1SMF5920B 2.5 Watt Zener Diode in Flat Lead Package This complete new line of 2.5 Watt Zener Diodes are offered in highly efficient micro miniature and space saving surface mount design. Because of its small size, it is ideal for use in cellular phones, portable devices, business machines and many other industrial/ consumer applications. Features • • • • • • • • • Zener Breakdown Voltage: 6.2 V Low Leakage < 5 mA ESD Rating of Class 3 (> 16 kV) per Human Body Model Small Footprint − Footprint Area of 8.45 mm2 Low Profile − Maximum Height of 1.0 mm Supplied in 8 mm Tape and Reel − 3,000 Units per Reel Cathode Indicated by Polarity Band Lead Orientation in Tape: Cathode Lead to Sprocket Holes These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com PLASTIC SURFACE MOUNT 2.5 WATT ZENER DIODE 6.2 VOLTS 1 2 1: CATHODE 2: ANODE SOD−123FL CASE 498 Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic MARKING DIAGRAM Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any 1 CATHODE QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements 5Y2M G G 2 ANODE 5Y2 = Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package 1SMF5920BT1G SOD−123FL (Pb−Free) Shipping† 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2014 August, 2014 − Rev. 0 1 Publication Order Number: 1SMF5920B/D 1SMF5920B MAXIMUM RATINGS Rating DC Power Dissipation @ TA = 25°C (Note 1) Derate above 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Lead Symbol Value Unit °PD° RqJA 350 2.9 350 °mW mW/°C °C/W RqJL 30 °C/W °PD 2.5 W TJ, Tstg −55 to +150 °C Maximum DC Power Dissipation (Notes 1 and 2) Operating and Storage Temperature Range Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Mounted with recommended minimum pad size, PC board FR−4. 2. At lead temperature 75°C ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 1.5 V Max. @ IF = 200 mA for all types) IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP IR IF Parameter Symbol VRWM I VC VBR VRWM V IR VF IT Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF IPP Uni−Directional TVS ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA) Zener Voltage (Note 3) VZ @ IZT (Volts) Device Device Marking Min Nom 1SMF5920BT1G 5Y2 5.89 6.2 VR ZZT @ IZT (Note 4) (mA) (V) 5.0 4.0 IZT IR @ VR Max (mA) 6.51 60.5 ZZK @ IZK (Note 4) IZK (W) (W) (mA) 2.0 200 1.0 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Zener voltage is measured with the device junction in thermal equilibrium with an ambient temperature of 25°C. 4. Zener Impedance Derivation ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz. http://onsemi.com 2 1SMF5920B 3.5 100 3 IZ, ZENER CURRENT (mA) P D , MAXIMUM POWER DISSIPATION (W) TYPICAL CHARACTERISTICS 2.5 2 TL 1.5 1 10 1 0.5 0 0.1 25 50 75 100 125 150 175 5 6 T, TEMPERATURE (°C) 7 8 9 10 VZ, ZENER VOLTAGE (VOLTS) Figure 2. VZ 10 8 ZZ , DYNAMIC IMPEDANCE (OHMS) qVZ, TEMPERATURE COEFFICIENT (mV/°C) Figure 1. Steady State Power Derating VZ @ IZT 6 4 2 0 −2 200 IZ(dc) = 1mA 100 70 50 −4 2 4 6 8 10 VZ, ZENER VOLTAGE (VOLTS) 30 20 10 7 5 10 mA 20 mA 3 2 5 12 7 iZ(rms) = 0.1 IZ(dc) 10 20 30 50 VZ, ZENER VOLTAGE (VOLTS) 70 100 Figure 4. Effect of Zener Voltage Figure 3. Zener Voltage 1k 10,000 TJ = 25°C iZ(rms) = 0.1 IZ(dc) 500 C, CAPACITANCE (pF) Z Z , DYNAMIC IMPEDANCE (OHMS) 11 200 100 50 20 10 5 1000 MEASURED @ 0 V BIAS MEASURED @ 50% VR 100 2 1 0.5 1 6.8 V 2 5 10 20 50 100 200 500 IZ, ZENER TEST CURRENT (mA) 10 1 10 VZ, REVERSE ZENER VOLTAGE (VOLTS) Figure 6. Capacitance versus Reverse Zener Voltage Figure 5. Effect of Zener Current http://onsemi.com 3 100 1SMF5920B PACKAGE DIMENSIONS SOD−123FL CASE 498 ISSUE D q E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. 4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. D 1 2 DIM A A1 b c D E L HE q A1 POLARITY INDICATOR OPTIONAL AS NEEDED A END VIEW TOP VIEW q HE MILLIMETERS NOM MAX 0.95 0.98 0.05 0.10 0.90 1.10 0.15 0.20 1.65 1.80 2.70 2.90 0.75 0.95 3.60 3.80 8° − MIN 0.035 0.000 0.028 0.004 0.059 0.098 0.022 0.134 0° INCHES NOM 0.037 0.002 0.035 0.006 0.065 0.106 0.030 0.142 − MAX 0.039 0.004 0.043 0.008 0.071 0.114 0.037 0.150 8° c RECOMMENDED SOLDERING FOOTPRINT* SIDE VIEW 2X 2X MIN 0.90 0.00 0.70 0.10 1.50 2.50 0.55 3.40 0° L b 2X BOTTOM VIEW 1.22 ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ 4.20 ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 2X 1.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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