Pb Free Product BLM3050K N-Channel Enhancement Mode Power MOSFET Description The BLM3050K uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. It can be used in a wide variety of applications. General Features ● VDS =30V,ID =50A RDS(ON) < 11mΩ @ VGS=10V Schematic diagram RDS(ON) < 16mΩ @ VGS=5V ● High density cell design for ultra low Rdson ● Fully characterized Avalanche voltage and current ● Good stability and uniformity with high EAS ● Excellent package for good heat dissipation ● Special process technology for high ESD capability Application ● Power switching application ● Hard switched and high frequency circuits ● Uninterruptible Power Supply Marking and pin assignment 100% UIS TESTED! TO-252-2L top view Package Marking And Ordering Information Device Marking 3050K Device Device Package Reel Size Tape width Quantity BLM3050K TO-252-2L - - - Absolute Maximum Ratings (TC=25℃unless otherwise noted) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS Limit Unit 30 V ±20 V ID 50 A ID (100℃) 35 A Pulsed Drain Current IDM 140 A Maximum Power Dissipation PD 60 W 0.4 W/℃ EAS 70 mJ TJ,TSTG -55 To 175 ℃ Drain Current-Continuous Drain Current-Continuous(TC=100℃) Derating factor Single pulse avalanche energy (Note 5) Operating Junction and Storage Temperature Range Page1 www.belling.com.cn V2.0 Pb Free Product BLM3050K Thermal Characteristic Thermal Resistance,Junction-to-Case(Note 2) RθJC Electrical Characteristics (TC=25℃unless otherwise noted) Parameter Symbol Condition 2.5 ℃/W Min Typ Max Unit Off Characteristics Drain-Source Breakdown Voltage BVDSS VGS=0V ID=250μA 30 33 - V Zero Gate Voltage Drain Current IDSS VDS=30V,VGS=0V - - 1 μA Gate-Body Leakage Current IGSS VGS=±20V,VDS=0V - - ±100 nA Gate Threshold Voltage VGS(th) VDS=VGS,ID=250μA 1 1.6 3 V Drain-Source On-State Resistance RDS(ON) VGS=10V, ID=25A - 8 11 VGS=5V, ID=20A - 10 16 VDS=5V,ID=20A 15 - - S - 2000 - PF - 280 - PF - 160 - PF - 10 - nS On Characteristics (Note 3) Forward Transconductance gFS mΩ Dynamic Characteristics (Note4) Input Capacitance Clss Output Capacitance Coss Reverse Transfer Capacitance Crss VDS=15V,VGS=0V, F=1.0MHz Switching Characteristics (Note 4) Turn-on Delay Time td(on) Turn-on Rise Time tr VDD=15V,ID=20A - 8 - nS td(off) VGS=10V,RGEN=1.8Ω - 30 - nS - 5 - nS - 23 - nC - 7 - nC - 4.5 - nC - 0.85 1.2 V - - 40 A Turn-Off Delay Time Turn-Off Fall Time tf Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd VDS=10V,ID=25A, VGS=10V Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) VSD VGS=0V,IS=25A Diode Forward Current (Note 2) IS Reverse Recovery Time trr TJ = 25°C, IF = 40A - 22 35 nS Reverse Recovery Charge Qrr di/dt = 100A/μs(Note3) - 12 20 nC Forward Turn-On Time ton Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production 5. EAS condition:Tj=25℃, VDD=15V,VG=10V,L=1mH, Rg=25Ω Page2 www.belling.com.cn V2.0 Pb Free Product BLM3050K Test circuit 1)EAS test Circuits 2)Gate charge test Circuit: 3)Switch Time Test Circuit: Page3 www.belling.com.cn V2.0 Pb Free Product BLM3050K ID- Drain Current (A) Normalized On-Resistance Typical Electrical And Thermal Characteristics (Curves) TJ-Junction Temperature(℃) Vds Drain-Source Voltage (V) Figure 4 Rdson-JunctionTemperature ID- Drain Current (A) Vgs Gate-Source Voltage (V) Figure 1 Output Characteristics Qg Gate Charge (nC) Figure 2 Transfer Characteristics Figure 5 Gate Charge Is- Reverse Drain Current (A) Rdson On-Resistance Normalized Vgs Gate-Source Voltage (V) ID- Drain Current (A) Figure 3 Rdson- Drain Current Page4 Vsd Source-Drain Voltage (V) Figure 6 Source- Drain Diode Forward www.belling.com.cn V2.0 Pb Free Product Normalized BVdss C Capacitance (pF) BLM3050K TJ-Junction Temperature(℃) Vds Drain-Source Voltage (V) Figure 9 BVDSS vs Junction Temperature ID- Drain Current (A) Figure 7 Capacitance vs Vds TJ-Junction Temperature(℃) Vds Drain-Source Voltage (V) Safe Operation Area Figure 10 VGS(th) vs Junction Temperature r(t),Normalized Effective Transient Thermal Impedance Figure 8 Square Wave Pluse Duration(sec) Figure 11 Normalized Maximum Transient Thermal Impedance Page5 www.belling.com.cn V2.0 Pb Free Product BLM3050K TO-252-2L Package Information Page6 www.belling.com.cn V2.0