GA01PNS80-CAL-SPC

 Die Datasheet
GA01PNS80-CAL
SPICE Model Parameters
Please copy this code from the SPICE model into LTSPICE (version 4) software for simulation of the
GA01PNS80-CAL device.
*
MODEL OF GeneSiC Semiconductor Inc.
*
*
$Revision:
1.1
$
*
$Date:
30-APR-2015
$
*
*
GeneSiC Semiconductor Inc.
*
43670 Trade Center Place Ste. 155
*
Dulles, VA 20166
*
*
COPYRIGHT (C) 2013 GeneSiC Semiconductor Inc.
*
ALL RIGHTS RESERVED
*
* These models are provided "AS IS, WHERE IS, AND WITH NO WARRANTY
* OF ANY KIND EITHER EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED
* TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
* PARTICULAR PURPOSE."
* Models accurate up to 2 times rated drain current.
*
* Start of GA01PNS80-CAL SPICE Model
*
. MODEL GA01PNS80 D
+ IS
9.2491e-015
+ RS
1.02512
+ N
3.3373
+ IKF
0.00011784
+ EG
3.23
+ XTI
25
+ TRS1
-0.0024
+ CJO
2.7E-11
+ VJ
2.304
+ M
0.376
+ FC
0.5
+ BV
8000
+ IBV
1.00E-03
+ VPK
8000
+ IAVE
1
+ TYPE
SiC_PiN
+ MFG
GeneSiC_Semi
*
* End of GA01PNS80-CAL SPICE Model
Apr 2015
http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-bare-die/
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