ROHM BD4216NUV

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STR UC T UR E
Silicon Monolithic Integrated Circuit
PRODUCT SERIES
Strobe Charge Control IC
T
BD4216NUV
Y
P
E
F u n c t i o n s
1.
2.
3.
4.
5.
6.
7.
Built-in power transistor
Adjustable transformer primary-side peak current
Standby mode switching with the START pin
Includes charge complete signal output (FULL) pin.
Includes charge voltage detection (VC) pin (can be set externally).
Built-in thermal shutdown circuit (TSD)
Built-in IGBT driver
Thermally enhanced VSON010V3030 package. (3.0mm x 3.0mm, 1.0mm pitch)
○Absolute maximum ratings(Ta=25℃)
Parameter
VCC pin
PVC pin
VC pin
START pin
ADJ pin
FULL pin
IGBT_IN pin
Operating temperature
Storage temperature range
Junction temperature
Power dissipation
Symbol
VCC
PVC
VC
START
ADJ
FULL
IGBT_IN
Limit
-0.3 to 7
50
-10 to 36
-0.3 to 7
-0.3 to 7
-0.3 to 7
-0.3 to 7
Unit
V
V
V
V
V
V
V
Topr
−35 to 85
°C
Tstg
−55 to 150
°C
Tjmax
150
1270*1
°C
Pd
mW
*1: Reduced by 10.16 mW/°C over Ta = 25°C. (When mounted on 74.2 mm  74.2 mm  1.6 mm, glass epoxy)
○Recommended operating ranges
Parameter
VCC power supply input voltage range
START pin input voltage range
ADJ pin input voltage range
IGBT_IN pin input voltage range
FULL pin input voltage range
Symbol
VCC
VSTART
VADJ
VIGBT_IN
VFULL
Limit
2.5 to 5.5
0 to VCC
0 to VCC
0 to VCC
0 to 5.5
Unit
V
V
V
V
V
◎This product is not designed for normal operation within a radioactive environment.
Status of this document
The Japanese version of this document is the official specification. Please use the translation version of this document as a reference to expedite
understanding of the official version.
If these are any uncertainty in translation version of this document, official version takes priority.
REV. A
2/4
○Electrical characteristics (Ta=25°C,VCC=START=3.3 V, VBAT=3.6V, ADJ=1.0V)
Parameter
Symbol
[Overall device]
VCC circuit current
IVCC
Circui current during standby operation
ISTB
[Standby control START pin]
START pin high voltage
VSTH
START pin low voltage
VSTL
Input bias current
ISTART
[Transformer primary-side driver block]
PVC pin leak current
IPVCL
PVC pin peak current 1
IPEAK1
PVC pin peak current 2
IPEAK2
PVC pin peak current 3
IPEAK3
PVC satulation voltage
VSAT
[Charging control block]
ADJ sink current
IADJ
Off time
TOFFMAX
[Transformer secondary-side detection block]
Full charge detection voltage
VFULLTH
FULL pin ON resistor
RFULLL
FULL pin leak current
IFULLH
[Protection circuit block]
UVLO detect voltage
VUVLOTH
[IGBT driver block]
Min.
Limit
Typ.
Max.
-
-
35
-
60
1
mA
uA
Output during ON time
START=0V
2.0
-
-
-
24
-
0.4
40
V
V
uA
START=3.3V
―
0.35
1.0
1.95
-
―
0.6
1.1
2.05
0.3
1
0.85
1.2
2.15
1
uA
A
A
A
V
PVC=36V
ADJ=0V
ADJ=1V
ADJ=3V
ISW=0.5A
―
―
2.5
10
10
30
uA
uS
29.7
-
-
30
110
-
30.3
300
1
V
Ω
uA
FULL=0.5V
FULL=3.3V
-
-
2.25
V
VCC detection
Unit
Output short high current
Ioso
70
140
―
mA
Output short low current
Iosi
30
60
―
mA
VIGBTH
VIGBTL
IIGBT_IN
2.0
―
-
-
-
24
―
0.4
40
V
V
uA
IGBT_IN input high voltage range
IGBT_IN input high voltage range
IGBT_IN sink current
○Package (UNIT:mm)
B D 4
2 1 6
Lot No.
○Pin Layout
REV. A
Conditions
IGBT_IN=3.3V,
IGBT_OUT=0V
IGBT_IN=0V,
IGBT_OUT=3.3V
IGBT_IN=3.3V
3/4
1
10
2
9
3
8
4
7
5
6
Pin No.
Pin Name
Function
1
PGND
Ground pin
2
IGBT_OUT
IGBT driver output pin
3
IGBT_IN
IGBT driver input pin
4
FULL
5
ADJ
6
START
Standby pin
7
VCC
VCC pin
8
VC
Full charge detection pin
9
N/C
N/C
10
PVC
Power transistor output pin
TOP VIEW
Fig.1 Pin Layout
○Block Diagram
FULL charge detection flag pin
primary-side
VCC
PVC
7
STB
VREF
current control pin
10
VCC
UVLO
UVLO
TSD
TSD
OS
START
6
START
STB
S Q
VCC
R
FULL
STB
UVLO
TSD
VC OFF TIME DETECTION
+
MAX OFF TIME
LOGIC
DRV
SQ
R
PGND
+
ADJ
5
1/A
FULL
FULL
4
Q
VC
+
-
S
R
3
8
VC
2
IGBT_OUT
OS
VCC
IGBT_IN
PGND
VCC
UVLO
PGND
1
PGND
Fig.2 Block Diagram
REV. A
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○ Cautions on use
1.
Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2.
PGND potential
Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND
pin carry a voltage less than or equal to the GND pin, including during actual transient phenomena.
3.
Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
4.
Protect circuit
The IC does not incorporate built-in malfunction protection such as overcurrent protection, short detection, or thermal
shutdown circuitry. For this reason, the IC may be damaged if it is shorted or subjected to a load that exceeds the
package power. The design of peripheral application circuits should reflect these potential risks.
5.
Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins
are shorted together or are shorted to other circuit’s power lines.
6.
Common impedance
The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating
voltage on the power ground line may damage the device.
7.
Backside copper foil
Connect to PGND pin for protection of malfunction.
8.
Thermal shutdown
there is a temperature protection circuit in the body ,for protect from heating damage, When thermal
circuit
moved, output is OFF condition. However it would be fixed automatically, If it return to regular
temperature.
9.
Voltage of START pin
The threshold voltages of START pin are 2.0V. STB state is set below 0.4V while action state is set beyond
2.0V.The region between 0.4V and 2.0V is not recommended and may cause improper operation.
REV. A
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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