NL27WZ14 Dual Schmitt-Trigger Inverter http://onsemi.com MARKING DIAGRAMS 6 6 1 M The NL27WZ14 is a high performance dual inverter with Schmitt−Trigger inputs operating from a 1.65 to 5.5 V supply. Pin configuration and function are the same as the NL27WZ04, but the inputs have hysteresis and, with its Schmitt trigger function, the NL27WZ14 can be used as a line receiver which will receive slow input signals. The NL27WZ14 is capable of transforming slowly changing input signals into sharply defined, jitter−free output signals. In addition, it has a greater noise margin than conventional inverters. The NL27WZ14 has hysteresis between the positive−going and the negative−going input thresholds (typically 1 V) which is determined internally by transistor ratios and is essentially insensitive to temperature and supply voltage variations. SC−88/SOT−363/SC70−6 DF SUFFIX CASE 419B MA M G G 1 Features • Designed for 1.65 V to 5.5 V VCC Operation • Over Voltage Tolerant Inputs and Outputs • LVTTL Compatible − Interface Capability with 5 V TTL Logic with VCC = 3 V • LVCMOS Compatible • 24 mA Balanced Output Sink and Source Capability • Near Zero Static Supply Current Substantially Reduces System • • • • Power Requirements Current Drive Capability is 24 mA at the Outputs Chip Complexity: FET = 72 NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant IN A1 1 6 2 GND IN A2 OUT Y1 5 3 VCC 6 6 1 TSOP−6 DT SUFFIX CASE 318G MA M G MA M G G 1 = Device Marking = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT Pin Function 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 OUT Y2 4 FUNCTION TABLE Figure 1. Pinout (Top View) IN A1 1 OUT Y1 IN A2 1 OUT Y2 A Input Y Output L H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2013 March, 2013 − Rev. 13 1 Publication Order Number: NL27WZ14/D NL27WZ14 MAXIMUM RATINGS Symbol VCC Characteristics DC Supply Voltage Value Units −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage, Output in Z or LOW State (Note 1) −0.5 ≤ VO ≤ +7.0 V IIK DC Input Diode Current, VI < GND −50 mA IOK DC Output Diode Current, VO < GND −50 mA IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C PD Power Dissipation in Still Air; SC−88, TSOP−6 200 mW qJA Thermal Resistance; SC−88, TSOP−6 333 °C/W TL Lead Temperature, 1 mm from case for 10 s 260 °C TJ Junction Temperature under Bias +150 °C VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A ILATCHU Latchup Performance Above VCC and Below GND at 125°C (Note 5) V mA ±100 P Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A 3. Tested to EIA/JESD22−A115−A 4. Tested to JESD22−C101−A 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage Operating Data Retention Only Min Max 1.65 1.5 5.5 5.5 Units V VI Input Voltage 0 5.5 V VO Output Voltage (High or LOW State) 0 5.5 V TA Operating Free−Air Temperature −55 +125 Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V VCC =3.0 V ±0.3 V VCC =5.0 V ±0.5 V 0 0 0 No Limit No Limit No Limit °C ns/V ORDERING INFORMATION Package Shipping† NL27WZ14DFT2G SC−88/SOT−363/SC70−6 (Pb−Free) 3000 / Tape & Reel NLV27WZ14DFT2G* SC−88/SOT−363/SC70−6 (Pb−Free) 3000 / Tape & Reel TSOP−6 (Pb−Free) 3000 / Tape & Reel Device NL27WZ14DTT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 2 NL27WZ14 DC ELECTRICAL CHARACTERISTICS VCC Condition TA = 25°C −40°C 3 TA 3 85°C −55°C 3 TA 3 125°C Symbol Parameter (V) Min Typ Max Min Max Min Max Units VT) Positive Input Threshold Voltage 2.3 2.7 3.0 4.5 5.5 1.0 1.2 1.3 1.9 2.2 1.5 1.7 1.9 2.7 3.3 1.8 2.0 2.2 3.1 3.6 1.0 1.2 1.3 1.9 2.2 1.8 2.0 2.2 3.1 3.6 1.0 1.2 1.3 1.9 2.2 1.8 2.0 2.2 3.1 3.6 V VT* Negative Input Threshold Voltage 2.3 2.7 3.0 4.5 5.5 0.4 0.5 0.6 1.0 1.2 0.75 0.87 1.0 1.5 1.9 1.15 1.4 1.5 2.0 2.3 0.4 0.5 0.6 1.0 1.2 1.15 1.4 1.5 2.0 2.3 0.4 0.5 0.6 1.0 1.2 1.15 1.4 1.5 2.0 2.3 V VH Input Hysteresis Voltage 2.3 2.7 3.0 4.5 5.5 0.25 0.3 0.4 0.6 0.7 0.75 0.83 0.93 1.2 1.4 1.1 1.15 1.2 1.5 1.7 0.25 0.3 0.4 0.6 0.7 1.1 1.15 1.2 1.5 1.7 0.25 0.3 0.4 0.6 0.7 1.1 1.15 1.2 1.5 1.7 V VOH High−Level Output Voltage IOH = −100 mA IOH = *3 mA IOH = *8 mA IOH = *12 mA IOH = *16 mA IOH = *24 mA IOH = *32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.52 2.1 2.4 2.7 2.5 4.0 IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VIN = VIH or VIL VOL Low−Level Output Voltage VIN = VIH or VIL IIN VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 0.08 0.2 0.22 0.28 0.38 0.42 VCC − 0.1 1.29 1.8 2.1 2.3 2.2 3.7 V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.4 0.5 0.5 0.55 0.65 V Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 ±1.0 mA IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0 1 10 10 mA ICC Quiescent Supply Current VIN = 5.5 V or GND 5.5 1 10 10 mA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) TA = 25°C Symbol tPLH tPHL −55°C 3 TA 3 125°C Condition VCC (V) RL = 1 MW, CL = 15 pF 2.5 ± 0.2 1.8 4.3 7.4 1.8 8.1 1.8 9.1 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 3.3 ± 0.3 1.5 1.8 3.3 4.0 5.0 6.0 1.5 1.8 5.5 6.6 1.5 1.8 6.5 7.6 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 ± 0.5 1.0 1.2 2.7 3.2 4.1 4.9 1.0 1.2 4.5 5.4 1.0 1.2 5.5 6.4 Parameter Propagation Delay Input A to Y (Figure 3 & 4) −40°C 3 TA 3 85°C Min Typ Max Min Max Min Max Units ns CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.0 V, VI = 0 V or VCC 11 12.5 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin ) ICC VCC. http://onsemi.com 3 NL27WZ14 VCC A or B VCC 50% GND tPLH Y PULSE GENERATOR DUT tPHL RT CL RL 50% VCC RT = CL or equivalent (includes jog and probe capacitance) RT = ZOUT of pulse generator (typically 50 W) VT , TYPICAL INPUT THRESHOLD VOLTAGE (VOLTS) Figure 3. Switching Waveforms Figure 4. Test Circuit 4 3 (VT)) 2 VHtyp (VT*) 1 2 2.5 3.5 3 VCC, POWER SUPPLY VOLTAGE (VOLTS) VHtyp = (VT) typ) − (VT* typ) 3.6 Figure 5. Typical Input Threshold, VT), VT* versus Power Supply Voltage VH Vin VCC VCC VH VT) VT* VT) VT* Vin GND GND VOH VOH Vout Vout VOL VOL (a) A Schmitt−Trigger Squares Up Inputs With Slow Rise and Fall Times (b) A Schmitt−Trigger Offers Maximum Noise Immunity Figure 6. Typical Schmitt−Trigger Applications http://onsemi.com 4 NL27WZ14 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y 2X aaa H D D A D 6 5 GAGE PLANE 4 2 L L2 E1 E 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END. 4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. H DETAIL A 3 aaa C 2X bbb H D 2X 3 TIPS e B 6X ddd TOP VIEW A2 A 6X ccc C A1 SIDE VIEW DIM A A1 A2 b C D E E1 e L L2 aaa bbb ccc ddd b C M C A-B D DETAIL A SEATING PLANE END VIEW c MILLIMETERS MIN NOM MAX −−− −−− 1.10 0.00 −−− 0.10 0.70 0.90 1.00 0.15 0.20 0.25 0.08 0.15 0.22 1.80 2.00 2.20 2.00 2.10 2.20 1.15 1.25 1.35 0.65 BSC 0.26 0.36 0.46 0.15 BSC 0.15 0.30 0.10 0.10 RECOMMENDED SOLDERING FOOTPRINT* 6X 6X 0.30 0.66 2.50 0.65 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 INCHES MIN NOM MAX −−− −−− 0.043 0.000 −−− 0.004 0.027 0.035 0.039 0.006 0.008 0.010 0.003 0.006 0.009 0.070 0.078 0.086 0.078 0.082 0.086 0.045 0.049 0.053 0.026 BSC 0.010 0.014 0.018 0.006 BSC 0.006 0.012 0.004 0.004 NL27WZ14 PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE V D H 6 E1 5 ÉÉÉ 1 NOTE 5 2 L2 4 GAUGE PLANE E 3 L b C DETAIL Z e 0.05 M A SEATING PLANE c A1 DETAIL Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. DIM A A1 b c D E E1 e L L2 M MIN 0.90 0.01 0.25 0.10 2.90 2.50 1.30 0.85 0.20 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 2.75 3.00 1.50 1.70 0.95 1.05 0.40 0.60 0.25 BSC 10° − RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 6X 3.20 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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