NCP51199, NCV51199 DDR 2-Amp Source / Sink VTT Termination Regulator The NCP/NCV51199 is a linear regulator designed to supply a regulated VTT termination voltage for DDR−2 and DDR−3 memory applications. The regulator is capable of actively sourcing and sinking ±2 A peak currents for DDR−2, and DDR−3 up to ±1.5 A while regulating the VTT output voltage to within ±10 mV. The output termination voltage is regulated to track VDDQ / 2 by two external voltage divider resistors connected to the PVCC, GND, and VREF pins. The NCP/NCV51199 incorporates a high−speed differential amplifier to provide ultra−fast response to line and load transients. Other features include source/sink current limiting, soft−start and on−chip thermal shutdown protection. http://onsemi.com MARKING DIAGRAM 8 8 1 XXXXXX ALYW G SOIC8−NB EP PD SUFFIX CASE 751BU 1 Features • • • • • • • • • • Supports DDR−2 VTT Termination to ±2 A, DDR−3 to ±1.5 A (peak) Stable with 10 mF Ceramic Capacitance on VTT Output Integrated Power MOSFETs High Accuracy VTT Output at Full−Load Fast Transient Response Built−in Soft−Start Shutdown for Standby or Suspend Mode Integrated Thermal and Current−Limit Protection NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant • SDRAM Termination Voltage for DDR−2 / DDR−3 • Motherboard, Notebook, and VGA Card Memory Termination • Set Top Box, Digital TV, Printers March, 2014 − Rev. 2 PIN CONNECTION PVCC 1 8 GND VREF NC NC VCC NC VTT SOIC−8 EP Typical Applications © Semiconductor Components Industries, LLC, 2014 XXXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package 1 ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. Publication Order Number: NCP51199/D NCP51199, NCV51199 NCP51199 PVCC = 1.5 to 5.0 V* 1 PVCC VCC C2 R2 100k 5V 6 C3 2 GND 3 VREF VTT = 0.75 to 2.5 V* 4 C1 R1 100k Enable VTT C4 R3 *For DDR2: PVCC = 1.8 V, VTT = 0.9 V DDR3: PVCC = 1.5 V, VTT = 0.75 V C1 = 1 mF (Low ESR) C2 = 470 mF (Low ESR) C3 = 47 mF C4 = 1000 mF + 10 mF (10 mF ceramic) R3 = Optional VTT discharge resistor N−ch MOSFET = Optional Enable / Disable Figure 1. Application Diagram PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 PVCC Input voltage which supplies current to the output pin. CIN = 470 mF with low ESR. 2 GND Common Ground 3 VREF Buffered reference voltage input equal to ½ of VDDQ and active low shutdown pin. An external resistor divider dividing down the PVCC voltage creates the regulated output voltage. Pulling the pin to ground (0.15 V maximum) turns the device off. 4 VTT Regulator output voltage capable of sourcing and sinking current while regulating the output rail. COUT = 1000 mF + 10 mF ceramic with low ESR. 5 NC True No Connect 6 VCC The VCC pin is a 5 V input pin that provides internal bias to the controller. PVCC should always be kept lower or equal to VCC. 7 NC True No Connect 8 NC True No Connect EP Thermal Pad Pad for thermal connection. The exposed pad must be connected to the ground plane using multiple vias for maximum power dissipation performance. http://onsemi.com 2 NCP51199, NCV51199 ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit PVCC, VCC −0.3 to 6 V Output Voltage Range VTT −0.3 to 6 V Reference Input Range VREF −0.3 to 6 V Maximum Junction Temperature TJ(max) 125 °C Storage Temperature Range TSTG −65 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2 kV ESD Capability, Machine Model (Note 2) ESDMM 150 V TSLD 260 °C Input Supply Voltage Range (Vcc w PVCC) (Note 1) Lead Temperature Soldering Reflow (SMD Styles Only), Pb−Free Versions (Note 3) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78 3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D THERMAL CHARACTERISTICS Rating Thermal Characteristics, SO8−EP (Note 4) Thermal Resistance, Junction−to−Air (Note 5) Power Rating at 25°C Ambient = 1.19 W, derate 12 mW/°C Thermal Reference, Junction−to−Lead2 (Note 5) Symbol Value RqJA 84 RYJL 20 Unit °C/W 4. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. OPERATING RANGES (Note 6) Rating Symbol Min Max Unit PVCC 1.5 5.5 V VCC 4.75 5.25 V Ambient Temperature TA −40 85 °C Junction Temperature TJ −40 125 °C Input Voltage Bias Supply Voltage 6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. http://onsemi.com 3 NCP51199, NCV51199 ELECTRICAL CHARACTERISTICS PVCC = 1.8 V / 1.5 V; VCC = 5 V; VREF = 0.9 V / 0.75 V; COUT = 10 mF (Ceramic); TA = +25°C, unless otherwise noted. Parameter Test Conditions Symbol Min Typ Max Unit Iout = 0 A VOS −20 − +20 mV VREF = 900 mV, Iout = ±1.8 A, PVCC = 1.8 V VREF = 750 mV, Iout = ±1.4 A, PVCC = 1.5 V Regload −10 − +10 Iout = 0 A IBIAS − 0.8 2.5 mA VREF < 0.2 V (Shutdown), RLOAD = 180W ISTB − 1 90 mA 2.0 − 3.5 1.5 − 3.5 REGULATOR OUTPUT Output Offset Voltage Load Regulation mV INPUT AND STANDBY CURRENTS Bias Supply Current Standby Current CURRENT LIMIT PROTECTION Current Limit PVCC = 1.8 V, VREF = 0.9 V PVCC = 1.5 V, VREF = 0.75 V ILIM A SHUTDOWN THRESHOLDS Enable VIH 0.6 − − Shutdown VIL − − 0.15 Thermal Shutdown Temperature VCC = 5 V TSD 160 168 176 °C Thermal Shutdown Hysteresis VCC = 5 V TSH 35 35 40 °C Shutdown Threshold Voltage V THERMAL SHUTDOWN http://onsemi.com 4 NCP51199, NCV51199 TYPICAL CHARACTERISTICS 0.915 0.770 PVCC = 1.8 V, VCC = 5 V OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 0.905 0.900 0.895 0.890 0.885 0.880 −50 0.760 0.755 0.750 0.745 0.740 0.735 −25 0 25 50 75 100 125 0.730 −50 25 50 75 100 Figure 2. Output Voltage vs. Temperature Figure 3. Output Voltage vs. Temperature 125 1.2 PVCC = 1.8 V, VCC = 5 V VCC = 5 V 1.0 VCC CURRENT (mA) SHUTDOWN THRESHOLD (V) 0 TEMPERATURE (°C) 0.50 0.45 Enabled 0.40 0.35 Shutdown 0.30 0.8 0.6 0.4 0.25 0.20 −50 −25 0 25 50 75 100 0.2 −50 125 0 25 50 75 100 TEMPERATURE (°C) Figure 4. Shutdown Threshold vs. Temperature Figure 5. VCC Current vs. Temperature 125 3.5 SOURCE CURRENT LIMIT (A) PVCC = 1.8 V, VCC = 5 V 2.5 2.0 1.5 1.0 0.5 0 −50 −25 TEMPERATURE (°C) 3.0 PVCC CURRENT (mA) −25 TEMPERATURE (°C) 0.60 0.55 PVCC = 1.5 V, VCC = 5 V 0.765 0.910 −25 0 25 50 75 100 3.0 2.5 2.0 1.5 0.5 0 −50 125 PVCC = 1.8 V, VCC = 5 V PVCC = 1.5 V, VCC = 5 V 1.0 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 6. PVCC Current vs. Temperature Figure 7. Source Current Limits vs. Temperature http://onsemi.com 5 125 NCP51199, NCV51199 TYPICAL CHARACTERISTICS 20 VTT, TRANSIENT RESPONSE (mV) SINK CURRENT LIMIT (A) 3.5 3.0 2.5 2.0 1.5 PVCC = 1.8 V, VCC = 5 V PVCC = 1.5 V, VCC = 5 V 1.0 0.5 0 −50 15 10 5 0 −5 −10 −15 −20 −25 0 25 50 75 100 125 TEMPERATURE (°C) TIME (100 msec / div) Figure 8. Sink Current Limits vs. Temperature Figure 9. 1.25 V, +1.6 A Transient Response Table 1. ORDERING INFORMATION Marking Package Shipping † NCP51199PDR2G 51199 NCV51199PDR2G* V51199 SOIC−8 (Pb-Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 6 NCP51199, NCV51199 PACKAGE DIMENSIONS SOIC8−NB EP CASE 751BU ISSUE B D A 8 NOTE 5 F 2X 0.10 C D 5 NOTE 6 A1 E E1 NOTE 4 L2 L 2X 4 TIPS 0.20 C 4 1 NOTE 5 8X B TOP VIEW b 0.25 M C A-B D 2X 0.10 C A-B NOTE 4 D 0.10 C DETAIL A 8X 0.10 C A SEATING PLANE C DETAIL A h B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.10mm IN EXCESS OF MAXIMUM MATERIAL CONDITION. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. DIMENSION E DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25mm PER SIDE. DIMENSIONS D AND E ARE DETERMINED AT DATUM F. 5. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM F. 6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 7. TAB CONTOUR MAY VARY MINIMALLY TO INCLUDE TOOLING FEATURES. DIM A A1 b b1 c c1 D E E1 e F G h L L2 B e C SIDE VIEW END VIEW SEATING PLANE b NOTE 7 ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ b1 F G c c1 SECTION B−B MILLIMETERS MIN MAX 1.35 1.75 −−− 0.10 0.31 0.51 0.28 0.48 0.17 0.25 0.17 0.23 4.90 BSC 6.00 BSC 3.90 BSC 1.27 BSC 1.55 3.07 1.55 3.07 0.25 0.50 0.40 1.27 0.25 BSC RECOMMENDED SOLDERING FOOTPRINT BOTTOM VIEW 3.30 3.10 8X 1.52 7.00 1 8X 0.60 1.27 PITCH DIMENSION: MILLIMETERS ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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