High Reliability Test Specification No. Test Item 1 Solderability 2 Soldering Heat 3 4 Test Condition Dip in flux Duration= 5 sec. Temp. of solder pot = 230± 5oC, Duration= 5~10 sec. MIL-STD-750D, Method 2026.1 Ac/Rj=22/0 Temp of solder pot= 260±5oC, Duration= 10~12 sec. MIL-STD-750D, Method 2031.2 Ac/Rj=22/0 MIL-STD-750D, Method 1051.5 Ac/Rj=22/0 MIL-STD-750D, Method 1056.7 Ac/Rj=22/0 Tstg (min.) to Tstg (max.) dwelled for 30 min and Temperature Cycle transfer Duration not exceed 1min; 20 cycles. Thermal Shock Test Test Foundation Quality Level Ta1=100oC, Duration=10 min o then Ta2= 0 C, Duration=10 min for 20 cycles, transfer Duration must not exceed 5 sec. 5 Steady State I=Io Operation Life Test Duration=168/1000 hrs. MIL-STD-750D, Method 1027.3 Ac/Rj=22/0 6 VR=80%VR High Temperature Temp.= 100/125/150/175 ±5oC Reverse Bias Life (depend on product) Testing Duration= 48 /168hrs. MIL-STD-750D, Method 1038.3 Ac/Rj=22/0 7 I=Io Intermittent Forward Operation Power ON 1.5hrs/OFF 0.5hrs Life Testing Duration：500 Cycles. MIL-STD-750D, Method 1036.3 Ac/Rj=22/0 JESD22-A102 Ac/Rj=22/0 ----- Ac/Rj=22/0 MIL-STD-750D, Method 1031.5 Ac/Rj=22/0 JIS C 7021, B-11 Ac/Rj=22/0 8 9 10 11 Ta= 121oC Pressure Cooker Pressure= 15 Psi Test Duration= 4hrs Boiling 5 hours at 100oC water. High Temperature Ta=TSTG MAX. Storage Life Duration=168/1000hrs Humidity Ta= 85oC RH= 85% Duration= 168/1000 hrs