HMC1057


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
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
Assembly Assistance

Support for all industry recognised
supply formats:

Die handling consultancy

Hi-Rel die qualification

Hot & Cold die probing

Electrical test & trimming
o Waffle Pack
o Gel Pak
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
Onsite storage, stockholding &
scheduling

100% Visual Inspection
o MIL-STD 883 Condition A
o MIL-STD 883 Condition A

On-site failure analysis

Bespoke 24 Hour monitored
storage systems for secure long
term product support

On-site failure analysis
Contact
[email protected]
For price, delivery and to place orders
HMC1057
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HMC1057
v01.0413
MIXERS - SUB HARMONIC - CHIP
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Typical Applications
Features
The HMC1057 is ideal for:
Passive: No DC Bias Required
• Short Haul / High Capacity Radios
High Input IP3: 13 dBm [2]
• Test Equipment & Sensors
High LO/RF Isolation: 30 dB
• Military End-Use
High 2LO/RF Isolation: 50 dB
• E-Band Communications Systems
Wide IF Bandwidth: DC - 12 GHz
• Automotive Radar
Upconversion & Downconversion Applications
Die Size: 1.74 x 1.73 x 0.1 mm
Functional Diagram
General Description
The HMC1057 is a sub-harmonically pumped MMIC
Mixer which can be used as either an Image reject
mixer (IRM) or a single sideband upconverter. This
passsive MMIC mixer is fabricated with GaAs Shottky
diode technology. For downconversion applications,
an external quadrature hybrid can be used to select
the desired sideband while rejecting image signals. All
bond pads and the die backside are Ti/Au metallized
and the Shottky devices are fully passivated for
reliable operation. All data shown herein is measured
with the chip in a 50 Ohm environment and contacted
with RF probes.
Electrical Specifications, TA = +25° C, IF = 4 GHz, LO = +13 dBm, USB [1]
Parameter
Min.
Typ.
Max.
Units
RF Frequency Range
71 - 86
GHz
IF Frequency Range
DC - 12
GHz
LO Frequency Range
29 - 43
GHz
Conversion Loss
12
2LO to RF Isolation
50
dB
LO to RF Isolation
30
dB
LO to IF Isolation
35
dB
RF to IF Isolation
IP3 (Input)
[2]
15
dB
25
dB
+13
dBm
[1] Unless otherwise noted , all measurements performed as an Downconverter with LO = +13 dBm
[2] Upconverter performance .
1
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Data Taken As IRM with External IF 90° Hybrid, IF = 4000 MHz
0
-5
-5
-10
-15
-20
-25
-10
-15
-20
-25
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
+85 C
-55 C
80
85
90
+13 dBm
Image Rejection, USB vs. LO Power
50
IMAGE REJECTION (dBc)
50
IMAGE REJECTION (dBc)
75
+11 dBm
Image Rejection, USB vs. Temperature
40
30
20
10
0
40
30
20
10
0
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
70
75
80
85
90
RF FREQUENCY (GHz)
+85 C
-55 C
+11 dBm
RF Return Loss
+13 dBm
LO Return Loss
0
0
-5
-5
RETURN LOSS (dB)
RETURN LOSS (dB)
70
RF FREQUENCY (GHz)
MIXERS - SUB HARMONIC - CHIP
Conversion Gain, USB vs. LO Drive
0
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Conversion Gain, USB vs. Temperature
-10
-15
-10
-15
-20
-20
-25
-25
60
65
70
75
80
RF FREQUENCY (GHz)
+25 C
85
90
20
25
30
35
40
45
50
LO FREQUENCY (GHz)
+25 C
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
2
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Data Taken As IRM with External IF 90° Hybrid, IF = 4000 MHz
IF Return Loss
RF/IF Isolation
0
-10
ISOLATION (dB)
RETURN LOSS (dB)
-5
-10
-15
-20
-20
-30
-40
-50
-25
-60
0
3
6
9
12
15
60
65
IF FREQUENCY (GHz)
IF1
70
75
80
85
90
RF FREQUENCY (GHz)
IF2
RF/IF1
RF/IF2
Upconverter Performance
Conversion Gain, USB
LO Isolation
0
0
CONVERSION GAIN (dB)
-10
ISOLATION (dB)
MIXERS - SUB HARMONIC - CHIP
0
-20
-30
-40
-50
-5
-10
-15
-20
-60
-25
-70
30
33
36
39
42
60
45
65
2LO/RF
LO/RF
80
85
90
Upconverter Performance
Sideband Rejection , USB
50
SIDEBAND REJECTION (dBc)
0
CONVERSION GAIN (dB)
75
+25 C
LO/IF1
LO/IF2
Upconverter Performance Conversion
Gain vs. Input Power, USB
-5
-10
-15
-20
-25
40
30
20
10
0
75
78
81
84
87
RF FREQUENCY (GHz)
0 dBm
-4 dBm
-8 dBm
3
70
RF FREQUENCY (GHz)
LO FREQUENCY (GHz)
90
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
-10 dBm
-12 dBm
+25 C
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Data Taken As IRM with External IF 90° Hybrid, IF = 4000 MHz
Upconverter Performance Input IP3, USB
Conversion Gain, LSB vs. LO Drive
CONVERSION GAIN (dB)
15
IP3 (dBm)
10
5
0
-5
-5
-10
-15
-20
-25
-10
60
65
70
75
80
85
60
90
65
+25 C
80
85
90
+13 dBm
Upconverter Performance
Conversion Gain, LSB
50
0
40
-5
CONVERSION GAIN (dB)
IMAGE REJECTION (dBc)
75
+11 dBm
Image Rejection, LSB vs. LO Drive
30
20
10
0
-10
-15
-20
-25
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
70
75
80
85
90
RF FREQUENCY (GHz)
+11 dBm
+13 dBm
+25 C
Upconverter Performance
Sideband Rejection , LSB
Upconverter Performance Input IP3, LSB
50
25
40
20
IP3 (dBm)
SIDEBAND REJECTION (dBc)
70
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
MIXERS - SUB HARMONIC - CHIP
0
20
30
20
10
15
10
5
0
0
60
62
64
66
68
70
72
74
RF FREQUENCY (GHz)
+25 C
76
78
80
82
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
-3 dBm
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
4
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Data Taken As IRM with External IF 90° Hybrid, IF = 500 MHz
0
0
-5
-5
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Conversion Gain, USB vs. LO Drive
-10
-15
-20
-25
-10
-15
-20
-25
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
+85 C
80
85
90
+13 dBm
Image Rejection, USB vs. LO Drive
50
IMAGE REJECTION (dBc)
50
40
30
20
10
40
30
20
10
0
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
70
75
80
85
90
RF FREQUENCY (GHz)
+85 C
+11 dBm
-55 C
Conversion Gain, LSB vs. LO Drive
+13 dBm
Image Rejection, LSB vs. LO Drive
30
IMAGE REJECTION (dBc)
0
CONVERSION GAIN (dB)
75
+11 dBm
-55 C
0
-5
-10
-15
-20
-25
20
10
0
60
65
70
75
80
85
RF FREQUENCY (GHz)
+11 dBm
5
70
RF FREQUENCY (GHz)
Image Rejection, USB vs. Temperature
IMAGE REJECTION (dBc)
MIXERS - SUB HARMONIC - CHIP
Conversion Gain, USB vs. Temperature
90
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
+13 dBm
+11 dBm
+13 dBm
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Data Taken As IRM with External IF 90° Hybrid, IF = 2000 MHz
0
0
-5
-5
-10
-15
-20
-25
-10
-15
-20
-25
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
+85 C
-55 C
80
85
90
+13 dBm
Image Rejection, USB vs. LO Drive
50
IMAGE REJECTION (dBc)
50
IMAGE REJECTION (dBc)
75
+11 dBm
Image Rejection, USB vs. Temperature
40
30
20
10
0
40
30
20
10
0
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
70
75
80
85
90
RF FREQUENCY (GHz)
+85 C
-55 C
Conversion Gain, LSB vs. LO Drive
+11 dBm
+13 dBm
Image Rejection, LSB vs. LO Drive
30
IMAGE REJECTION (dBc)
0
CONVERSION GAIN (dB)
70
RF FREQUENCY (GHz)
MIXERS - SUB HARMONIC - CHIP
Conversion Gain, USB vs. LO Drive
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Conversion Gain, USB vs. Temperature
-5
-10
-15
-20
-25
20
10
0
60
65
70
75
80
85
RF FREQUENCY (GHz)
+11 dBm
90
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
+13 dBm
+11 dBm
+13 dBm
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
6
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Data Taken As IRM with External IF 90° Hybrid, IF = 8000 MHz
0
0
-5
-5
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Conversion Gain, USB vs. LO Drive
-10
-15
-20
-25
-10
-15
-20
-25
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
+85 C
-55 C
80
85
90
+13 dBm
Image Rejection, USB vs. LO Drive
50
IMAGE REJECTION (dBc)
50
40
30
20
10
40
30
20
10
0
60
65
70
75
80
85
60
90
65
+25 C
70
75
80
85
90
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
+85 C
-55 C
+11 dBm
Conversion Gain, LSB vs. LO Drive
+13 dBm
Image Rejection, LSB vs. LO Drive
50
IMAGE REJECTION (dBc)
0
CONVERSION GAIN (dB)
75
+11 dBm
0
-5
-10
-15
-20
-25
40
30
20
10
0
60
65
70
75
80
85
RF FREQUENCY (GHz)
+11 dBm
7
70
RF FREQUENCY (GHz)
Image Rejection, USB vs. Temperature
IMAGE REJECTION (dBc)
MIXERS - SUB HARMONIC - CHIP
Conversion Gain, USB vs. Temperature
90
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
+13 dBm
+11 dBm
+13 dBm
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Data Taken As IRM with External IF 90° Hybrid, IF = 12000 MHz
0
0
-5
-5
-10
-15
-20
-25
-10
-15
-20
-25
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
+85 C
80
85
90
+13 dBm
Image Rejection, USB vs. LO Drive
50
IMAGE REJECTION (dBc)
50
IMAGE REJECTION (dBc)
75
+11 dBm
-55 C
Image Rejection, USB vs. Temperature
40
30
20
10
0
40
30
20
10
0
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
70
75
80
85
90
RF FREQUENCY (GHz)
+85 C
-55 C
+11 dBm
Conversion Gain, LSB vs. LO Drive
+13 dBm
Image Rejection, LSB vs. LO Drive
50
IMAGE REJECTION (dBc)
0
CONVERSION GAIN (dB)
70
RF FREQUENCY (GHz)
MIXERS - SUB HARMONIC - CHIP
Conversion Gain, USB vs. LO Drive
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Conversion Gain, USB vs. Temperature
-5
-10
-15
-20
40
30
20
10
0
-25
60
65
70
75
80
85
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
+11 dBm
90
+13 dBm
+11 dBm
+13 dBm
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
8
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
MIXERS - SUB HARMONIC - CHIP
Table 1. Absolute Maximum Ratings
RF Power (LO = 13 dBm)
+7.5 dBm
LO Drive (RF = -10 dBm)
+20 dBm
IF Power
+5 dBm
Maximum Junction Temperature
175 °C
Thermal Resistance (RTH)
(junction to die bottom)
258 °C/W
Operating Temperature
-55°C to +85 °C
Storage Temperature
-65°C to 150 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Table 2. Die Packaging Information
Standard
Alternate
GP-1 (Gel Pack)
[2]
[1]
[1] For more information refer to the “Packaging
information” Document in the Product Support Section of
our website.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
9
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS 0.004”
3. BOND PADS 1, 2 & 3 are 0.0059” [0.150] X 0.0039” [0.099].
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. Overall die size ± 0.002
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Table 3. Pad Descriptions
Function
Description
1
RF
This pad is matched to 50 Ohms.
2, 4
IF1, IF2
These pads are matched to 50 Ohms.
3
LO
This pad is AC coupled
and Matched to 50 Ohms.
Die Bottom
GND
Die bottom must be connected to RF/DC
ground
Pad Schematic
Assembly Diagram
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
MIXERS - SUB HARMONIC - CHIP
Pad Number
10
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
MIXERS - SUB HARMONIC - CHIP
The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). One way to accomplish this is to attach the 0.102mm (4 mil)
thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab)
which is then attached to the ground plane (Figure 2).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
Microstrip substrates should be located as close to the die as possible
in order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
RF Ground Plane
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V
ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pickup.
General Handling: Handle the chip along the edges with a vacuum collet
or with a sharp pair of bent tweezers. The surface of the chip may have
fragile air bridges and should not be touched with vacuum collet, tweezers,
or fingers.
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Figure 1.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
0.150mm (0.005”) Thick
Moly Tab
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Figure 2.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on
the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
11
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1057
v01.0413
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
MIXERS - SUB HARMONIC - CHIP
Notes:
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
12