TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1002 Series SP1002 Series 5pF 8kV Bidirectional TVS Array RoHS Pb GREEN Description Back-to-Back Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-42 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features SP1002-01JTG SP1002-02JTG (SC70-3) (SC70-5) 1 5 1 NC NC 2 4 3 Functional Block Diagram SP1002-01JTG • Low leakage current of 0.5μA (MAX) at 5V • ESD protection of ±8kV contact discharge, ±15kV air discharge, (Level 4, IEC61000-4-2) • Small package saves board space • Lightning Protection, IEC61000-4-5, 2A (8/20µs) • EFT protection, IEC61000-4-4, 40A (5/50ns) Applications SP1002-02JTG 1 1 • Low capacitance of 5pF (TYP) I/O to I/O 3 • Computer Peripherals • LCD/PDP TVs • Mobile Phones • Set Top Boxes • Digital Cameras • DVD Players •Desktops/Notebooks •MP3/PMP Application Example 2 5 4 Additional Information MultiMedia Device MultiMedia Device Audio Out L Audio In L Audio Out R Audio In R 2 x SP1002-01 Datasheet Resources Samples SCART MultiMedia Application of SP1002-01 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1002 Series Absolute Maximum Ratings Symbol IPP Thermal Information Parameter Value Units Peak Current (tp=8/20μs) 2 A Storage Temperature Range Parameter Rating Units –55 to 150 °C 150 °C 260 °C Thermal Resistance Junction to Ambient 539.03 °C/W Thermal Resistance Junction to Case 404.99 °C/W Power Dissipation 0.188 W TOP Operating Temperature –40 to 125 °C Maximum Junction Temperature TSTOR Storage Temperature –55 to 150 °C Maximum Lead Temperature (Soldering 20s-40s) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min VD IR=1mA 6.0 Reverse Standoff Voltage VRWM IR≤1µA with 1 I/O at GND Leakage Current ILEAK Voltage Drop Dynamic Resistance RDYN ESD Withstand Voltage1,2 VESD Diode Capacitance VR=5V with I/O at GND VC Clamp Voltage1 1 Typ Max Units 9.5 V 6.0 V 0.5 µA IPP=1A, tp=8/20µs, Fwd 9.2 13.0 V IPP=2A, tp=8/20µs, Fwd 11.2 16.0 (VC2 - VC1) / (IPP2 - IPP1) 2.0 V Ω IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV CD Reverse Bias=0V 6 pF Reverse Bias=2.5V 5 pF Reverse Bias=5V 5 pF Notes: 1 2 Parameter is guaranteed by device characterization A minimum of 1,000 ESD pulses are applied at 1s intervals Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition tS time to peak temperature Time TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1002 Series Package Dimensions — SC70-3 B Package Solder Pad Layout 1.30 [0.0512] 3 0.65 [0.0256] 0.70 [0.0276] E HE 2 1 e e 1.90 [0.0748] D A2 A 0.90 [0.0354] A1 C L SC70-3 Pins 3 JEDEC MO-203 Millimeters Min Inches Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.66 BSC e 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SC70-5 e e 6 5 not used Package 4 Solder Pad Layout E 1 2 SC70-5 Pins 5 JEDEC MO-203 HE 3 B D A2 A A1 Millimeters Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.65 BSC e C L Inches Min 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1002 Series Part Numbering System Part Marking System B** SP 1002 – ** J T G TVS Diode Arrays (SPA® Diodes) B** G= Green Product Series Number of Channels (varies) B = SP1002 Series Assembly Site T= Tape & Reel (varies) Series Number of Channels Ordering Information Package -01 = 1 Channel -02 = 2 Channel J = SC70-3 SC70-5 Part Number Package Marking Min. Order Qty. SP1002-01JTG SC70-3 B*1 3000 SP1002-02JTG SC70-5 B*2 3000 Embossed Carrier Tape & Reel Specification — SC70-3 PO Millimetres ØD W F P KO AO A1 BO B1 ØD1 Min t E P2 K1 E F P2 D D1 P0 10P0 W P A0 A1 B0 B1 K0 K1 t Max Inches Min Max 1.65 1.85 3.45 3.55 1.95 2.05 1.40 1.60 1.00 1.25 3.90 4.10 40.0 ± 0.20 7.70 8.10 3.90 4.10 2.30 2.50 1.00 Ref 2.30 2.50 1.90 Ref 1.10 1.30 0.60 Ref 0.27 max 0.065 0.073 0.135 0.139 0.077 0.081 0.055 0.063 0.039 0.049 0.154 0.161 1.574 ± 0.008 0.303 0.318 0.153 0.161 0.090 0.098 0.039 Ref 0.090 0.098 0.074 0.043 0.051 0.023 Ref 0.010 Millimetres Inches Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/26/16 Max 1.65 1.85 3.45 3.55 1.95 2.05 1.40 1.60 1.00 1.25 3.90 4.10 40.0 ± 0.20 7.70 8.10 3.90 4.10 2.14 2.34 2.24 2.44 1.12 1.32 0.27 max Min Max 0.065 0.073 0.135 0.139 0.077 0.081 0.055 0.063 0.039 0.049 0.154 0.161 1.574 ± 0.008 0.303 0.318 0.153 0.161 0.084 0.092 0.088 0.096 0.044 0.052 0.010 max