN Ratings 3 300 Units KV V 6.5 V VIN +0.3 V Input Voltage Relative to GND VOUT Output Voltage Relative to GND ILOAD Maximum Continuous Load Current TJMAX Maximum Junction Temperature TST Note: Parameter Human Body Model ESD Protection Machine Model ESD Protection Storage Temperature Range (Note 4) Internal Limited A 150 °C -65 to +150 °C 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C) Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter VIN Input Voltage Relative to GND IOUT Output Current TA Operating Ambient Temperature AP2331 Document Number: DS35529 Rev. 5 - 2 2 of 12 www.diodes.com Min Max Units 2.7 5.2 V 0 0.2 A -40 +85 °C September 2014 © Diodes Incorporated AP2331 Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.) Symbol VUVLO IQ IREV RDS(ON) ILIMIT NEW PRODUCT IOS IROCP TTRIG VOVP Parameter Test Conditions (Note 5) Min Input UVLO VIN rising Input quiescent current Above UVLO, IOUT = 0 Reverse leakage current VIN = 0V, VOUT = 5V, IREV at VIN Switch on-resistance VIN = 5V, IOUT = 0.2A 100 Over-load current limit VIN = 5V, VOUT = 4V Short-circuit current OUT shorted to ground Output over-voltage trip point (Note 7) Max Unit 2.65 V 85 125 µA 0.01 0.10 µA 250 350 mΩ 0.3 0.4 0.5 A 0.3 0.4 0.5 A 0.20 0.25 A 0.7 1.0 ms 5.6 V Reverse-current trigger point VIN = 5.0V, VOUT = 5.2V Deglitch time from reverse current trigger to (Note 6) MOSFET turn off Typ 2.35 0.5 5.3 VREC Debounce time from output over-voltage to MOSFET turn off Recovery after turn-off from ROCP and OVP TON Output turn-on time (Note 8) CL = 0.1µF, RLOAD = 20Ω (UVLO to 90% VOUT-NOM) 0.7 TSHDN Thermal shutdown threshold VIN = 2.7V to 5.2V 150 °C THYS Thermal shutdown hysteresis 20 °C 215 °C/W SC59 255 °C/W U-DFN2020-3 180 °C/W TOVP SOT23 θJA Notes: Thermal Resistance Junction-to-Ambient (Note 9) 15 µs 101% VIN ms 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 6. When reverse current triggers at IROCP = 0.20A, the reverse current is continuously clamped at IROCP for 0.7ms deglitch time until MOSFET is turned off. 7. During output over-voltage protection, the output draws approximately 60µA current. 8. Since the output turn-on slew rate is dependent on input supply slew rate, this limit is only applicable for input supply slew rate between VIN/0.2ms to VIN/1ms. 9. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. AP2331 Document Number: DS35529 Rev. 5 - 2 3 of 12 www.diodes.com September 2014 © Diodes Incorporated AP2331 Typical Performance Characteristics UVLO Decreasing 1ms/div 5ms/div Over-Load Current Limit Short-Circuit Current Limit NEW PRODUCT UVLO Increasing 5ms/div 100µs/div Deglitch Time from Reverse-Current Trigger to MOSFET Turn-Off Reverse-Current Limit 550µs 200mA 200µs/div 200µs/div AP2331 Document Number: DS35529 Rev. 5 - 2 4 of 12 www.diodes.com September 2014 © Diodes Incorporated AP2331 Typical Performance Characteristics (cont.) Output Over-Voltage Trip Point NEW PRODUCT OVP at 5.4V Output Turn-On Time OVP recovery at 5.1V CL=0.1µF Rload=20Ω 10ms/div 200µs/div 140 SUPPLY CURRENT (µA) 120 SHORT CIRCUIT CURRENT (mA) 0.408 VIN = 5V VIN = 5.2V 100 80 VIN = 2.7V 60 VIN = 3.3V 40 20 0.406 0.402 VIN = 3.3V 0.400 0.398 0.396 0.394 0.392 0.390 0 -40 VIN = 2.7V 0.404 0.388 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE (°C) Fig. 1 Quiescent Supply Current vs. Ambient Temperature VIN = 5V, VIN = 5.2V CL = 10µF 40 60 80 20 -20 0 AMBIENT TEMPERATURE (°C) Fig. 2 Short Circuit Current Limit vs. Ambient Temperature 500 0.45 VIN = 2.7V ON-STATE RESISTANCE (mΩ) OUTPUT TURN ON-TIME (ms) 450 0.40 0.35 0.30 0.25 C L = 1µF R L = 5Ω 0.20 2.5 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) Fig. 3 Output Turn On-Time vs. Input Voltage Document Number: DS35529 Rev. 5 - 2 VIN = 3.3V 350 300 250 200 VIN = 5V 150 100 VIN = 5.5V 50 3.0 AP2331 400 5 of 12 www.diodes.com 0 -40 -20 0 20 40 60 AMBIENT TEMPERATURE (°C) Fig. 4 Switch On-Resistance vs. Ambient Temperature 80 September 2014 © Diodes Incorporated AP2331 Typical Performance Characteristics (cont.) 500 REVERSE CURRENT LIMIT (mA) 0.402 SUPPLY CURRENT (µA) NEW PRODUCT 0.400 0.398 0.396 0.394 0.392 0.390 0.388 -40 450 VIN = 2.7V 400 350 300 250 200 150 100 50 0 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE (°C) Fig. 5 Current Limit Trip Threshold vs. Ambient Temperature AP2331 Document Number: DS35529 Rev. 5 - 2 6 of 12 www.diodes.com VIN = 3.3V VIN = 5V 60 -20 0 20 40 AMBIENT TEMPERATURE (°C) Fig. 6 Reverse Current Limit vs. Ambient Temperature 80 September 2014 © Diodes Incorporated AP2331 Application information Under-Voltage Lockout (UVLO) Under-voltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions only when the power supply has reached at least 2.5V (TYP). Whenever the input voltage falls below approximately 2.5V, the power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. NEW PRODUCT Over-Current and Short-Circuit Protection An internal sensing FET is employed to check for over current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an over current condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. The different overload conditions and the corresponding response of the AP2331 are outlined below: S.NO 1 Conditions Short-circuit condition at start-up Explanation Output is shorted before input voltage is applied or before the part is powered up. 2 Short-circuit or Over current condition Short-Circuit or Overload condition that occurs when the part is powered up and above UVLO. 3 Gradual increase from nominal operating current to ILIMIT Load increases gradually until the current-limit threshold. Behavior of the AP2331 The IC senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. The current rises until ILIMIT. Once the threshold has been reached, the device switches into its current limiting mode and is clamped at ILIMIT. Reverse-Current Protection The USB specification does not allow an output device to source current back into the USB port. In a normal MOSFET switch, current will flow in reverse direction (from the output side to the input side) when the output side voltage is higher than the input side. A reverse current limit feature is implemented in the AP2331 to limit such back currents. Reverse current limit is always active in AP2331. Reverse current is limited at IROCP level and when the fault exists for more than 700µs, output device is disabled and shut down. This is called the "Deglitch time from reverse current trigger to MOSFET turn off.” Recovery from IROCP occurs when the output voltage falls to 101% of input voltage. Over-Voltage Protection The device has an output over-voltage protection that triggers when the output voltage reaches 5.3V (MIN). When this fault condition stays on for longer than 15µs, (This is called the “Debounce time from output over voltage to MOSFET turn off”) output device is disabled and shut down. Recovery from ROVP occurs when the output voltage falls to 101% of input voltage. Thermal Protection Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or shortcircuit faults are present for extended periods of time. The AP2331 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +150°C, the Thermal protection feature gets activated as follows: The internal thermal sense circuitry turns the power switch off thus preventing the power switch from damage. Hysteresis in the thermal sense circuit allows the device to cool down to approximately +20°C before the output is turned back on. This built-in thermal hysteresis feature is an excellent feature, as it avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the load fault is removed, resulting in a pulsed output. Discharge Function When input voltage falls below UVLO, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge resistance of 800Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the resistance and the output capacitor. Discharge time is calculated when UVLO falling threshold is reached to output voltage reaching 300mV. AP2331 Document Number: DS35529 Rev. 5 - 2 7 of 12 www.diodes.com September 2014 © Diodes Incorporated AP2331 Application information (cont.) Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON) × I2 Finally, calculate the junction temperature: TJ = PD x RθJA + TA NEW PRODUCT Where: TA= Ambient Temperature °C RθJA = Thermal Resistance PD = Total Power Dissipation Ordering Information AP 2331 X - 7 Package SA : SOT23 W : SC59 FJ : DFN2020 Packing 7 : Tape & Reel 7” Tape and Reel Part Number Suffix Part Number Package Code Packaging (Note 10) Quantity AP2331SA-7 AP2331W-7 AP2331FJ-7 SA W FJ SOT23 SC59 U-DFN2020-3 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel Note: -7 -7 -7 10. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. Marking Information (1) SOT23 ( Top View ) 3 XX Y W X 2 1 Device AP2331SA-7 (2) XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal code Package SOT23 Identification Code KJ SC59 ( Top View ) 3 XX Y W X 1 Device AP2331W-7 AP2331 Document Number: DS35529 Rev. 2 - 2 2 XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal code Package SC59 8 of 12 www.diodes.com Identification Code KN September 2014 © Diodes Incorporated AP2331 Marking Information (3) U-DFN2020-3 ( Top View ) IN XX YW X 3 IN 3 1 2 GND OUT DFN2020-3 NEW PRODUCT XX YWX 1 2 GND OUT DFN2020 -3 Device AP2331FJ-7 XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal code Package U-DFN2020-3 Identification Code FJ Package Information Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (1) SOT23 A B C H K M K1 D J F L G SOT23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.903 1.10 1.00 K1 0.400 L 0.45 0.61 0.55 M 0.085 0.18 0.11 0° 8° α All Dimensions in mm (2) SC59 A SC59 Min Max Typ 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 G 1.90 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 0° 8° α All Dimensions in mm Dim A B C G H K J M N D AP2331 Document Number: DS35529 Rev. 5 - 2 L 9 of 12 www.diodes.com September 2014 © Diodes Incorporated AP2331 Package Information (cont.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (3) U-DFN2020-3 A A3 A1 Seating Plane U-DFN2020-3 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.152 b 0.20 0.30 0.25 D 1.950 2.075 2.00 D2 1.10 1.30 1.20 D3 0.325 REF e 0.50 E 1.950 2.075 2.00 E2 0.80 1.00 0.90 E3 0.138 REF L 0.35 0.45 0.40 All Dimensions in mm D NEW PRODUCT D2 L R0 .20 0 Pin #1 ID E E3 E2 D3 b L e Suggested Pad Layout Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (1) SOT23 Y Z C X Dimensions Value (in mm) Z 3.4 X 0.8 Y 1.0 2.4 C 1.35 E E (2) SC59 Y Z C X AP2331 Document Number: DS35529 Rev. 5 - 2 Dimensions Z X Y C E Value (in mm) 3.4 0.8 1 2.4 1.35 E 10 of 12 www.diodes.com September 2014 © Diodes Incorporated AP2331 Suggested Pad Layout (cont.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (3) U-DFN2020-3 X3 X1 Y1 0 R0.05 0 .20 R0 5 .22 R0 NEW PRODUCT X2 Y2 G 0 .20 R0 Y4 Y3 Y X AP2331 Document Number: DS35529 Rev. 5 - 2 Dimensions C G X X1 X2 X3 Y Y1 Y2 Y3 Y4 Value (in mm) 1.000 0.150 0.350 0.450 1.400 1.724 0.600 0.450 1.100 0.450 2.300 C 11 of 12 www.diodes.com September 2014 © Diodes Incorporated AP2331 IMPORTANT NOTICE NEW PRODUCT DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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