MATERIAL DATA SHEET Material # CPDER series(0503) (Halogen Free) Product Line Discrete Devices Date 2014/1/27 Rev. date H COMPONENT DETAILS No. 1 2 3 4 5 Construction element FR-4 Board Wafer Al wire Silver paste Molding Compound Material group Material weight (mg) Substrate/ Terminal Diode Conductor Welding CAS if applicable Average mass (%) Copper 7440-50-8 58.86% Nickel 7440-02-0 3.12% Gold 7440-57-5 0.09% Continuous Filament Fiber Glass 65997-17-3 37.93% Silicon 7440-21-3 97.95% Aluminum 7429-90-5 2.00% Titanium 7440-32-6 0.00% Siliver 7440-57-5 0.00% 0.231 0.029 0.001 0.006 Outer 1.153 Total weight 1.42 Comchip Technology CO., LTD. Material SiO2 14808-60-7 0.05% Aluminium 7429-90-5 >99% Silicon 7440-21-3 <1% Modified Epoxy Resin 29690-82-2 5~25% Silver 7440-22-4 76~85% Imidazole 827-43-0 1~4% Amide 461-58-5 1~4% Silica 60676-86-0 70~90% Epoxy Resin 29690-82-2 6~16% Phenolic Resin 9003-35-4 5~15% Carbon Black 1333-86-4 0.1~1% www.comchiptech.com.tw TEL: +886-2-86776675 FAX: +886-2-86776672 1/1 Sum(%) 16.27 2.04 0.07 0.42 81.20 Traces