MATERIAL DATA SHEET Material # CDBFR & CDBF series(1005) (Halogen Free) Product Line Integrated Passive & Active Devices Date 2011/10/5 Rev. E . COMPONENT DETAILS No. 1 2 3 4 5 Construction element FR-4 Board Wafer Al wire Silver paste Molding Compound Material group Substrate/ Terminal Diode Conductor Welding Material weight (mg) 2.716 0.057 0.002 0.012 Outer 3.762 Total weight 6.549 Comchip Technology CO., LTD. Material CAS if applicable Average mass (%) Copper 7440-50-8 27.62% Nickel 7440-02-0 4.244% Gold 7440-57-5 0.140% Continuous Filament Fiber Glass 65997-17-3 68.00% Silicon 7440-21-3 92.00% Aluminum 7429-90-5 1.30% Titanium 7440-32-6 0.20% G ld Gold 7440 57 5 7440-57-5 6 50% 6.50% Aluminum 7429-90-5 99.00% Silicon 7440-21-3 1.00% Modified Epoxy Resin 29690-82-2 1~7% Silver 7440-22-4 76~85% Imidazole 827-43-0 Amide 461-58-5 5~25% Silica 60676-86-0 70~90% Epoxy Resin Trade Secret 6~16% Phenolic Resin Trade Secret 5~15% Carbon Black 1333-86-4 0.1~1% www.comchiptech.com TEL: +886-2-86776675 FAX: +886-2-86776672 1/1 Sum(%) 41.47 0.87 0.03 0.18 57.44 Traces