HALOGEN PS04LTVA1 ESD Suppressor PolySurg™ LTV Series Pb HF FREE Applications • • • • • • • • • Satellite / digital radio • Mobile phones • GSM Modules • HDTV Equipment • A/V Equipment DMB Modules Test and measurement equipment Portable game systems Personal media players Security equipment Broadband network equipment Other RF applications High speed data ports - USB 2.0/3.0 - IEEE 1394 - HDMI - DVI - High speed ethernet Packaging Surface Mount Device • 10,000 pieces in paper tape on 7 inch diameter (178mm) reel. Ordering Information Description The PolySurg™ PS04LTVA ESD Suppressors protect valuable high-speed data circuits with sensitive ICs from ESD damage without distorting data signals as a result of its ultra-low (0.05pF typical) capacitance. Catalog Number Description PS04LTVA1 Features 10,000 pieces in paper tape on 7 inch diameter (178mm) reel, tin plating • Low trigger voltage and clamping voltage delivers enhanced ESD protection of very sensitive ICs • Ultra-low capacitance (0.05pF typ.) ideal for high speed data applications • Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test • Single line, bidirectional device for placement flexibility • Low profile 0402/1005 design for board space savings • Low leakage current (<0.1nA typ.) reduces power consumption • RoHS compliant, halogen free and lead free for global acceptance • Tin-plated (Sn) version available • Tested to meet automotive specifications (AEC-Q200) Device Marking Specifications Performance Characteristics Value Rated voltage 5Vdc typical, 12Vdc maximum Clamping voltage1 25V typical Trigger voltage 150V typical 2 Capacitance @ 1MHz 0.05pF typical, 0.15pF maximum Attenuation change (0-20GHz) -0.2dB typical Leakage current @ 12Vdc <0.1nA typical ESD Capability - IEC 61000-4-2 Direct Discharge - IEC 61000-4-2 Air Discharge 8kV typical 15kV typical ESD pulse withstand 1 >1000 pulses typical PolySurg™ ESD Suppressors are marked on the tape and reel packages, not individually. Since the product is bi-directional and symmetrical, no orientation marking is required. Design Consideration The location in the circuit for the LTV series has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground). 1. Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A) measured 30nS after initiation of pulse. 2. Trigger measurement made using Transmission Line Pulse (TLP) method. 3. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate. 0510 BU-SB10613 Page 1 of 2 Data Sheet 4083 Environmental Specifications: • • • • • • • • High Temperature Exposure: MIL-STD-202 Method 108 Temperature Cycling: 1000 Air to Air cycles -40°C to +125°C JESD22 Method JA-104 Moisture Resistance Test: MIL-STD-202 Method 106G, 10 cycles Biased Humidity: MIL-STD-202 Method 103, 1,000hours +85°C, 85%RH Thermal Shock: MIL-STD-202, Method 107G Air-to-Air -55°C to +125°C, 10 cycles Vibration Test and Mechanical Shock Test: MIL-STD-202 Method 204 and Method 213 Resistance to Solvent: MIL-STD-202 Method 215 Operating and Storage Temperature Range: -55°C to +125°C Soldering Recommendations Dimensions - mm (in) • Compatible with lead and lead-free solder reflow processes • Peak reflow temperatures and durations: - IR Reflow = 260°C max for 10 sec. max - Wave Solder = 260°C max. for 10 sec. max • Recommended IR Reflow Profile: Recommended Pad Layout - mm (in) 0.40 (0.016) 0.70 (0.028) 2.20 (0.087) The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2010 Cooper Bussmann St. Louis, MO 63178 www.cooperbussmann.com 0410 BU-SB10613 Page 2 of 2 Data Sheet 4083