HU2109 3A, High Efficiency uPOL Module GENERAL DESCRIPTION: FEATURES: The uPOL module is non-isolated dc-dc converters that can deliver up to 3A of output current. The PWM switching regulator, high frequency power inductor are integrated in one hybrid package. It only needs input/output capacitors and one voltage dividing resistor. High Density uPOL Module 3A Output Current Input Voltage Range from 4.5V to 16V Output Voltage Range from 0.6V to 5.0V 93% Peak Efficiency Enable / PGOOD Function Automatic Power Saving/PWM Mode Protections (OCP: Non-latching, OTP) Internal Soft Start Compact Size: 6mm*6mm*3.5mm(Max) Pb-free for RoHS compliant MSL 2, 250C Reflow The module has automatic operation with PWM mode and power saving mode according to loading. Other features include remote enable function, internal soft-start, non-latching over current protection and power good. The low profile and compact size package (6.0mm × 6.0mm x 3.5mm) is suitable for automated assembly by standard surface mount equipment. The uPOL module is Pb-free and RoHS compliance. APPLICATIONS: Distributed Power Supply Server, Workstation, and Storage Networking and Datacom TYPICAL APPLICATION CIRCUIT & PACKAGE SIZE: PGOOD Css PGOOD SS RFB Setting Output Voltage FB VIN VOUT VIN VOUT 3.5 mm uPOL Power Module EN (Max) COUT CIN GND 6.0mm 6.0mm TABLE 1: OUTPUT VOLTAGE SETTING Vout 1.0V 1.2V 1.8V 2.5V 3.3V 5.0V RFB (Ohm) 150k 100k 49.9k 31.6k 22.1k 13.7k 1 HU2109 3A, High Efficiency uPOL Module ORDER INFORMATION: Part Number Ambient Temp. Range Package (°C) (Pb-Free) -40 ~ +85 LGA HU2109 MSL Note Level 2 - Order Code Packing Quantity HU2109 Tape and reel 1000 PIN CONFIGURATION: TOP VIEW 2 HU2109 3A, High Efficiency uPOL Module PIN DESCRIPTION: Symbol Pin No. VIN 1, 19, 20 PHASE 2, 3, 4 GND 5, 6, 7 FB 9 VOUT 10, 11, 12, 13, 14 Description Power input pin. It needs to connect input rail and thermal exposed pad of VIN_TPD(21) for heat transferring. Place the input ceramic type capacitor as closely as possible to this pin. One capacitor of 22uF at least for input capacitance. Switch output. Connect to thermal exposed pad of PHASE_TPD(22) for heat transferring. Power ground pin for signal, input, and output return path. This pin needs to connect one or more ground plane directly. Connect to thermal exposed pad of GND_TPD(23, 25) for heat transferring. Feedback input. Connect an external resistor divider from the FB to GND to set the output voltage. Power output pin. Connect to output and thermal exposed pad of VOUT_TPD(24) for heat transferring. Place the output capacitors as closely as possible to this pin. Two capacitors of 47uF at least for output capacitance. Soft start pin. It has internal current source for changing ramp up to set soft start time. Leave SS pin floating for default 1ms soft-start time. SS 15 N.C. 8,16 PGOOD 17 Power good signal pin. Open drain output when the output voltage is above 90% of regulation point. EN 18 On/Off control pin for module. VIN_TPD 21 PHASE_TPD 22 GND_TPD 23, 25 VOUT_TPD 24 Not Connected. Power input pin. Connect input rail and using for heat transferring to heat dissipation layer by Vias connection. Phase node pin. Using for heat transferring to heat dissipation layer by Vias connection. Power ground pin. It needs to connect one or more ground plane directly and using for heat transferring to heat dissipation layer by Vias connection. Power output pin. Connect to output and using for heat transferring to heat dissipation layer by Vias connection. 3 HU2109 3A, High Efficiency uPOL Module ELECTRICAL SPECIFICATIONS: CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impact product reliability and result in failures not covered by warranty. Parameter Description Min. Typ. Max. Unit - - +18 V +6.5 V VIN+0.3 V Absolute Maximum Ratings VIN to GND VOUT to GND SW to GND Note 1 EN to GND Note 1 - - +6.0 V Tc Case Temperature of Inductor - - +110 °C Tj Junction Temperature -40 - +150 °C Tstg Storage Temperature -40 - +125 °C Input Supply Voltage +4.5 - +16 V Adjusted Output Voltage +0.6 +5.0 V Recommendation Operating Ratings VIN VOUT Ta Ambient Temperature -40 - +85 °C - 14 - °C/W Thermal Information Rth(jchoke-a) Thermal resistance from junction to ambient (Note 2) NOTES: 1. Parameters guaranteed by power IC vendor design and test prior to module assembly. 2. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm× 30mm× 1.6mm with 4 layers. The test condition is complied with JEDEC EIJ/JESD 51 Standards. 4 HU2109 3A, High Efficiency uPOL Module ELECTRICAL SPECIFICATIONS: (Cont.) Conditions: TA = 25 ºC, unless otherwise specified. Vin = 12V, Vout = 5.0V, Cin = 22uF/16V/1206× 2, Cout = 47uF/10V/1206× 2. Symbol Parameter Conditions Min. Typ. Max. Unit Vin =12V, EN = GND - 5.5 - uA Vin = 12V, Iout = 0A Vout = 5.0V, EN = VIN - 0.13 - mA Input Characteristics ISD(IN) Input shutdown current IQ(IN) Input supply bias current Vin = 12V, EN = VIN IS(IN) Input supply current Output continuous current range VO(SET) Ouput Voltage Set Point ΔVOUT /ΔVIN Line regulation accuracy ΔVOUT /ΔIOUT Load regulation accuracy VOUT(AC) Output ripple voltage 2.5 - mA - 1.39 - A 0 - 3 A +2.5 % VO(SET) With 0.5% tolerance for external resistor used to set output voltage Vin = 7.0V to 15V Vout = 5.0V, Iout = 0A Vout = 5.0V, Iout = 3A Iout = 0A to 3A Vin = 12V, Vout = 5.0V Vin = 12V, Vout = 5.0V EN = VIN,20MHz Bandwidth -2.5 - 0.2 -2 - - % VO(SET) +3 % VO(SET) - - IOUT = 5mA 25 mVp-p IOUT = 3A 30 mVp-p Dynamic Characteristics ΔVOUT-DP Voltage change for positive load step ΔVOUT-DN Voltage change for negative load step ΔVOUT-DP Voltage change for positive load step ΔVOUT-DN Voltage change for negative load step - Iout = 3A,Vout =5.0V Output Characteristics IOUT(DC) Iout = 5mA,Vout =5.0V Iout = 0 A to 1.5A Current slew rate = 0.8A/uS Vin = 12V, Vout = 5V Iout = 1.5A to 0A Current slew rate = 0.8A/uS Vin = 12V, Vout = 5V Iout = 1.5 A to 3A Current slew rate = 0.8A/uS Vin = 12V, Vout = 5V Iout = 3A to 1.5A Current slew rate = 0.8A/uS Vin = 12V, Vout = 5V - 35 - mVp-p - 65 - mVp-p - 95 - mVp-p - 85 - mVp-p Control Characteristics OCP Protection Output Current Note 3 4.1 A FOSC Oscillator frequency Note 3 1 MHz VREF Referance voltage Note 3 -1.5 0.600 +1.5 V/% VPG Power good threshold Note 3 88 90 92 % VREF ToffMIN Minimum Off time Note 3 140 170 220 nS TonMIN Minimum On time Note 3 50 80 120 nS NOTES: 3. Parameters guaranteed by IC vendor design and test prior to module assembly. 5 HU2109 3A, High Efficiency uPOL Module TYPICAL PERFORMANCE CHARACTERISTICS: Conditions: TA = 25 ºC, unless otherwise specified. Cin = 22uF/16V/1206× 2, Cout = 47uF/10V/1206× 2. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers. FIG.1 12VIN EFFICIENCY V.S. LOAD CURRENT FIG.2 DE-RATING CURVE VOUT VOUT FIG.3 OUTPUT RIPPLE (12VIN, 5VOUT, IOUT=0A) FIG.4 OUTPUT RIPPLE (12VIN, 5VOUT, IOUT=3A) EN VOUT VOUT FIG.5 TRANSIENT RESPONSE (12VIN, 5VOUT, 0% to 100% LOAD STEP) FIG.6 TURN-ON (12VIN, 5VOUT, IOUT=3A) 6 HU2109 3A, High Efficiency uPOL Module APPLICATIONS INFORMATION: REFERENCE CIRCUIT FOR GENERAL APPLICATION: The Figure 7 shows the HU2109 application schematics for input voltage +12V with automatic power saving function operation. R(EN) 100k/0402 Enable/Disable control VIN N.C. EN PGOOD VIN VOUT GND VOUT Css DNP/0402 VOUT VOUT PHASE_TPD FB PHASE N.C. VOUT GND_TPD GND PHASE GND C(SN) DNP/0805 PHASE GND_TPD R(SN) DNP/0805 SS VOUT_TPD GND C(IN) 22uF/16V/1206*2 VIN VIN VIN_TPD PGOOD R(FB) 13.7k/0402 GND C(OUT) 47uF/10V/1206*2 FIG.7 TYPICAL APPLICATION FOR PWM OPERATION 7 VOUT HU2109 3A, High Efficiency uPOL Module APPLICATIONS INFORMATION: (Cont.) SAFETY CONSIDERATIONS: Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. INPUT FILTERING: The module should be connected to as low AC impedance source supply and a highly inductive source or line inductance can affect the stability of the module. Input capacitors must be placed directly to the input pin of the module, to minimize input ripple voltage and ensure module stability. OUTPUT FILTERING: To reduce output ripple and improve the dynamic response to as step load change, the additional capacitors at the output must be used. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module. PROGRAMMING OUTPUT VOLTAGE: The module has an internal 0.6V±1.5% reference voltage. The output voltage can be programmed by the dividing resistance RFB which respects to FB pin and GND pin. The output voltage can be calculated as shown in Equation 1 and the resistance according to typical output voltage is shown in TABLE 1. 100k VOUT (V) 0.6 1 R FB (EQ.1) PROGRAMMING SOFT-START: Leave SS pin float for default 1ms soft-start time. This mechanism provides output voltage soft rise and no inrush current charges the output capacitors. The soft start time can be calculated as shown in Equation 2 for reference. TSS (Sec) Css 0.6V 4uA 8 (EQ.2) HU2109 3A, High Efficiency uPOL Module APPLICATIONS INFORMATION: (Cont.) RECOMMENDATION LAYOUT GUIDE: In order to achieve stable, low losses, less noise or spike, and good thermal performance some layout considerations are necessary. The recommendation layout is shown as Figure 8. 1. The ground connection between pin 23, pin25 and pin 5 to 7 should be a solid ground plane under the module. It can be connected one or more ground plane by using several Vias. 2. Place high frequency ceramic capacitors between pin 1, pin 19 to 21 (VIN), and pin 23, pin25, pin 5 to 7 (GND) for input side; and pin 24, pin 10 to 14 (VOUT), and pin 23, pin25, pin 5 to 7 (GND) for output side, as close to module as possible to minimize high frequency noise. 3. Keep the RFB connection trace to the module pin 9 (FB) short. 4. Use large copper area for power path (VIN, VOUT, and GND) to minimize the conduction loss and enhance heat transferring. Also, use multiple Vias to connect power planes in different layer. Avoid any sensitive signal traces near the pin 24, and pin 2 to 4 (PHASE). GND C(SN) Cin R(SN) VIN PHASE RFB Cin 5. GND Cout VOUT FIG.8 RECOMMENDATION LAYOUT (TOP LAYER) 9 HU2109 3A, High Efficiency uPOL Module APPLICATIONS INFORMATION: (Cont.) Thermal Considerations: All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm× 30mm× 1.6mm with 4 layers. The case temperature of module sensing point is shown as Figure 9. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The HU2109 module is designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature. Figure 9 Case Temperature Sensing Point 10 HU2109 3A, High Efficiency uPOL Module REFLOW PARAMETERS: Lead-free soldering process is a standard of making electronic products. Many solder alloys like Sn/Ag, Sn/Ag/Cu, Sn/Ag/Bi and so on are used extensively to replace traditional Sn/Pb alloy. Here the Sn/Ag/Cu alloy (SAC) are recommended for process. In the SAC alloy series, SAC305 is a very popular solder alloy which contains 3% Ag and 0.5% Cu. It is easy to get it. Figure 10 shows an example of reflow profile diagram. Typically, the profile has three stages. During the initial stage from 70°C to 90°C, the ramp rate of temperature should be not more than 1.5°C/sec. The soak zone then occurs from 100°C to 180°C and should last for 90 to 120 seconds. Finally the temperature rises to 230°C to 245°C and cover 220°C in 30 seconds to melt the solder. It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and user could switch to optimize the profile according to various solder type and various manufactures’ formula. FIG.10 Recommendation Reflow Profile 11 HU2109 3A, High Efficiency uPOL Module PACKAGE OUTLINE DRAWING: 12 HU2109 3A, High Efficiency uPOL Module LAND PATTERN REFERENCE: Unit:mm 13 HU2109 3A, High Efficiency uPOL Module PACKING REFERENCE: Unit: mm Package In Tape Loading Orientation Tape Dimension pulling direction A0 B0 F W D0 D1 6.60 0.10 6.60 0.10 7.50 0.10 16.00 0.30 φ1.5 +0.1/-0.0 φ1.5 Min. E1 K0 P0 P1 P2 t 14 1.75 0.10 3.70 0.10 12.00 0.10 2.00 0.10 4.00 0.10 0.35 0.05 HU2109 3A, High Efficiency uPOL Module PACKING REFERENCE: (Cont.) Unit: mm Reel Dimension See Detail A Detail A Peel Strength of Top Cover Tape The peel speed shall be about 300mm/min. The peel force of top cover tape shall between 0.1N to 1.3N 0.1~1.3N 15 HU2109 3A, High Efficiency uPOL Module REVERSION HISTORY: Date Revision Changes 2014.11.20 00 Release the preliminary specification. 2014.12.18 01 Add packing and marking drawing. 2015.2.12 02 2015.02.26 03 2015.05.07 04 Change ISD(IN) and IQ(IN) current 2015.06.10 05 Change Recommendation Vout Operating Ratings 2015.06.24 06 Add REFLOW PARAMETERS Change PIN 1 position: PIN CONFIGURATION, PACKAGE OUTLINE DRAWING, LAND PATTERN REFERENCE, PACKING REFERENCE 1. Thermal Information: Delete Note 2 test board oz 16