MATERIAL DATA SHEET - Comchip Technology

MATERIAL DATA SHEET
Material #
CPDFR & CPDF series(1005) (Halogen Free)
Product Line
Integrated Passive & Active Devices
Date
2014/1/27
Rev.
G
COMPONENT DETAILS
No.
1
2
3
4
5
Construction
element
FR-4 Board
Wafer
Al wire
Silver paste
Molding
Compound
Material group
Material weight
(mg)
Substrate/
Terminal
Diode
Conductor
Welding
CAS
if applicable
Average mass
(%)
Copper
7440-50-8
27.62%
Nickel
7440-02-0
4.244%
Gold
7440-57-5
0.140%
Continuous Filament Fiber Glass
65997-17-3
67.996%
Silicon
7440-21-3
97.950%
Aluminum
7429-90-5
2.0%
Titanium
7440-32-6
0.001%
Siliver
7440-57-5
0.001%
SiO2
14808-60-7
0.048%
Aluminum
7429-90-5
99%
Silicon
7440-21-3
1%
Modified Epoxy Resin
29690-82-2
5~25%
Silver
7440-22-4
76~85%
Imidazole
827-43-0
1~4%
2.716
0.057
0.002
0.012
Outer
3.762
Total weight
6.549
Comchip Technology CO., LTD.
Material
Amide
461-58-5
1~4%
Silica
60676-86-0
70~90%
Epoxy Resin
29690-82-2
6~16%
Phenolic Resin
9003-35-4
5~15%
Carbon Black
1333-86-4
0.1~1%
www.comchiptech.com.tw
TEL: +886-2-86776675
FAX: +886-2-86776672
Sum(%)
41.47
0.87
0.03
0.18
57.44
1/1
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