0603ESDA2-TR2 ESD Suppressor PolySurg™ Series HALOGEN HF Pb FREE Applications • • • • • • • • Computers and peripherals Blu-Ray/DVD players Satellite and HD radio PDAs Digital camcorders Set top Boxes DSL Modems High speed data ports - USB 2.0/3.0 - High speed ethernet - Infiniband® Part Numbering System: Surface Mount Device • • • • • • • HDTV Equipment A/V Equipment Cell phones Digital still cameras MP3 / Multimedia players External storage GPS - IEEE 1394 - DVI - HDMI 0603 ESDA 2 TR2 Package size Product family Second generation designator Packaging code Description Packaging The second generation PolySurg™ 0603ESDA2-TR2 ESD Suppressors protect valuable high-speed data circuits from ESD damage without distorting data signals as a result of its ultra-low (0.15pF maximum) capacitance. • 5000 pieces in paper tape on 7 inch diameter (178mm) reel per EIA Standard 481. Packaging Code Features • • • • • • • • Lead free, halogen free materials 0603/1608 footprint surface mount device Ideal ESD protection for high frequency, low voltage applications Exceeds testing requirements of IEC 61000-4-2 Ultra low capacitance (0.15pF maximum) Very low leakage current Fast response time Bi-directional Package Code Suffix Description -TR2 Device Marking PolySurg™ ESD Suppressors are marked on the tape and reel packages, not individually. Since the product is bi-directional and symmetrical, no orientation marking is required. Specifications Performance Characteristics Continuous Operating Voltage Clamping Voltage1 Trigger Voltage2 ESD Threat Voltage Capability Capacitance (@ 1MHz) Leakage Current (@ 12Vdc) Peak Current Operating Temperature ESD Pulse Withstand Units Vdc V V kv pF nA A °C # Pulses Min --------55 20 Typ 14 35 350 8 0.10 <0.1 30 Typ. +25 >500 Max 30 60 -15 0.15 100 45 +105 -- 1. Per IEC 61000-4-2, 30A @ 8kV, Level 4, contact discharge, measurement made 30ns after initiation of pulse. 2. Trigger measurement made using Transmission Line Pulse (TLP) method. 0612 BU-SB12433 5000 pieces in paper tape on 7 inch diameter (178mm) reel per EIA Standard 481 Design Consideration The location in the circuit for the 0603ESDA2-TR2 Series has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground). Processing Recommendations The 0603ESDA2-TR2 Series currently has a convex profile on the top surface of the part. This profile is a result of the construction of the device. They can be processed using standard pick-and-place equipment. The placement and processing techniques for these devices are similar to those used for chip resistors and chip capacitors. Page 1 of 2 Data Sheet 4419 Environmental Specifications: Soldering Recommendations • Coating bond strength: ASTM D3359-83, Method A, Section 6. Note: the device coating is not scored. • Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H2O, detergent solution, defluxer). • Humidity(steady state): MIL-STD-883, method 1004.7, 85% RH, 85°C, 240 hrs. • Thermal shock: MIL-STD-202F, method 107G, -65°C to 125°C, 30 min, 5 cycles. • Vibration: MIL-STD-202F,method 201A,(10 to 55 to 10Hz, 1 minute cycle, 2 hrs. each in X-Y-Z axis). • Solder leach resistance and terminal adhesion per EIA-567. • Solderability per MIL-STD-202, Method 208 (95% coverage). • Full load voltage: 14.4Vdc, 1000hrs., 25°C. • Operating temperature characteristics: Electrical testing at +105°C and -55°C. • Compatible with lead and lead-free solder reflow processes • Peak temperatures and durations: - IR Reflow = 260°C max for 30 sec. max. Capable of 3X reflow. - Wave Solder = 260°C max. for 10 sec. max. - Hand Soldering = 350°C max. for 5 sec. max. T 0603ESDA Tc -5°C Supplier tp W H T Recommended Pad Layout - in (mm) User tp Tp tp Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TL Tc -5°C t Tsmax Preheat Area Tsmin ts 25 Time 25°C to Peak Time Peak package body temperature (Tp)* 1.60±0.15 0.80±0.10 0.60±0.10 0.31±0.21 (0.063±0.006) (0.031±0.004) (0.024±0.004) (0.012±0.008) - User Tp < Tc Tc Profile Feature Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to Tp) Liquidous temperature (TL) Time at liquidous (tL) W L - H L EIA Size Supplier Tp > Tc Te m p e r a t u r e Dimensions - mm (in) Recommended IR Reflow Profile Sn-Pb Eutectic Assembly Pb-Free Assembly 100°C 150°C 60-120 seconds 3°C/second max. 183°C 60-150 seconds See classification temp in Table 4.1 20** seconds 150°C 200°C 60-120 seconds 3°C/second max. 217°C 60-150 seconds See classification temp in Table 4.2 30** seconds Time (tp)** within 5°C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) 6°C/second max. 6°C/second max. Time 25°C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Tape and Reel Specifications - mm (in) (per IPC-SM-782 ) 0.60min (0.023 min) 1.1 ref (0.043 ref) 1.0 max (0.039 max) The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2012 Cooper Bussmann www.cooperbussmann.com 0612 BU-SB12433 Page 2 of 2 Data Sheet 4419