VJ Soldering Recommendations

VJ Soldering Recommendations
www.vishay.com
Vishay
Surface Mount Multilayer Ceramic Chip Capacitors
SOLDERING RECOMMENDATIONS
1. Termination Selection (1)
• The termination selected depends on the assembly
method to be used and the requirements of the
application.
• Reflow solder assembly: select termination code “X”.
For CDR-MIL-PRF 55681 product, select termination
code “W” or “Y”.
• Wave solder assembly: select termination code “X”.
For CDR-MIL-PRF 55681 product, select termination
code “W” or “Y”.
• Additional board flex protection: select the polymer
termination code “B”.
• Conductive epoxy assembly: select termination code
“F” and “E” (2) 
For CDR-MIL-PRF 55681 and DSCC product, select
termination code “M”.
• Non-magnetic requirements: select termination code
“C” for solder assembly, or “N” for conductive epoxy
assembly.
• Lead-bearing requirements: select termination code “L”
For CDR-MIL-PRF 55681 and DSCC product, select
termination code “Z” or “U”.
Notes
(1) Where applicable, see datasheets
(2) Termination code “E” is for conductive epoxy assembly, contact
[email protected] for availability.
2. Chip Size vs. Solder Profile
A. 0402, 0505, 0603, 0805, 1111, 1206, and 1210
(thickness  0.049", 1.24 mm) can be used in all three
solder systems shown on the following page.
1111, 1210 to 1812 with a thickness > 0.049" (1.24 mm)
and case size 1825 and larger should not be wave
soldered.
B. Solder profiles should be properly controlled to minimize
any thermal shock to the capacitor(s).
5. Soldering Techniques
Generalized soldering curves shown on next page.
6. Soldering with a Solder Iron
Attachment by soldering iron is not recommended. A heat
shock may cause a crack in the MLCC chip capacitors,
however, if solder iron is used, the following precautions
should be taken:
A. Preheat the chip capacitor to +150 °C minimum. Use hot
plate or hot air flow for preheat.
B. Use a low wattage, temperature controlled iron.
C. Tip temperature setting  280 °C and a maximum
soldering time of 5 s.
D. Use a soldering tip no greater than 0.120" (3.0 mm) in
diameter. Apply the transmission of heat through the
soldering material.
E. When removal of chip capacitor is necessary, a hot air
pencil is the preferred tool.
7. Cool Down
After soldering, allow the chip to cool at room ambient
conditions. Using forced cool air or refrigerated air for
expediting the cooling process is not recommended and
can create thermal shock cracks and may facilitate board
bend stresses.
8. Cleaning
Selection of an appropriate cleaning solvent is dependent
upon the type of flux used. Cleaning in alcohol, water,
hydrocarbons or any of the common, halogenated
degreaser solvents is not detrimental to Vishay chip
capacitors.
(See recommended solder profiles on the following page.)
3. Soldering Flux
Use mildly activated rosin flux RMA or RA types or low
residue liquid fluxes (no-clean flux). Flux residues from
no-clean flux can be removed with aqueous cleaners.
During wave soldering ensure that the majority of solvents
are removed at preheat.
4. Solder Type
Both, lead containing solders, such as Sn60, Sn62 or Sn63
and lead free solders, such as SnAgCu, can be used with
our MLCCs.
In case of non-magnetic termination code “C”, use lead
containing or lead (Pb)-free SAC405 solders.
Revision: 08-Jun-15
Document Number: 45034
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VJ Soldering Recommendations
www.vishay.com
Vishay
WAVE AND REFLOW SOLDERING GRAPHS
WAVE SOLDERING
300
T
(°C)
250
T
(°C)
SECOND WAVE
235 °C to 260 °C
200
300
MAX. TEMPERATURE
250
> 215 °C 20 ~ 40 s
~
~ 5 K/s
FIRST WAVE
200
~
~ 2 K/s
~ 200 K/s
~
150
100
IR REFLOW WITH SnPb SOLDER
10 s
150
MIN. TEMPERATURE
100 °C to 130 °C
100
FORCED
COOLING
~
2
~ K/s
50
Sn-Pb EUTECTIC SOLDER PASTE
50
0
0
0
50
100
150
200 t (s) 250
30 ~ 60 s
30 ~ 60 s
30 ~ 60 s
TIME
LEAD (Pb)-FREE SOLDERING PROFILE
300
MIN. 300 s
MIN. 255 °C
MAX. 260 °C
TEMPERATURE (°C)
250
T (SOLID) MIN. 217 °C
MIN. 190 °C
200
MIN. 40 s
MIN. 90 s
150
100
RAMP DOWN
FROM T (SOLID)
MAX. 6 K/s
RAMP UP
TO 150 °C
MAX. 3 K/s
50
MIN. 110 s
0
0
Revision: 08-Jun-15
50
100
150
200
250
300
350
400
TIME (s)
Document Number: 45034
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VJ Soldering Recommendations
www.vishay.com
Vishay
WAVE AND REFLOW SOLDERING

WAVE SOLDERING
Vishay offers the following recommendations:
1. Set dwell time in the solder wave 2 s to 3 s. Solder pot
set at +240 °C to +260 °C. Belt speed at 3 feet/min to 5
feet/min.
2. Adjust flux station (foam, spray or wave) topside preheat
at +80 °C to +105 °C.
3. Set preheat  +160 °C below the solder wave
temperature. Usually maximum underside PC board
temperature at last preheat zone is +150 °C. Preheat
rate should be 1.5 °C/s to 2.5 °C/s.
4. Do not force cool the PC board. Maintain a uniform
profile.
5. Finally check that the delta difference between the
solder temperature and the temperature as the PC
board leaves the last preheat zone is +160 °C or less.
Chip size and mass make some types more prone to
thermal shocking during the soldering operation,
leading to insulation resistance (IR) failures in use.

REFLOW SOLDERING (SnPb - Solder)
The reflow soldering process using no-clean solder paste
for mounting ceramic chip capacitors has wide acceptance.
Chip capacitors may develop thermally induced cracks if the
temperature changes in reflow process are not controlled.
Vishay offers the following recommendations:
1. Set peak reflow temperature at +215 °C to +260 °C
based on paste melting point.
2. First preheat zone temperature elevation at +150 °C
± 10 °C, ramp rate 3 °C/s.
3. Second preheat zone temperature +150 °C ± 10 °C,
ramp rate of 0.1 °C/s. Set preheat for  60 s. Long
preheat times could cause solder balls near the
capacitor/other components.
4. Adjust reflow zone temperatures to +150 °C ± 10 °C to
+225 °C ± 5 °C at ramp of 4 °C/s to 5 °C/s. Total time at
reflow over +200 °C should not exceed 15 s to 20 s.
5. Use natural cooling at the final cooling zone. Maintain a
uniform profile no more than -3 °C/s.
Vishay does not recommend wave soldering for chip size
1111, 1210 to 1812 with a thickness > 0.049" (1.24 mm) and
case size 1825 and larger should not be wave soldered.
VAPOR PHASE REFLOW

TEMPERATURE (°C)
ENTRANCEPREHEAT
REFLOW
ZONE
COOL DOWN
ZONE
215
200
150
With vapor phase reflow, heat reaches the product uniformly
and quickly because of vapor condensation heating. During
condensation heating a dense vapor condenses on all
exposed surfaces. Due to the inherent low boiling point
(+215 °C) for liquids used in vapor phase, ceramic chips can
be reflowed without thermal shock damage. Vishay offers
the following recommendations:
1. Preheat or pre-bake zone duration should be about
1.5 min to 2 min. Infrared heating can be used for preheat
sections.
2. Vapor phase zone maximum temperature is +215 °C
with typical settings at +210 °C.
3. Total duration is typically 4 min to 5 min, use natural
cooling at the final cooling zone.
100
50
0
1
2
3
4
TIME (min)
SOLDERING ZONE RANGE
Revision: 08-Jun-15
RECOMMENDED AREA
Document Number: 45034
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000