MATERIAL DATA SHEET - Comchip Technology

MATERIAL DATA SHEET
Material #
CPDER series(0503) (Halogen Free)
Product Line
Discrete Devices
Date
2014/1/27
Rev. date
H
COMPONENT DETAILS
No.
1
2
3
4
5
Construction
element
FR-4 Board
Wafer
Al wire
Silver paste
Molding
Compound
Material group
Material weight
(mg)
Substrate/
Terminal
Diode
Conductor
Welding
CAS
if applicable
Average mass
(%)
Copper
7440-50-8
58.86%
Nickel
7440-02-0
3.12%
Gold
7440-57-5
0.09%
Continuous Filament Fiber Glass
65997-17-3
37.93%
Silicon
7440-21-3
97.95%
Aluminum
7429-90-5
2.00%
Titanium
7440-32-6
0.00%
Siliver
7440-57-5
0.00%
0.231
0.029
0.001
0.006
Outer
1.153
Total weight
1.42
Comchip Technology CO., LTD.
Material
SiO2
14808-60-7
0.05%
Aluminium
7429-90-5
>99%
Silicon
7440-21-3
<1%
Modified Epoxy Resin
29690-82-2
5~25%
Silver
7440-22-4
76~85%
Imidazole
827-43-0
1~4%
Amide
461-58-5
1~4%
Silica
60676-86-0
70~90%
Epoxy Resin
29690-82-2
6~16%
Phenolic Resin
9003-35-4
5~15%
Carbon Black
1333-86-4
0.1~1%
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1/1
Sum(%)
16.27
2.04
0.07
0.42
81.20
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