1/4 STRUCTURE Silicon monolithic integrated circuits PRODUCT SERIES Bipolar stepping motor driver TYPE BD63940EFV FUNCTION ・PWM constant current controllable two H bridge driver ・Forward, Reverse, Brake mode ・Parallel IN control ○Absolute maximum ratings(Ta=25℃) Item Supply voltage Symbol VCC1,2 Limit Unit -0.2～+36.0 V ※1 1.1 W Power dissipation Pd 4.0※2 W Input voltage for control pin VIN -0.2～+5.5 V RNF maximum voltage VRNF 0.5 V Maximum output current IOUT 1.2※3 A/phase Operating temperature range Topr -25～+85 ℃ Storage temperature range Tstg -55～+150 ℃ Junction temperature Tjmax +150 ℃ ※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃. ※2 4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃. ※3 Do not, however exceed Pd, ASO and Tjmax=150℃. ○Recommended operating conditions (Ta=-25～+85℃) Item Symbol Min. Supply voltage VCC1,2 19 Output current IOUT ※4 Do not, however exceed Pd, ASO. Typ. 24 0.7 This product isn’t designed for protection against radioactive rays. Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority. REV. A Max. 28 0.9※4 Unit V A/phase 2/4 ○Electrical characteristics (Unless otherwise specified Ta=25℃, VCC1,2=24V) Limit Item Symbol Min. Typ. Max. Whole Circuit current at standby ICCST 0.6 2.0 Circuit current ICC 2.7 7.0 Control input (IN1A, IN1B, IN2A, IN2B, PS) H level input voltage VINH 2.0 L level input voltage VINL 0.8 Output (OUT1A, OUT1B, OUT2A, OUT2B) Output ON resistance Output leak current Current control RNFX input current VREFX input current VREFX input voltage range Comparator offset Minimum on time Unit mA mA PS=L PS=H, VREFX=0.4V V V RON - 1.4 1.8 Ω ILEAK - - 10 μA IRNF IVREF VREF VCOF tONMIN -40 -2.0 0 -20 0.3 -20 -0.1 0 0.7 0.4 20 1.2 μA μA V mV μs REV. A Conditions IOUT=0.7A, Sum of upper and lower RNFX=0V VREFX=0V VREFX=0.4V R=39kΩ,C=1000pF 3/4 ○Package outline Product No. BD63940 Lot No. HTSSOP-B24 (Unit: mm) ○Block diagram ○Pin No. / Pin name LOGIC IN1B 11 CR1 9 VREF1 10 ONE SHOT 16 OUT1A Predriver 18 OUT1B 17 RNF1 OCP Current Limit Comp. 22 VCC2 IN2A 24 LOGIC IN2B 2 CR2 4 VREF2 3 ONE SHOT 21 OUT2A Predriver 19 OUT2B 20 RNF2 OCP Current Limit Comp. PGND 1 Regulator PGND 14 TSD GND 7 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 15 VCC1 IN1A 13 OVLO RESET Pin name PGND IN2B VREF2 CR2 NC TEST GND PS CR1 VREF1 IN1B NC 6 TEST NC : Non Connection 8 PS UVLO REV. A Pin No. 13 14 15 16 17 18 19 20 21 22 23 24 Pin name IN1A PGND VCC1 OUT1A RNF1 OUT1B OUT2B RNF2 OUT2A VCC2 NC IN2A 4/4 ○Operation Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Power supply lines As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) GND potential The potential of GND pin must be minimum potential in all operating conditions. (4) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (6) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (7) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (8) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. (9) Ground Wiring Pattern When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (10) Mounting errors and Inter-pin short When attaching to a printed circuit board, pay attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (11) TEST pin Be sure to connect TEST pin to GND. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A