HU1145 1A, High Efficiency LDS Module GENERAL DESCRIPTION: FEATURES: The LDS module is non-isolated dc-dc converter that can deliver up to 1A of output current. The PWM switching regulator, high frequency power inductor, input/output bulk capacitors are integrated in one hybrid package. High Density Integration Module 1A Output Current 93% Peak Efficiency at 3.3VIN Input Voltage Range from 2.7V to 5.5V Adjusted Output Voltage Enable Function Automatic Power Saving/PWM Mode Protections (UVLO, OCP: Non-latching) Internal Soft Start Compact Size: 2.9mm*2.3mm*1.0mm Pb-free for RoHS compliant MSL 2, 260C Reflow The module has automatic operation with PWM mode and power saving mode according to loading. Other features include remote enable function, internal soft-start, non-latching over current protection, short circuit protection and input under voltage locked-out capability. The low profile and compact size package (2.9mm × 2.3mm x 1.0mm) is suitable for automated assembly by standard surface mount equipment. The module is Pb-free and RoHS compliance. APPLICATIONS: Single Li-Ion Battery-Powered Equipment LDOs Replacement Cell Phones / PDAs / Palmtops TYPICAL APPLICATION CIRCUIT & PACKAGE: Enable ON OFF(GND) EN V OU T V IN (+) (+) RFB_top VIN 2.7V ~ 5.5V GN D CFB VOUT FB Adjusted RFB_bot (-) (-) FIG.1 TYPICAL APPLICATION CIRCUIT FIG.2 HIGH DENSITY LOW PROFILE LDS MODULE TABLE 1. OUTPUT VOLTAGE SETTING Vout 1.0V 1.2V 1.5V RFB_top(Ω) RFB_bot(Ω) 1.8V 2.5V 3.3V 50k 31.6k 22.1k 100k 150k 100k 66.5k 1 HU1145 1A, High Efficiency LDS Module ELECTRICAL SPECIFICATIONS: CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impact product reliability and result in failures not covered by warranty. Parameter Typ. Max. Unit VIN to GND Note 1 - - +6.0 V VOUT to GND Note 1 - - +6.0 V EN to GND Note 1 - - VIN+0.6 V - - +110 °C Tc Case Temperature of Inductor Tj Junction Temperature -40 - +150 °C Tstg Storage Temperature -40 - +125 °C Human Body Model (HBM) - - 2k V Machine Model (MM) - - 200 V Charge Device Model (CDM) - - 1k V Input Supply Voltage +2.7 - +5.5 V Output Voltage +0.8 - +4.0 V Ambient Temperature -40 - +85 °C - 70 - °C/W Recommendation Operating Ratings VIN VOUT Ta Min. Absolute Maximum Ratings ESD Rating Description Thermal Information Rth(jchoke-a) Thermal resistance from junction to ambient. (Note 2) NOTES: 1. Parameters guaranteed and tested by power IC vendor. 2. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm×30mm×1.6mm with 2 layers, 1oz. The test condition is complied with JEDEC EIJ/JESD 51 Standards. 2 HU1145 1A, High Efficiency LDS Module ELECTRICAL SPECIFICATIONS: (Cont.) Conditions: TA = 25 ºC, Vin = 12V, Vout = 3.3V, unless otherwise specified. Symbol Conditions Min. Typ. Max. Unit Vin = 12V, Iout = 0A EN = VIN Vout = 3.3V - 0.25 - mA Vin =12V, EN = VIN - - - - - 0.6 - mA - 33 - mA - 320 - mA 0 - 1000 mA +3.0 % VO(SET) Input Characteristics IQ(IN) IS(IN) Parameter Input supply bias current Input supply current Iout = 1mA Vout = 3.3V Iout = 100mA Vout = 3.3V Iout = 1000mA Vout = 3.3V Output Characteristics IOUT(DC) Output continuous current range VO(SET) Ouput voltage set point ΔVOUT /ΔVIN Line regulation accuracy ΔVOUT /ΔIOUT Load regulation accuracy VOUT(AC) Output ripple voltage Vin=12V, Vout=3.3V With 0.5% tolerance for external resistor used to set output voltage Vin = 5V to 12V Vout = 3.3V, Iout = 0A Vout = 3.3V, Iout = 1000mA Iout = 0A to 1000mA Vin = 12V, Vout = 3.3V Vin = 12V, Vout = 3.3V EN = VIN -3.0 - 0.1 0.2 % VO(SET) - 0.5 1.0 % VO(SET) - - - Iout = 1mA 14 mVp-p Iout = 1000mA 8 mVp-p 3 HU1145 1A, High Efficiency LDS Module ELECTRICAL SPECIFICATIONS: (Cont.) Conditions: TA = 25 ºC, Vin = 3.3V, Vout = 1.8V, unless otherwise specified. Symbol Conditions Min. Typ. Max. Unit 0.558 0.6 0.612 V - 3.0 - MHz Control Characteristics VREF Referance voltage Note 1 FOSC Oscillator frequency Note 1, PWM Operation Enable rising threshold voltage Note 1 1.5 - - V Enable falling threshold voltage Note 1 - - 0.4 V Falling, Note 1 - 2.5 - V Note 1 - 160 - ℃ 1.3 - - A VEN_TH Parameter Fault Protection VUVLO_TH TOTP ILIMIT_TH Input under voltage lockout threshold Over temp protection Current limit threshold Peak value of inductor current, Note 1 4 HU1145 1A, High Efficiency LDS Module PIN CONFIGURATION: EN (1) (6) VOUT (5) FB GND (2) VIN (3) (4) GND TOP VIEW PIN DESCRIPTION: Symbol Pin No. Description On/Off control pin for module. EN = LOW, the module is off. EN = HIGH, the module is on. Do not float. Power ground pin for signal, input, and output return path. This pin needs to connect one or more ground plane directly. EN 1 GND 2, 4 VIN 3 Power input pin. It needs to connect input rail. FB 5 Feedback input. Connect to output through a voltage dividing resistors for adjusting output voltage. Place those resistors as closely as possible to this pin. VOUT 6 Power output pin. Connect to output for the load. 5 HU1145 1A, High Efficiency LDS Module TYPICAL PERFORMANCE CHARACTERISTICS: (1.0VOUT) Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. The following figures are the typical characteristic curves at 1.0Vout. FIG.3 EFFICIENCY V.S. LOAD CURRENT FIG.4 DE-RATING CURVE AT 3.3VIN VOUT VOUT VOUT FIG.5 OUTPUT RIPPLE (3.3VIN, IOUT=5mA) FIG.6 OUTPUT RIPPLE (3.3VIN, IOUT=1000mA) VOUT EN FIG.7 TRANSIENT RESPONSE (3.3VIN, 0% to 50% LOAD STEP) FIG.8 TURN-ON (3.3VIN, IOUT=1000mA) 6 HU1145 1A, High Efficiency LDS Module TYPICAL PERFORMANCE CHARACTERISTICS: (1.2VOUT) Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. The following figures are the typical characteristic curves at 1.2Vout. FIG.9 EFFICIENCY V.S. LOAD CURRENT FIG.10 DE-RATING CURVE AT 3.3VIN VOUT VOUT VOUT FIG.11 OUTPUT RIPPLE (3.3VIN, IOUT=5mA) FIG.12 OUTPUT RIPPLE (3.3VIN, IOUT=1000mA) VOUT VOUT VOUT EN FIG.13 TRANSIENT RESPONSE (3.3VIN, 0% to 50% LOAD STEP) FIG.14 TURN-ON (3.3VIN, IOUT=1000mA) 7 HU1145 1A, High Efficiency LDS Module TYPICAL PERFORMANCE CHARACTERISTICS: (1.5VOUT) Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. The following figures are the typical characteristic curves at 1.5Vout. FIG.15 EFFICIENCY V.S. LOAD CURRENT FIG.16 DE-RATING CURVE AT 3.3VIN VOUT VOUT FIG.17 OUTPUT RIPPLE (3.3VIN, IOUT=5mA) FIG.18 OUTPUT RIPPLE (3.3VIN, IOUT=1000mA) VOUT VOUT EN FIG.19 TRANSIENT RESPONSE (3.3VIN, 0% to 50% LOAD STEP) FIG.20 TURN-ON (3.3VIN, IOUT=1000mA) 8 HU1145 1A, High Efficiency LDS Module TYPICAL PERFORMANCE CHARACTERISTICS: (1.8VOUT) Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. The following figures are the typical characteristic curves at 1.8Vout. FIG.21 EFFICIENCY V.S. LOAD CURRENT FIG.22 DE-RATING CURVE AT 3.3VIN VOUT VOUT FIG.23 OUTPUT RIPPLE (3.3VIN, IOUT=5mA) FIG.24 OUTPUT RIPPLE (3.3VIN, IOUT=1000mA) VOUT VOUT EN FIG.25 TRANSIENT RESPONSE (3.3VIN, 0% to 50% LOAD STEP) FIG.26 TURN-ON (3.3VIN, IOUT=1000mA) 9 HU1145 1A, High Efficiency LDS Module TYPICAL PERFORMANCE CHARACTERISTICS: (2.5VOUT) Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. The following figures are the typical characteristic curves at 2.5Vout. FIG.27 EFFICIENCY V.S. LOAD CURRENT FIG.28 DE-RATING CURVE AT 3.3VIN VOUT VOUT FIG.29 OUTPUT RIPPLE (3.3VIN, IOUT=5mA) FIG.30 OUTPUT RIPPLE (3.3VIN, IOUT=1000mA) VOUT VOUT EN FIG.31 TRANSIENT RESPONSE (3.3VIN, 0% to 50% LOAD STEP) FIG.32 TURN-ON (3.3VIN, IOUT=1000mA) 10 HU1145 1A, High Efficiency LDS Module APPLICATIONS INFORMATION: REFERENCE CIRCUIT FOR GENERAL APPLICATION: The Figure 33 shows the module application schematics for input voltage +5V or +3.3V and turn on by input voltage directly through enable resistor (REN). Enable REN ON 100k/0201 OFF(GND) EN V OU T V IN (+) VIN 3.3V / 5.0V RFB_top 100k/0201 GN D (+) CFB 100pF/0201 FB Co Option/0402 VOUT 1.8Vo RFB_bot 50k/0201 (-) (-) FIG.33 TYPICAL APPLICATION FOR PWM OPERATION 11 HU1145 1A, High Efficiency LDS Module APPLICATIONS INFORMATION: (Cont.) SAFETY CONSIDERATIONS: Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. INPUT FILTERING: The module should be connected to a source supply of low AC impedance and high inductance in which line inductance can affect the module stability. An input capacitor must be placed as near as possible to the input pin of the module so to minimize input ripple voltage and ensure module stability. OUTPUT FILTERING: To reduce output ripple and improve the dynamic response as the step load changes, an additional capacitor at the output must be connected. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module. PROGRAMMING OUTPUT VOLTAGE: The module has an internal 0.6V±2% reference voltage. The output voltage can be programmed by the dividing resistor (RFB) which connects to both FB pin and GND pin. The output voltage can be calculated by Equation 1, resistor choice may be referred to TABLE 1. 100k VOUT (V) 0.6 1 RFB VOU(V) RFB(k) 1.0 150(1%) 1.2 100(1%) 1.8 50(1%) 2.5 31.6(1%) 3.3 22.1(1%) TABLE 1 Resistor values for common output voltages 12 (EQ.1) HU1145 1A, High Efficiency LDS Module APPLICATIONS INFORMATION: (Cont.) RECOMMENDATION LAYOUT GUIDE: In order to achieve stable, low losses, less noise or spike, and good thermal performance some layout considerations are necessary. The recommendation layout is shown as Figure 34. 1. The ground connection between pin 2 and 4 should be a solid ground plane under the module. It can be connected one or more ground plane by using several Vias. 2. Place high frequency ceramic capacitors between pin 3 (VOUT), and pin 2, 4 (GND) for output side, as close to module as possible to minimize high frequency noise. 3. Keep the RFB_top ,RFB_bot , and CFF connection trace to the module pin 5 (FB) short. 4. Use large copper area for power path (VIN, VOUT, and GND) to minimize the conduction loss and enhance heat transferring. Also, use multiple Vias to connect power planes in different layer. FIG.34 RECOMMENDATION LAYOUT (TOP LAYER) 13 HU1145 1A, High Efficiency LDS Module APPLICATIONS INFORMATION: (Cont.) Thermal Considerations: All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm×30mm×1.6mm with 2 layers. The case temperature of module sensing point is shown as Figure 35. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The HU1145 module is designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature. FIG. 35 Case Temperature Sensing Point 14 HU1145 1A, High Efficiency LDS Module REFLOW PARAMETERS: Lead-free soldering process is a standard of making electronic products. Many solder alloys like Sn/Ag, Sn/Ag/Cu, Sn/Ag/Bi and so on are used extensively to replace traditional Sn/Pb alloy. Here the Sn/Ag/Cu alloy (SAC) are recommended for process. In the SAC alloy series, SAC305 is a very popular solder alloy which contains 3% Ag and 0.5% Cu. It is easy to get it. Figure 36 shows an example of reflow profile diagram. Typically, the profile has three stages. During the initial stage from 70°C to 90°C, the ramp rate of temperature should be not more than 1.5°C/sec. The soak zone then occurs from 100°C to 180°C and should last for 90 to 120 seconds. Finally the temperature rises to 230°C to 245°C and cover 220°C in 30 seconds to melt the solder. It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and user could switch to optimize the profile according to various solder type and various manufactures’ formula. FIG.36 Recommendation Reflow Profile 15 HU1145 1A, High Efficiency LDS Module PACKAGE OUTLINE DRAWING: Unit: mm 16 HU1145 1A, High Efficiency LDS Module LAND PATTERN REFERENCE: Unit: mm RECOMMENDED STENCIL PATTERN BASED ON 130um THICKNESS STENCIL 17 HU1145 1A, High Efficiency LDS Module PACKING REFERENCE: Package In Tape Loading Orientation PIN1 Tape Dimension A0 2.62 0.10 E1 1.75 0.10 B0 3.22 0.10 K0 1.35 0.10 F 3.50 0.05 P0 4.00 0.10 W 8.0 0.30 P1 2.00 0.05 D0 φ1.5 +0.10/-0.00 P2 4.00 0.10 D1 φ1.00 0.10 t 0.25 0.1 18 HU1145 1A, High Efficiency LDS Module PACKING REFERENCE: (Cont.) Unit: mm Reel Dimension See Detail A Detail A Peel Strength of Top Cover Tape The peel speed shall be about 300mm/min. The peel force of top cover tape shall between 0.1N to 1.0N 19 HU1145 1A, High Efficiency LDS Module REVERSION HISTORY: Date Revision Changes 2015.01.08 00 Initial released. 2015.03.31 01 Official released. 2015.06.24 02 Add REFLOW PARAMETERS 20