TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series SP1005 Series 30pF 30kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP1005 includes back-to-back Zener diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Pinout Features 0201 Flipchip 1 2 • Low leakage current of 0.1μA at 5V • EFT, IEC61000-4-4, 40A (5/50ns) • Space efficient 0201 and 0402 footprint • Lightning, IEC61000-4-5, 10A (tP=8/20μs) • AEC-Q101 qualified (SOD882 package) • Low capacitance of 30pF (@ VR=0V) SOD882 1 • ESD, IEC61000-4-2, ±30kV contact, ±30kV air Applications 2 (AEC-Q101 qualified) • Mobile Phones • MP3/PMP • Smart Phones • Camcorders • Portable Navigation Devices • Portable Medical • Tablets • Digital Cameras • Point of Sale Terminals Application Example Functional Block Diagram Keypads 2 1 Outside World I/O Controller P1 P2 P3 P4 IC SP1005 (x4) Additional Information GND Datasheet Resources Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/31/15 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series Absolute Maximum Ratings Symbol Parameter Value Units 10.0 1 IPP Peak Current (tp=8/20μs) A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C 8.0 2 Notes: 1. “1 “ indicates SP1005-01WTG , while “2” indicates SP1005-01ETG 2. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Rating Units –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ Max Units 6.0 V Breakdown Voltage VBR IR=1mA 8.5 9.5 V Leakage Current ILEAK VR=5V with 1 pin at GND 0.1 0.5 μA Clamp Voltage1 VC Dynamic Resistance RDYN 2 ESD Withstand Voltage1 VESD IPP=1A, tp=8/20µs, Fwd 9.3 V IPP=2A, tp=8/20µs, Fwd 10.0 V IPP=10A, tP=8/20μs, Fwd 15.6 V TLP, tp =100ns, I/O to GND 0.28 Ω IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV CD Diode Capacitance1 Reverse Bias=0V 30 pF Reverse Bias=2.5V 23 pF Notes: 1. Parameter is guaranteed by design and/or device characterization. 2. Transmission Line Pulse (TLP) with 100ns width and 200[s rise time. Capacitance vs. Reverse Bias Pulse Waveform 110% 40.0 100% 35.0 90% 80% 25.0 Percent of IPP Capacitance (pF) 30.0 20.0 15.0 10.0 70% 60% 50% 40% 30% 20% 5.0 10% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Bias Voltage (V) 3.5 4.0 4.5 5.0 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/31/15 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series Clamping Voltage vs. IPP Insertion Loss (S21) I/O to GND 18.0 5 16.0 0 Attenuation (dB) Clamp Voltage (VC) 14.0 12.0 10.0 8.0 6.0 -5 -10 -15 -20 -25 4.0 -30 2.0 -35 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 1 10.0 10 100 Peak Pulse Current-IPP (A) 1000 10000 Frequency (MHz) Transmission Line Pulsing(TLP) Plot Product Characteristics of SOD-882 Package 22 Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 20 18 TLP Current (A) 16 14 12 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 TLP Voltage (V) Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/31/15 Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition tS time to peak temperature Time TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series Part Marking System Part Numbering System SP 1005 – 01 x T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Number of Channels a SP1005-01ETG SP1005-01WTG Package W: 0201 Flipchip E: SOD882 Ordering Information Part Number Package Marking Min. Order Qty. SP1005-01WTG 0201 Flipchip • 10,000 SP1005-01ETG SOD882 •a 10,000 Package Dimensions — 0201 Flipchip 0201 Flipchip Symbol 0.30 A 0.28 B F 0.75 0.19 C *Sizes in mm G D E D Millimeters Inches Min Typ Max Min Typ Max A 0.595 0.620 0.645 0.0234 0.0244 0.0254 B 0.295 0.320 0.345 0.0116 0.0126 0.0136 C 0.245 0.275 0.305 0.0096 0.0108 0.0120 D 0.145 0.150 0.155 0.0057 0.0059 0.0061 E 0.245 0.250 0.255 0.0096 0.0098 0.0100 F 0.245 0.250 0.255 0.0096 0.0098 0.0100 G 0.005 0.010 0.015 0.0002 0.0004 0.0006 Recommended Solder Pad Footprint Package Dimensions — SOD882 Symbol 0.325 0.325 0.650 0.650 0.975 Package SOD882 JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max A 0.90 1.00 1.10 0.035 0.039 0.043 B 0.50 0.60 0.70 0.020 0.024 0.028 C 0.40 0.50 0.60 0.016 0.020 0.024 0.45 D 0.018 E 0.20 0.25 0.35 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 Recommended Soldering Pad Layout © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/31/15 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series Embossed Carrier Tape & Reel Specification — 0201 Flipchip P1 P2 D P0 E F W D1 T A0 Symbol Millimeters A0 0.41±0.03 B0 0.70±0.03 D ø 1.50 + 0.10 D1 ø 0.20 ± 0.05 E 1.75±0.10 F 3.50±0.05 K0 0.38±0.03 P0 2.00±0.05 P1 2.00±0.05 P2 4.00±0.10 W 8.00 + 0.30 -0.10 T 0.23±0.02 K0 B0 Embossed Carrier Tape & Reel Specification — SOD882 D evice Orientation in Tape Pin 1 Location © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/31/15 Symbol Millimeters A0 0.70±0.045 B0 1.10±0.045 K0 0.65±0.045 F 3.50±0.05 P1 2.00±0.10 W 8.00 + 0.30 -0.10