HMC424


Design Assistance

Customised Pack Sizes / Qtys

Assembly Assistance

Support for all industry recognised
supply formats:

Die handling consultancy

Hi-Rel die qualification

Hot & Cold die probing

Electrical test & trimming
o Waffle Pack
o Gel Pak
o Tape & Reel

Onsite storage, stockholding &
scheduling

100% Visual Inspection
o MIL-STD 883 Condition A
o MIL-STD 883 Condition A

On-site failure analysis

Bespoke 24 Hour monitored
storage systems for secure long
term product support

On-site failure analysis
Contact
[email protected]
For price, delivery and to place orders
HMC424
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HMC424
v06.0809
ATTENUATORS - DIGITAL - CHIP
1
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
Typical Applications
Features
The HMC424 is ideal for:
0.5 dB LSB Steps to 31.5 dB
• Fiber Optics & Broadband Telecom
Single Control Line Per Bit
• Microwave Radio & VSAT
±0.5 dB Typical Bit Error
• Military Radios, Radar & ECM
Die Size: 1.45 x 0.85 x 0.1 mm
• Space Applications
Functional Diagram
General Description
The HMC424 die is a broadband 6-bit GaAs IC digital
attenuator MMIC chip. Covering DC to 13 GHz, the
insertion loss is less then 4 dB typical. The attenuator bit values are 0.5 (LSB), 1, 2, 4, 8, and 16 dB for a
total attenuation of 31.5 dB. Attenuation accuracy is
excellent at ± 0.5 dB typical step error with an IIP3 of
+32 dBm. Six control voltage inputs, toggled between 0 and -5V, are used to select each attenuation
state. A single Vee bias of -5V allows operation at frequencies down to DC.
Electrical Specifi cations, TA = +25° C, With Vee = -5V & VCTL = 0/-5V
Parameter
Frequency (GHz)
Typ.
Max.
Units
Insertion Loss
DC - 8.0 GHz
8.0 - 13.0 GHz
Min.
3.0
4.0
3.8
4.6
dB
dB
Attenuation Range
DC - 13.0 GHz
31.5
dB
Return Loss (RF1 & RF2, All Atten. States)
DC - 8.0 GHz
8.0 - 13.0 GHz
12
15
dB
dB
8
11
Attenuation Accuracy: (Referenced to Insertion Loss)
0.5 - 7.5 dB States
8 - 31.5 dB States
Input Power for 0.1 dB Compression
Input Third Order Intercept Point
(Two-Tone Input Power= 0 dBm Each Tone)
REF State
All Other States
Switching Characteristics
± 0.3 + 4% of Atten. Setting Max
± 0.3 + 6% of Atten. Setting Max
dB
dB
1.0 - 13.0 Ghz
22
dBm
1.0 - 13.0 Ghz
46
32
dBm
dBm
30
50
ns
ns
DC - 13.0 GHz
tRISE, tFALL (10/90% RF)
tON/tOFF (50% CTL to 10/90% RF)
1-8
DC - 13.0 GHz
DC - 13.0 GHz
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC424
v06.0809
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
Return Loss RF1, RF2
0
-2
-5
-4
+25 C
+85 C
-55 C
-6
-8
0.5 dB
1 dB
2 dB
4 dB
8 dB
16 dB
31.5 dB
-10
-15
-20
-10
-25
0
3
6
9
12
15
0
3
6
FREQUENCY (GHz)
9
12
15
FREQUENCY (GHz)
Normalized Attenuation
(Only Major States are Shown)
Bit Error vs. Attenuation State
2
-5
0.1 GHz
4 GHz
8 GHz
13 GHz
1
-10
BIT ERROR (dB)
NORMALIZED ATTENUATION (dB)
0
-15
-20
0.5 dB
1 dB
2 dB
4 dB
-25
8 dB
16 dB
31.5 dB
0
-1
-30
-35
-2
0
3
6
9
12
0
15
4
8
FREQUENCY (GHz)
12
16
20
24
28
32
ATTENUATION STATE (dB)
Bit Error vs. Frequency
Relative Phase vs. Frequency
(Only Major States are Shown)
(Only Major States are Shown)
2
100
0.5 dB
1 dB
2 dB
4 dB
8 dB
16 dB
31.5 dB
80
8 dB
16 dB
31.5 dB
RELATIVE PHASE (deg)
0.5 dB
1 dB
2 dB
4 dB
1
BIT ERROR (dB)
ATTENUATORS - DIGITAL - CHIP
0
RETURN LOSS (dB)
INSERTION LOSS (dB)
1
(Only Major States are Shown)
Insertion Loss
0
-1
60
40
20
0
-2
-20
0
3
6
9
FREQUENCY (GHz)
12
15
0
3
6
9
12
15
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1-9
HMC424
v06.0809
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
1
Worst Case Step Error
Between Successive Attenuation States
Bias Voltage & Current
Vee Range= -5 Vdc ± 10%
1.5
1
STEP ERROR (dB)
ATTENUATORS - DIGITAL - CHIP
2
Vee
(Vdc)
Iee (Typ.)
(mA)
Iee (Max.)
(mA)
-5
2
5
0.5
0
-0.5
Control Voltage
-1
-1.5
-2
0
3
6
9
12
15
State
Bias Condition
Low
0 to -3V @ 35 μA Typ.
High
Vee to Vee +0.8V @ 5 μA Typ.
FREQUENCY (GHz)
Truth Table
Absolute Maximum Ratings
Control Voltage Input
V1
16 dB
Low
Low
Low
V2
8 dB
Low
Low
Low
V3
4 dB
Low
Low
Low
V4
2 dB
Low
Low
Low
V5
1 dB
Low
Low
High
V6
0.5 dB
Low
High
Low
Attenuation
State
RF1 - RF2
Reference
I.L.
0.5 dB
1 dB
Low
Low
Low
High
Low
Low
2 dB
Low
Low
High
Low
Low
Low
4 dB
Low
High
Low
Low
Low
Low
8 dB
High
Low
Low
Low
Low
Low
16 dB
High
High
High
High
High
High
31.5 dB
Any Combination of the above states will provide
an attenuation approximately equal to the sum of
the bits selected.
Control Voltage (V1 to V6)
Vee - 0.5 Vdc
Bias Voltage (Vee)
-7 Vdc
Channel Temperature
150 °C
Thermal Resistance
330 °C/W
Storage Temperature
-65 to + 150 °C
Operating Temperature
-55 to +85 °C
RF Input Power (0.5 - 13 GHz)
+25 dBm
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate
WP-8 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
1 - 10
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC424
v06.0809
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. TYPICAL BOND PAD IS .004” SQUARE.
3. TYPICAL BOND PAD SPACING IS .006”
CENTER TO CENTER EXCEPT AS NOTED.
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
ATTENUATORS - DIGITAL - CHIP
1
Outline Drawing
Pad Descriptions
Pad Number
Function
Description
GND
Die bottom must be connected to RF ground.
1, 3
RF1, RF2
This pad is DC coupled and matched to 50 Ohm. Blocking
capacitors are required if RF line potential is not equal to 0V.
2
VEE
Supply Voltage -5V ± 10%
4, 5, 6, 7, 8, 9
V1 - V6
See truth table and control voltage table.
Interface Schematic
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1 - 11
HMC424
v06.0809
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
ATTENUATORS - DIGITAL - CHIP
1
1 - 12
Suggested Driver Circuit
(One Circuit Required Per Bit Control Input)
Simple driver using inexpensive standard logic ICs provides fast switching using minimum DC current.
* Recommended value to suppress unwanted RF signals at V1 - V6 control lines.
Assembly Diagram
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC424
v06.0809
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be
used, the die should be raised 0.150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Microstrip substrates should brought as close to the die as possible in
order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Figure 1.
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity:
strikes.
Follow ESD precautions to protect against ESD
Transients: Suppress instrument and bias supply transients while bias
is applied. Use shielded signal and bias cables to minimize inductive
pick-up.
RF Ground Plane
0.150mm (0.005”) Thick
Moly Tab
ATTENUATORS - DIGITAL - CHIP
1
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Figure 2.
General Handling: Handle the chip along the edges with a vacuum collet
or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with
vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on
the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1 - 13