HMC1022


Design Assistance

Customised Pack Sizes / Qtys

Assembly Assistance

Support for all industry recognised
supply formats:

Die handling consultancy

Hi-Rel die qualification

Hot & Cold die probing

Electrical test & trimming
o Waffle Pack
o Gel Pak
o Tape & Reel

Onsite storage, stockholding &
scheduling

100% Visual Inspection
o MIL-STD 883 Condition A
o MIL-STD 883 Condition A

On-site failure analysis

Bespoke 24 Hour monitored
storage systems for secure long
term product support

On-site failure analysis
Contact
[email protected]
For price, delivery and to place orders
HMC1022
www.analog.com
www.micross.com
Analog Devices Welcomes
Hittite Microwave Corporation
NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED
www.analog.com
www.hittite.com
THIS PAGE INTENTIONALLY LEFT BLANK
HMC1022
v00.0811
Amplifiers - Linear & Power - Chip
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
Typical Applications
Features
The HMC1022 is ideal for:
High P1dB Output Power: 22 dBm
• Test Instrumentation
High Psat Output Power: 24 dBm
• Microwave Radio & VSAT
High Gain: 12 dB
• Military & Space
High Output IP3: 32 dBm
• Telecom Infrastructure
Supply Voltage: +10 V @ 150 mA
• Fiber Optics
50 Ohm Matched Input/Output
Die Size: 2.82 x 1.50 x 0.1 mm
Functional Diagram
General Description
The HMC1022 is a GaAs pHEMT MMIC Distributed Power Amplifier which operates between DC
and 48 GHz. The amplifier provides 12 dB of gain,
32 dBm output IP3 and +22 dBm of output power at
1 dB gain compression while requiring 150 mA from
a +10 V supply. The HMC1022 exhibits a slightly
positive gain slope from 10 to 35 GHz, making
it ideal for EW, ECM, Radar and test equipment
applications. The HMC1022 amplifier I/Os are
internally matched to 50 Ohms facilitating integration into Multi-Chip-Modules (MCMs). All data is
taken with the chip connected via two 0.025 mm
(1 mil) wire bonds of minimal length 0.31 mm (12 mils).
Electrical Specifications, TA = +25° C, Vdd = +10 V, Vgg2 = +4.5 V, Idd = 150 mA [1]
Parameter
Min.
Frequency Range
Gain
Typ.
Max.
Min.
DC - 16
9.5
11.5
Typ.
Max.
Min.
16 - 36
9.5
12
9.5
Typ.
Max.
Units
36 - 48
GHz
11.5
dB
Gain Flatness
±0.5
±0.3
±1.1
dB
Gain Variation Over Temperature
0.012
0.018
0.041
dB/ °C
Input Return Loss
18
16
15
dB
Output Return Loss
28
22
18
dB
Output Power for 1 dB Compression (P1dB)
Saturated Output Power (Psat)
20
22
24.5
19.5
19
dBm
23.5
21.5
16
21
dBm
Output Third Order Intercept (IP3)
35
32
29
dBm
Noise Figure
4
5.5
8
dB
150
150
150
mA
Supply Current
(Idd) (Vdd= 10V, Vgg1= -0.8V Typ.)
[1] Adjust Vgg1 between -2 to 0 V to achieve Idd = 150 mA typical.
1
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1022
v00.0811
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
18
10
16
S21
S11
S22
0
+25C
+85C
-55C
14
-10
12
-20
10
-30
8
-40
6
0
5
10
15
20
25
30
35
40
45
50
55
0
5
10
15
FREQUENCY (GHz)
Input Return Loss vs. Temperature
30
35
40
45
50
0
+25C
+85C
-55C
-10
RETURN LOSS (dB)
RETURN LOSS (dB)
25
Output Return Loss vs. Temperature
0
-20
-30
-40
+25C
+85C
-55C
-10
-20
-30
-40
0
5
10
15
20
25
30
35
40
45
50
0
5
10
FREQUENCY (GHz)
15
20
25
30
35
40
45
50
FREQUENCY (GHz)
Gain vs. Vdd [1]
Low Frequency Gain & Return Loss
18
20
10
16
+8V
+10V
+11V
0
RESPONSE (dB)
14
GAIN (dB)
20
FREQUENCY (GHz)
Amplifiers - Linear & Power - Chip
Gain vs. Temperature
20
GAIN (dB)
RESPONSE (dB)
Gain & Return Loss
12
10
S21
S11
S22
-10
-20
-30
-40
8
-50
6
0
5
10
15
20
25
30
35
40
45
50
-60
0.0001
FREQUENCY (GHz)
0.001
0.01
0.1
1
10
FREQUENCY (GHz)
[1] For Vdd= +8V, Vgg2=+3.5V; for Vdd= +10V, Vgg2= +4.5V; for Vdd= 11V, Vgg2= +5.5V.
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
2
HMC1022
v00.0811
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
P1dB vs. Supply Voltage [1]
26
24
24
22
22
P1dB (dBm)
P1dB (dBm)
26
20
18
20
+8V
+10V
+11V
18
+25C
+85C
-55C
16
16
14
14
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
FREQUENCY (GHz)
26
26
24
24
Psat (dBm)
28
22
30
35
40
45
50
35
40
45
50
35
40
45
50
22
+8V
+10V
+11V
20
+25C
+85C
-55C
18
18
16
16
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
FREQUENCY (GHz)
20
30
Psat vs. Supply Current [2]
26
28
24
26
Psat (dBm)
22
20
18
24
22
100 mA
150 mA
20
16
100 mA
150 mA
14
25
FREQUENCY (GHz)
P1dB vs. Supply Current [2]
P1dB (dBm)
25
Psat vs. Supply Voltage [1]
28
20
20
FREQUENCY (GHz)
Psat vs. Temperature
Psat (dBm)
Amplifiers - Linear & Power - Chip
P1dB vs. Temperature
18
16
12
0
5
10
15
20
25
30
35
40
45
50
FREQUENCY (GHz)
0
5
10
15
20
25
30
FREQUENCY (GHz)
[1] For Vdd= +8V, Vgg2=+3.5V; for Vdd= +10V, Vgg2= +4.5V; forVdd= 11V Vgg2= +5.5V.
[2] Vdd= +10V, Vgg2=+3.5V.
3
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1022
v00.0811
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
38
38
36
36
34
34
32
32
30
28
+25C
+85C
-55C
26
30
28
+8V
+10V
+11V
26
24
24
22
22
0
4
8
12
16
20
24
28
32
36
40
44
48
0
4
8
12
16
FREQUENCY (GHz)
60
60
50
50
40
40
IM3 (dBc)
IM3 (dBc)
24
28
32
36
40
44
48
Output IM3 @ Vdd = +10V [1]
Output IM3 @ Vdd = +8V [1]
30
20
30
20
4 GHz
10 GHz
16 GHz
22 GHz
10
28 GHz
34 GHz
40 GHz
44 GHz
4 GHz
10 GHz
16 GHz
22 GHz
10
0
28 GHz
34 GHz
40 GHz
44 GHz
0
0
2
4
6
8
10
12
14
16
18
20
0
2
4
6
8
Pout/TONE (dBm)
50
10
NOISE FIGURE(dB)
12
40
30
20
4 GHz
10 GHz
16 GHz
22 GHz
12
14
16
18
20
Noise Figure vs. Temperature
60
10
10
Pout/TONE (dBm)
Output IM3 @ Vdd = +11V [1]
IM3 (dBc)
20
FREQUENCY (GHz)
Amplifiers - Linear & Power - Chip
Output IP3 vs.
Supply Voltage @ Pout = 14 dBm / Tone [1]
IP3 (dBm)
IP3 (dBm)
Output IP3 vs.
Temperature @ Pout = 14 dBm / Tone
28 GHz
34 GHz
40 GHz
44 GHz
+25C
+85C
-55C
8
6
4
2
0
0
0
2
4
6
8
10
12
14
16
18
20
Pout/TONE (dBm)
0
4
8
12
16
20
24
28
32
36
40
44
48
FREQUENCY (GHz)
[1] For Vdd= +8V, Vgg2=+3.5V; for Vdd= +10V, Vgg2= +4.5V; for Vdd= 11V Vgg2= +5.5V.
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
4
HMC1022
v00.0811
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
Power Compression @ 24 GHz
Reverse Isolation vs. Temperature
ISOLATION (dB)
Pout (dBm), GAIN (dB), PAE (%)
32
+25C
+85C
-55C
-20
-30
-40
-50
-60
-70
-80
28
Pout
Gain
PAE
24
20
16
12
8
4
0
0
5
10
15
20
25
30
35
40
45
50
-4
-1
2
5
8
11
14
17
FREQUENCY (GHz)
INPUT POWER (dBm)
Gain & Power vs. Supply Current @ 24 GHz
Gain & Power vs. Supply Voltage @ 24 GHz
30
Gain (dB), P1dB (dBm), Psat (dBm)
30
Gain (dB), P1dB (dBm), Psat (dBm)
Amplifiers - Linear & Power - Chip
0
-10
25
20
Gain
P1dB
Psat
15
10
5
0
100
25
20
Gain
P1dB
Psat
15
10
5
0
110
120
130
140
150
8
9
Idd (mA)
10
11
Vdd (V)
Power Dissipation
POWER DISSIPATION (W)
2
1.5
1
4 GHz
10 GHz
20 GHz
30 GHz
40 GHz
46 GHz
0.5
0
0
3
6
9
12
15
INPUT POWER (dBm)
5
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1022
v00.0811
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
Second Harmonics vs. Temperature @ Pout =
10 dBm, Vdd = 10V & Vgg = 4.5V, 150 mA
Second Harmonics vs.
Vdd @ Pout = 10 dBm, Idd = 150 mA [1]
60
+25C
+85C
-55C
50
40
30
20
10
60
+8V
+10V
+11V
50
40
30
20
10
0
0
0
4
8
12
16
20
24
0
4
8
FREQUENCY(GHz)
12
16
20
24
FREQUENCY(GHz)
Second Harmonics vs. Pout
Vdd = 10V & Vgg = 4.5V & Idd = 150 mA
SECOND HARMONIC (dBc)
70
+4 dBm
+6 dBm
+8 dBm
+10 dBm
+12 dBm
+14 dBm
+16 dBm
+18 dBm
60
50
40
30
20
10
0
0
4
8
12
16
20
24
FREQUENCY(GHz)
Amplifiers - Linear & Power - Chip
70
SECOND HARMONIC (dBc)
SECOND HARMONIC (dBc)
70
Absolute Maximum Ratings
Drain Bias Voltage (Vdd)
12V
Output Power into VSWR >7:1
24 dBm
Gate Bias Voltage (Vgg1)
-3 to 0 Vdc
Storage Temperature
-65 to 150 °C
For Vdd = 12V, Vgg2 = 5.5V
Idd >125mA
Operating Temperature
-55 to 85 °C
Gate Bias Voltage (Vgg2)
For Vdd between 8.5V to 11V,
Vgg2 = (Vdd - 6.5V) to 5.5V
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
For Vdd < 8.5V,
Vgg2 must remain > 2V
RF Input Power (RFIN)
20 dBm
Channel Temperature
150 °C
Continuous Pdiss (T= 85 °C)
(derate 27 mW/°C above 85 °C)
1.76 W
Thermal Resistance
(channel to die bottom)
37 °C/W
Typical Supply Current vs. Vdd
Vdd (V)
Idd (mA)
+8
150
+10
150
+11
150
[1] For Vdd= +8V, Vgg=+3.5V; for Vdd= +10V, Vgg= +4.5V; for Vdd= 11V Vgg= +5.5V.
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
6
HMC1022
v00.0811
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
Amplifiers - Linear & Power - Chip
Outline Drawing
Die Packaging Information
[1]
Standard
Alternate
GP-1 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
7
NOTES:
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]
2. DIE THICKNESS IS 0.004 (0.100)
3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE
4. BOND PAD METALIZATION: GOLD
5. BACKSIDE METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS
8. OVERALL DIE SIZE IS ±.002
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1022
v00.0811
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
Pad Descriptions
Function
Description
1
RFIN
This pad is DC coupled and matched
to 50 Ohms. Blocking capacitor is required.
2
VGG2
Gate control 2 for amplifier. Attach bypass
capacitor per application circuit herein. For nominal
operation +4.5V should be applied to Vgg2.
4, 7
ACG2, ACG4
Low frequency termination. Attach bypass
capacitor per application circuit herein.
3
ACG1
Low frequency termination. Attach bypass
capacitor per application circuit herein.
5
RFOUT & VDD
RF output for amplifier. Connect DC bias (Vdd) network to
provide drain current (Idd). See application circuit herein.
6
ACG3
Low frequency termination. Attach bypass
capacitor per application circuit herein.
8
VGG1
Gate control 1 for amplifier. Attach bypass
capacitor per application circuit herein. Please
follow “MMIC Amplifier Biasing Procedure”
application note.
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
Interface Schematic
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
Amplifiers - Linear & Power - Chip
Pad Number
8
HMC1022
v00.0811
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
Amplifiers - Linear & Power - Chip
Assembly Diagram
Application Circuit
NOTE 1: Drain Bias (Vdd) must be applied through a broadband bias tee
with low series resistance and capable of providing 500mA
9
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1022
v00.0811
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be
used, the die should be raised 0.150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Microstrip substrates should be placed as close to the die as possible in
order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Figure 1.
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity:
strikes.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Follow ESD precautions to protect against ESD
Transients: Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pickup.
0.150mm (0.005”) Thick
Moly Tab
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Figure 2.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Amplifiers - Linear & Power - Chip
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
RF bonds made with two 1 mil wires are recommended. These bonds should be thermosonically bonded with a force
of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds
should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a
nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy should be applied to achieve reliable
bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm).
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
10