HU2106 1A, High Efficiency LDS Module GENERAL DESCRIPTION: FEATURES: The HU2106 is non-isolated dc-dc converters. The PWM switching regulator, high frequency power inductor, and most of support components are integrated in one hybrid package. High Density LDS Module 1000mA Output Current 94% Peak Efficiency at 5 Vin to 3.3 Vout Input Voltage Range from 4.5 V to 18V Adjusted Output Voltage Enable Function Protections (UVLO, OCP: Non-latching) Internal Soft Start Compact Size: 3.9mm*2.6mm*1.7mm(Max.) Pb-free for RoHS compliant MSL 2, 260C Reflow Other features include remote enable function, internal soft-start, non-latching over current protection, and input under voltage locked-out capability. The low profile and compact size package (3.9mm × 2.6mm x 1.7mm) is suitable for automated assembly by standard surface mount equipment. The HU2106 is Pb-free and RoHS compliance. APPLICATIONS: DSL Modem / LCD TV Portable TV / Access Point Router TYPICAL APPLICATION CIRCUIT & PACKAGE: 1.7mm 2.6mm 3.9mm FIGURE.1 TYPICAL APPLICATION CIRCUIT FIGURE.2 HIGH DENSITY LOW PROFILE LDS MODULE 1 HU2106 1A, High Efficiency LDS Module ELECTRICAL SPECIFICATIONS: CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impact product reliability and result in failures not covered by warranty. Parameter Min. Typ. Max. Unit VIN to GND - - +20 V VOUT to GND - - +6 V Note 1 - - VIN+0.3 V Tc Case Temperature of Inductor - - +110 °C Tj Junction Temperature -40 - +150 °C Tstg Storage Temperature -40 - +125 °C Human Body Model (HBM) - - 2k V Machine Model (MM) - - 200 V Charge Device Model (CDM) - - 500 V Input Supply Voltage +4.5 - +18 V Adjusted Output Voltage +0.8 - +6.0 V Ambient Temperature -40 - +85 °C Absolute Maximum Ratings EN to GND ESD Rating Description Recommendation Operating Ratings VIN VOUT Ta NOTES: 1. Parameters guaranteed by power IC vendor design and test prior to module assembly. 2. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm×30mm×1.6mm with 4 layers. The test condition is complied with JEDEC EIJ/JESD 51 Standards. 2 HU2106 1A, High Efficiency LDS Module ELECTRICAL SPECIFICATIONS: (Cont.) Conditions: TA = 25 ºC, Vin = 3.3V, Vout = 1.8V, Cin=22uF/X5R/6.3V , Cout=47uF/X5R/6.3V, unless otherwise specified. Symbol Conditions Min. Typ. Max. Unit Input Characteristics ISD(IN) Input shutdown current Vin = 3.3V, EN = GND - 50 - uA IQ(IN) Input supply bias current Vin = 3.3V, Iout = 0A EN = VIN Vout = 1.8V - 120 - uA Vin = 3.3V, EN = VIN - - - - - 3.2 - mA - 0.91 - A - 2 - A 0 - 3 A -3.0 - +3.0 % VO(SET) - 0.1 - % VO(SET) - 0.5 - % VO(SET) - - - - IOUT = 5mA, - 50 - mVp-p IOUT = 3.0A, - 15 - mVp-p Iout = 3.0A, ESR≧1 m - - 150 uF IS(IN) Parameter Input supply current Iout = 5mA Vout = 1.8V Iout = 1.5A Vout = 1.8V Iout = 3.0A Vout = 1.8V Output Characteristics IOUT(DC) Output continuous current range VO(SET) Ouput Voltage Set Point ΔVOUT /ΔVIN ΔVOUT /ΔIOUT Line regulation accuracy Load regulation accuracy VOUT(AC) COUT(MAX) Output ripple voltage Maximum capacitive load Vin=3.3V, Vout=1.8V With 0.5% tolerance for external resistor used to set output voltage Vin = 3.3V to 5V Vout = 1.8V, Iout = 3.0A Iout = 0A to 3.0A Vin = 3.3V, Vout = 1.8V Vin = 3.3V, Vout = 1.8V EN = VIN 3 HU2106 1A, High Efficiency LDS Module ELECTRICAL SPECIFICATIONS: (Cont.) Conditions: TA = 25 ºC, Vin = 12V, Vout = 3.3V, unless otherwise specified. Symbol Parameter Conditions Min. Switching Frequency Max. 1.2 Unit MHz Input Characteristics IQ(IN) IS(IN) Typ. Input supply bias current Input supply current Vin = 12V, Iout = 0A EN = With pull-up 100kΩ to VIN Vout = 3.3V - 14 - mA Iout = 5mA Vout = 3.3V - 14.3 - mA - 41.7 - mA - 319 - mA 0 - 1000 mA Iout = 100mA Vout = 3.3V Iout = 1000mA Vout = 3.3V Output Characteristics IOUT(DC) ΔVOUT /ΔVIN ΔVOUT /ΔIOUT VOUT(AC) Output continuous current range Line regulation accuracy Load regulation accuracy Output ripple voltage Vin=12V, Vout=3.3V Vin = 12V to 5V Vout = 3.3V, Iout = 1000mA Iout = 0A to 1000mA Vin = 12 V, Vout = 3.3V 0.2 0.5 Vin = 5V, Vout = 3.3V IOUT = 1000mA 11 Vin = 12V, Vout = 3.3V IOUT = 1000mA 12 4 % VO(SET) % VO(SET) mVp-p mVp-p HU2106 1A, High Efficiency LDS Module ELECTRICAL SPECIFICATIONS: (Cont.) Conditions: TA = 25 ºC, Vin = 12V, Vout = 3.3V, unless otherwise specified. Symbol Conditions Min. Typ. Max. Unit Control Characteristics VEN_TH Parameter Rising Threshold threshold voltage Note 1 Enable lower threshold voltage Note 1 1.5 V 0.4 V 4.5 V Fault Protection VUVLO_TH TOTP ILIMIT_TH Input under voltage lockout threshold Over temp protection Current limit threshold Falling, Note 1 - Note 1 - 150 ℃ - 2.2 A Peak value of inductor current, Note 1 5 HU2106 1A, High Efficiency LDS Module PIN CONFIGURATION: Vout 6 GND Vin 5 FB EN 4 1 BS 2 3 TOP VIEW PIN DESCRIPTION: Symbol Pin No. Description BS 1 GND 2 FB 3 EN 4 On/Off control pin for module. VIN 5 Input pin. Decouple this pin to GND pin with 10uF ceramic cap VOUT 6 Power output pin. Connect to output for the load. Boot-Strap Pin. Power ground pin for signal, input, and output return path. This pin needs to be connected to one or more ground planes directly. Feedback input. Connect to output through a voltage dividing resistor between this pin to GND for adjusting output voltage. Place this resistor as closely as possible to this pin. 6 HU2106 1A, High Efficiency LDS Module TYPICAL PERFORMANCE CHARACTERISTICS: (3.3VOUT) Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. The following figures are the typical characteristic curves at 3.3 Vout. FIG.3 EFFICIENCY V.S. LOAD CURRENT FIG.4 DE-RATING CURVE VOUT VOUT FIG.5 OUTPUT RIPPLE (12VIN, IOUT=0A) FIG.6 OUTPUT RIPPLE (12VIN, IOUT=1A) VOUT EN VOUT FIG.7 TRANSIENT RESPONSE (12VIN, 0% to 100% LOAD STEP) FIG.8 TURN-ON (12VIN, IOUT=1A) 7 HU2106 1A, High Efficiency LDS Module TYPICAL PERFORMANCE CHARACTERISTICS: (3.3VOUT) Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. The following figures are the typical characteristic curves at 3.3 Vout. FIG.9 OUTPUT RIPPLE (5V VIN, IOUT=0 A) FIG.10 OUTPUT RIPPLE (5V VIN, IOUT=1 A) FIG.11 TRANSIENT RESPONSE (5V VIN, 0% to 100% LOAD STEP) FIG.12 TURN-ON (5V VIN, IOUT=1 A) 8 HU2106 1A, High Efficiency LDS Module TYPICAL PERFORMANCE CHARACTERISTICS: (3.3VOUT) Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm×30mm×1.6mm, 2 layers. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. The following figures are the typical characteristic curves at 3.3 Vout. FIG.13 OUTPUT RIPPLE (15V VIN, IOUT=0 A) FIG.14 OUTPUT RIPPLE (15V VIN, IOUT=1 A) FIG.15 TRANSIENT RESPONSE (15V VIN, 0% to 100% LOAD STEP) FIG.16 TURN-ON (15V VIN, IOUT=1 A) 9 HU2106 1A, High Efficiency LDS Module TYPICAL PERFORMANCE CHARACTERISTICS: (5VOUT) Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 76.2mm×76.2mm×1.6mm, 4 layers. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. The following figures provide the typical characteristic curves at 5Vout. FIG.17 EFFICIENCY V.S. LOAD CURRENT 12 Vin FIG.18 DE-RATING CURVE (12V VIN, 0% to 100% LOAD STEP) FIG.19 OUTPUT RIPPLE (12VIN, IOUT=0A) FIG.20 OUTPUT RIPPLE (12VIN, IOUT=1A) 10 HU2106 1A, High Efficiency LDS Module APPLICATIONS INFORMATION: LOAD TRANSIENT CONSIDERATIONS: The HU2106 integrates the compensation components to achieve good stability and fast transient responses. In some applications, adding a 100pF ceramic cap between Vout and FB may further speed up the load transient responses and is thus recommended for applications with large load transient step requirements. Fig.21 shows the module application schematics FIG.21 REFERENCE CIRCUIT FOR GENERAL APPLICATION REFERENCE CIRCUIT FOR GENERAL APPLICATION: Figure 22 shows the module application schematics for input voltage +12V and turn on by input voltage directly through enable resistor (R1). FIG.22 REFERENCE CIRCUIT FOR GENERAL APPLICATION 11 HU2106 1A, High Efficiency LDS Module RECOMMEND PCB LAYOUT: Figure 23 shows recommendation PCB layout for using LDS module, C3/C4 are bypass filter for high frequency noise. Design paths of main current wide and short as Make the traces of the main current paths as short and wide as possible. Place the input/out capacitor as close as possible to the LDS module pins. Ensure all feedback network connections are short and direct. The GND pin and should be connected to a strong ground plane for heat dissipating. The output capacitor must C3: High Frequency Filter be placed near the IC. Input capacitor must be placed as close to the IC as possible. FIG.23 PCB LAYOUT 12 HU2106 1A, High Efficiency LDS Module APPLICATIONS INFORMATION: (Cont.) SAFETY CONSIDERATIONS: Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. INPUT FILTERING: The module should be connected to a low AC impedance source supply and a highly inductive source or line inductance can affect the stability of the module. An input capacitor must be placed directly to the input pin of the module, to minimize input ripple voltage and ensure module stability. OUTPUT FILTERING: To reduce output ripple and improve the dynamic response to as step load change, the additional capacitor at the output must be used. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module. PROGRAMMING OUTPUT VOLTAGE: The module has an internal 0.62V±2% reference voltage. The output voltage can be programed by the dividing resistance RFB which respects to FB pin and GND pin. The output voltage can be calculated as shown in Equation 1.(R1 is integrated in Module :100KΩ+/-1%) Vout=0.62*(1+R1/RFB) Vout (V) 1 1.2 1.5 1.8 2.5 3.3 RFB 165KΩ 107KΩ 69.8KΩ 52.3KΩ 32.4KΩ 23.2KΩ TABLE.01 Resistor values for common output voltages 13 HU2106 1A, High Efficiency LDS Module Thermal Considerations: All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm×30mm×1.6mm with 4 layers. The case temperature of module sensing point is shown as Figure 24. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The HU2106 module is designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature. FIG 24. Case Temperature Sensing Point 14 HU2106 1A, High Efficiency LDS Module REFLOW PARAMETERS: Lead-free soldering process is a standard of making electronic products. Many solder alloys like Sn/Ag, Sn/Ag/Cu, Sn/Ag/Bi and so on are used extensively to replace traditional Sn/Pb alloy. Here the Sn/Ag/Cu alloy (SAC) are recommended for process. In the SAC alloy series, SAC305 is a very popular solder alloy which contains 3% Ag and 0.5% Cu. It is easy to get it. Figure 25 shows an example of reflow profile diagram. Typically, the profile has three stages. During the initial stage from 70°C to 90°C, the ramp rate of temperature should be not more than 1.5°C/sec. The soak zone then occurs from 100°C to 180°C and should last for 90 to 120 seconds. Finally the temperature rises to 230°C to 245°C and cover 220°C in 30 seconds to melt the solder. It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and user could switch to optimize the profile according to various solder type and various manufactures’ formula. FIG.25 Recommendation Reflow Profile 15 HU2106 1A, High Efficiency LDS Module PACKAGE OUTLINE DRAWING: Unit:mm 16 HU2106 1A, High Efficiency LDS Module LAND PATTERN REFERENCE: Unit:mm 17 HU2106 1A, High Efficiency LDS Module PACKING REFERENCE: Package In Tape Loading Orientation Unit: mm Tape Dimension A0 B0 F W D0 D1 2.9 0.10 4.2 0.10 5.50 0.05 12.00 0.30 φ1.55 0.05 φ1.50 0.10 E K0 P0 P1 P2 t 1.75 0.10 1.88 0.10 4.00 0.10 8.00 0.10 2.00 0.05 0.25 0.10 18 HU2106 1A, High Efficiency LDS Module PACKING REFERENCE: (Cont.) Unit: mm Reel Dimension See Detail A Detail A Peel Strength of Top Cover Tape The peel speed shall be about 300mm/min. The peel force of top cover tape is between 0.1N to 1.3N 19 HU2106 1A, High Efficiency LDS Module REVERSION HISTORY: Date Revision Changes 2014.08.01 00 Preliminary Spec. issued initially. 2014.08.07 01 Change Vout range. 2014.10.23 02 Change figure of module; Add Load Transient Consideration. 2015.01.07 03 Add package information. 2015.06.29 04 Add reflow parameters. Add reference circuit for general application. 20