VJ Soldering Recommendations www.vishay.com Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection (1) • The termination selected depends on the assembly method to be used and the requirements of the application. • Reflow solder assembly: select termination code “X”. For CDR-MIL-PRF 55681 product, select termination code “W” or “Y”. • Wave solder assembly: select termination code “X”. For CDR-MIL-PRF 55681 product, select termination code “W” or “Y”. • Additional board flex protection: select the polymer termination code “B”. • Conductive epoxy assembly: select termination code “F” and “E” (2) For CDR-MIL-PRF 55681 and DSCC product, select termination code “M”. • Non-magnetic requirements: select termination code “C” for solder assembly, or “N” for conductive epoxy assembly. • Lead-bearing requirements: select termination code “L” For CDR-MIL-PRF 55681 and DSCC product, select termination code “Z” or “U”. Notes (1) Where applicable, see datasheets (2) Termination code “E” is for conductive epoxy assembly, contact [email protected] for availability. 2. Chip Size vs. Solder Profile A. 0402, 0505, 0603, 0805, 1111, 1206, and 1210 (thickness 0.049", 1.24 mm) can be used in all three solder systems shown on the following page. 1111, 1210 to 1812 with a thickness > 0.049" (1.24 mm) and case size 1825 and larger should not be wave soldered. B. Solder profiles should be properly controlled to minimize any thermal shock to the capacitor(s). 5. Soldering Techniques Generalized soldering curves shown on next page. 6. Soldering with a Solder Iron Attachment by soldering iron is not recommended. A heat shock may cause a crack in the MLCC chip capacitors, however, if solder iron is used, the following precautions should be taken: A. Preheat the chip capacitor to +150 °C minimum. Use hot plate or hot air flow for preheat. B. Use a low wattage, temperature controlled iron. C. Tip temperature setting 280 °C and a maximum soldering time of 5 s. D. Use a soldering tip no greater than 0.120" (3.0 mm) in diameter. Apply the transmission of heat through the soldering material. E. When removal of chip capacitor is necessary, a hot air pencil is the preferred tool. 7. Cool Down After soldering, allow the chip to cool at room ambient conditions. Using forced cool air or refrigerated air for expediting the cooling process is not recommended and can create thermal shock cracks and may facilitate board bend stresses. 8. Cleaning Selection of an appropriate cleaning solvent is dependent upon the type of flux used. Cleaning in alcohol, water, hydrocarbons or any of the common, halogenated degreaser solvents is not detrimental to Vishay chip capacitors. (See recommended solder profiles on the following page.) 3. Soldering Flux Use mildly activated rosin flux RMA or RA types or low residue liquid fluxes (no-clean flux). Flux residues from no-clean flux can be removed with aqueous cleaners. During wave soldering ensure that the majority of solvents are removed at preheat. 4. Solder Type Both, lead containing solders, such as Sn60, Sn62 or Sn63 and lead free solders, such as SnAgCu, can be used with our MLCCs. In case of non-magnetic termination code “C”, use lead containing or lead (Pb)-free SAC405 solders. Revision: 08-Jun-15 Document Number: 45034 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VJ Soldering Recommendations www.vishay.com Vishay WAVE AND REFLOW SOLDERING GRAPHS WAVE SOLDERING 300 T (°C) 250 T (°C) SECOND WAVE 235 °C to 260 °C 200 300 MAX. TEMPERATURE 250 > 215 °C 20 ~ 40 s ~ ~ 5 K/s FIRST WAVE 200 ~ ~ 2 K/s ~ 200 K/s ~ 150 100 IR REFLOW WITH SnPb SOLDER 10 s 150 MIN. TEMPERATURE 100 °C to 130 °C 100 FORCED COOLING ~ 2 ~ K/s 50 Sn-Pb EUTECTIC SOLDER PASTE 50 0 0 0 50 100 150 200 t (s) 250 30 ~ 60 s 30 ~ 60 s 30 ~ 60 s TIME LEAD (Pb)-FREE SOLDERING PROFILE 300 MIN. 300 s MIN. 255 °C MAX. 260 °C TEMPERATURE (°C) 250 T (SOLID) MIN. 217 °C MIN. 190 °C 200 MIN. 40 s MIN. 90 s 150 100 RAMP DOWN FROM T (SOLID) MAX. 6 K/s RAMP UP TO 150 °C MAX. 3 K/s 50 MIN. 110 s 0 0 Revision: 08-Jun-15 50 100 150 200 250 300 350 400 TIME (s) Document Number: 45034 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VJ Soldering Recommendations www.vishay.com Vishay WAVE AND REFLOW SOLDERING WAVE SOLDERING Vishay offers the following recommendations: 1. Set dwell time in the solder wave 2 s to 3 s. Solder pot set at +240 °C to +260 °C. Belt speed at 3 feet/min to 5 feet/min. 2. Adjust flux station (foam, spray or wave) topside preheat at +80 °C to +105 °C. 3. Set preheat +160 °C below the solder wave temperature. Usually maximum underside PC board temperature at last preheat zone is +150 °C. Preheat rate should be 1.5 °C/s to 2.5 °C/s. 4. Do not force cool the PC board. Maintain a uniform profile. 5. Finally check that the delta difference between the solder temperature and the temperature as the PC board leaves the last preheat zone is +160 °C or less. Chip size and mass make some types more prone to thermal shocking during the soldering operation, leading to insulation resistance (IR) failures in use. REFLOW SOLDERING (SnPb - Solder) The reflow soldering process using no-clean solder paste for mounting ceramic chip capacitors has wide acceptance. Chip capacitors may develop thermally induced cracks if the temperature changes in reflow process are not controlled. Vishay offers the following recommendations: 1. Set peak reflow temperature at +215 °C to +260 °C based on paste melting point. 2. First preheat zone temperature elevation at +150 °C ± 10 °C, ramp rate 3 °C/s. 3. Second preheat zone temperature +150 °C ± 10 °C, ramp rate of 0.1 °C/s. Set preheat for 60 s. Long preheat times could cause solder balls near the capacitor/other components. 4. Adjust reflow zone temperatures to +150 °C ± 10 °C to +225 °C ± 5 °C at ramp of 4 °C/s to 5 °C/s. Total time at reflow over +200 °C should not exceed 15 s to 20 s. 5. Use natural cooling at the final cooling zone. Maintain a uniform profile no more than -3 °C/s. Vishay does not recommend wave soldering for chip size 1111, 1210 to 1812 with a thickness > 0.049" (1.24 mm) and case size 1825 and larger should not be wave soldered. VAPOR PHASE REFLOW TEMPERATURE (°C) ENTRANCEPREHEAT REFLOW ZONE COOL DOWN ZONE 215 200 150 With vapor phase reflow, heat reaches the product uniformly and quickly because of vapor condensation heating. During condensation heating a dense vapor condenses on all exposed surfaces. Due to the inherent low boiling point (+215 °C) for liquids used in vapor phase, ceramic chips can be reflowed without thermal shock damage. Vishay offers the following recommendations: 1. Preheat or pre-bake zone duration should be about 1.5 min to 2 min. Infrared heating can be used for preheat sections. 2. Vapor phase zone maximum temperature is +215 °C with typical settings at +210 °C. 3. Total duration is typically 4 min to 5 min, use natural cooling at the final cooling zone. 100 50 0 1 2 3 4 TIME (min) SOLDERING ZONE RANGE Revision: 08-Jun-15 RECOMMENDED AREA Document Number: 45034 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000