TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1011 Series SP1011 Series 7pF 15kV Unidirectional TVS Array RoHS Pb GREEN Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protection highspeed signal pins. Pinout Features • E SD, IEC61000-4-2, ±15kV contact, ±30kV air I/O (1) I/O (4) GND GND • L ightning, IEC61000-4-5, 2A (tp=8/20µs) I/O (3) • L ow capacitance of 7 pF (TYP) per I/O @ 2.5V I/O (2) µDFN-6 (1.25x1.0x0.5mm) 5 • E FT protection IEC61000-4-4, 40A (5/50ns) • L ow leakage current of 1µA (MAX) at 5V Functional Block Diagram 6 • T iny μDFN( JEDEC MO229) package (1.25mm x 1.0mm x 0.5mm) Applications 4 • LCD/PDP TV • Mobile Phone • DVD Player • Notebook • Desktop • MP3/PMP • Set Top Box • Digital camera Application Example 1 2 3 Keyboard Controller Input Additional Information Resources Samples Outside World Datasheet D1 D2 D3 D4 SP1011-04UTG Shield Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/10/13 Signal Ground TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1011 Series Absolute Maximum Ratings Symbol Parameter Value Units 2 A Operating Temperature –40 to 125 °C Storage Temperature –55 to 150 °C IPP Peak Pulse Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min VR IR = 1mA 6.0 Reverse Standoff Voltage VRWM IR≤1µA Reverse Leakage Current ILEAK VR = 5V Reverse Voltage Drop Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 Typ Max Units 8.5 V 6 V 1 µA 0.1 IPP=1A, tp=8/20μs, Fwd 8.7 V IPP=2A, tp=8/20μs, Fwd 10.2 V (VC2 - VC1) / (IPP2 - IPP1) 1.5 Ω IEC61000-4-2 (Contact Discharge) ±15 kV IEC61000-4-2 (Air Discharge) ±30 kV CD Reverse Bias = 0V 12 Reverse Bias = 2.5V 7 15 pF pF Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND 14.0 5 12.0 0 10.0 -5 Attenuation (dB) Capacitance (pF) Capacitance vs. Reverse Bias 8.0 6.0 4.0 2.0 0.0 -10 -15 -20 -25 0.0 0.5 1.0 1.5 2.0 2.5 DC Bias (V) 3.0 3.5 4.0 4.5 5.0 -30 10 100 1000 10000 Frequency (MHz) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/10/13 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1011 Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max - Temperature (TL) (Liquidus) Reflow 217°C Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 60 – 150 seconds - Temperature (tL) tP TP Temperature Reflow Condition 25 tS time to peak temperature Time Package Dimensions — µDFN-6 (1.25x1.0x0.5mm) Top View D Package Bottom View JEDEC ℮ A 0.05 C 6 5 4 4 5 6 0.05 C L E 1 2 3 Pin 1 chamfer 0.10 x 45’ 3 B Pin 1 Index Area 2 1 A1 A A3 Seating plane b C Max Min Max 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 0.127 REF b 0.15 0.25 0.006 0.010 1.20 1.30 0.047 0.051 D2 - - - - E 0.95 1.05 0.037 0.041 E2 - - - - L 0.4 0.3 0.1 0.3 Total:+/- 0.01mm 0.005 REF D 0.05 M C 0.4 1.1 Min 0.45 e 1.1 Inches A 0.10 M C A B Recommanded Soldering Pad for µDFN-6L 1.25 x1.0x0.5 mm © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/10/13 Symbol MO-229 Millimeters A3 Side View 0.05 C µDFN-6 (1.25x1.0x0.5mm) 0.4 REF 0.25 0.016 REF 0.35 0.010 0.014 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1011 Series Part Numbering System Product Characteristics SP 1011 – 04 U T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Package U: µDFN-6 Series Number of Channels Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : Part Marking System 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. O *4 Product Series O = SP1011 O*4 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Number of Channels 5. Package surface matte finish VDI 11-13. Assembly Site (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP1011-04UTG µDFN-6 (1.25x1.0x0.5mm) O4 3000 Embossed Carrier Tape & Reel Specification —µDFN-6 (1.25x1.0x0.5mm) t W E D P2 K0 A0 Inches Min Max Min Max 1.65 1.85 0.06 0.07 F 3.45 3.55 0.14 0.14 D1 0.50 0.65 0.02 0.03 D B0 P0 Millimeters E P0 F D1 Symbol 10P0 1.50 MIN 3.90 4.10 40.0 ± 0.20 0.06 MIN 0.15 0.16 1.57 ± 0.01 W 7.90 8.30 0.31 0.33 P2 1.95 2.05 0.08 0.08 A0 1.09 1.19 0.04 0.05 B0 1.42 1.52 0.06 0.06 K0 0.71 0.81 0.03 0.03 t 0.25 TYP 0.01 TYP © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/10/13