SP1002 Series 5pF 8kV bidirectional TVS Array

TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1002 Series
SP1002 Series 5pF 8kV Bidirectional TVS Array
RoHS
Pb GREEN
Description
Back-to-Back Zener diodes fabricated in a proprietary
silicon avalanche technology protect each I/O pin to provide
a high level of protection for electronic equipment that
may experience destructive electrostatic discharges (ESD).
These robust diodes can safely absorb repetitive ESD
strikes at the maximum level specified in the IEC 61000-42 international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting highspeed signal pins.
Pinout
Features
SP1002-01JTG
SP1002-02JTG
(SC70-3)
(SC70-5)
1
5
1
NC
NC
2
4
3
Functional Block Diagram
SP1002-01JTG
• Low leakage current of
0.5μA (MAX) at 5V
• ESD protection of ±8kV
contact discharge, ±15kV
air discharge, (Level 4,
IEC61000-4-2)
• Small package saves
board space
• Lightning Protection,
IEC61000-4-5, 2A (8/20µs)
• EFT protection,
IEC61000-4-4, 40A
(5/50ns)
Applications
SP1002-02JTG
1
1
• Low capacitance of 5pF
(TYP) I/O to I/O
3
• Computer Peripherals
• LCD/PDP TVs
• Mobile Phones
• Set Top Boxes
• Digital Cameras
• DVD Players
• Desktops/Notebooks
• MP3/PMP
Application Example
2
5
4
Additional Information
MultiMedia
Device
MultiMedia
Device
Audio Out L
Audio In L
Audio Out R
Audio In R
2 x SP1002-01
Datasheet
Resources
Samples
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
SCART MultiMedia Application of SP1002-01
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1002 Series
Absolute Maximum Ratings
Symbol
Thermal Information
Parameter
Value
IPP
Peak Current (tp=8/20μs)
TOP
Operating Temperature
Storage Temperature
TSTOR
Parameter
Units
Rating
Units
–55 to 150
°C
2
A
Storage Temperature Range
–40 to 125
°C
Maximum Junction Temperature
150
°C
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
–55 to 150
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP = 25°C)
Parameter
Symbol
Test Conditions
Min
VD
IR=1mA
6.0
Reverse Standoff Voltage
VRWM
IR≤1µA with 1 I/O at GND
Leakage Current
ILEAK
Voltage Drop
VC
Clamp Voltage1
Dynamic Resistance
RDYN
ESD Withstand Voltage1,2
VESD
Diode Capacitance1
Typ
VR=5V with I/O at GND
Max
Units
9.5
V
6.0
V
0.5
µA
IPP=1A, tp=8/20µs, Fwd
9.2
13.0
V
IPP=2A, tp=8/20µs, Fwd
11.2
16.0
V
(VC2 - VC1) / (IPP2 - IPP1)
2.0
IEC61000-4-2 (Contact)
±8
IEC61000-4-2 (Air)
±15
CD
Ω
kV
kV
Reverse Bias=0V
6
pF
Reverse Bias=2.5V
5
pF
Reverse Bias=5V
5
pF
Notes:
2
Parameter is guaranteed by device characterization
A minimum of 1,000 ESD pulses are applied at 1s intervals
Soldering Parameters
Reflow Condition
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes max.
Do not exceed
260°C
tP
TP
Temperature
1
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1002 Series
Package Dimensions — SC70-3
B
Package
Solder Pad Layout
1.30
[0.0512]
3
0.65
[0.0256]
0.70
[0.0276]
E HE
2
1
e
e
1.90
[0.0748]
D
A2 A
0.90
[0.0354]
A1
C
L
SC70-3
Pins
3
JEDEC
MO-203
Millimeters
Min
Inches
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
0.66 BSC
e
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package Dimensions — SC70-5
e
e
6
5
not used
Package
4
Solder Pad Layout
E
1
2
SC70-5
Pins
5
JEDEC
MO-203
HE
3
B
D
A2 A
A1
Millimeters
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
0.65 BSC
e
C
L
Inches
Min
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Product Characteristics
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1002 Series
Part Numbering System
Part Marking System
B**
SP 1002 – ** J T G
TVS Diode Arrays
(SPA® Diodes)
B**
G= Green
Product Series
Number of Channels
(varies)
B = SP1002 Series
Assembly Site
T= Tape & Reel
(varies)
Series
Number of Channels
Ordering Information
Package
-01 = 1 Channel
-02 = 2 Channel
J = SC70-3
SC70-5
Part Number
Package
Marking
Min. Order Qty.
SP1002-01JTG
SC70-3
B*1
3000
SP1002-02JTG
SC70-5
B*2
3000
Embossed Carrier Tape & Reel Specification — SC70-3
PO
Millimetres
ØD
W
F
KO
AO
A1
BO
B1
ØD1
P
Min
t
E
P2
K1
E
F
P2
D
D1
P0
10P0
W
P
A0
A1
B0
B1
K0
K1
t
Max
Inches
Min
Max
1.65
1.85
3.45
3.55
1.95
2.05
1.40
1.60
1.00
1.25
3.90
4.10
40.0 ± 0.20
7.70
8.10
3.90
4.10
2.30
2.50
1.00 Ref
2.30
2.50
1.90 Ref
1.10
1.30
0.60 Ref
0.27 max
0.065
0.073
0.135
0.139
0.077
0.081
0.055
0.063
0.039
0.049
0.154
0.161
1.574 ± 0.008
0.303
0.318
0.153
0.161
0.090
0.098
0.039 Ref
0.090
0.098
0.074
0.043
0.051
0.023 Ref
0.010
Millimetres
Inches
Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6
Min
E
F
P2
D
D1
P0
10P0
W
P
A0
B0
K0
t
Max
1.65
1.85
3.45
3.55
1.95
2.05
1.40
1.60
1.00
1.25
3.90
4.10
40.0 ± 0.20
7.70
8.10
3.90
4.10
2.14
2.34
2.24
2.44
1.12
1.32
0.27 max
Min
Max
0.065
0.073
0.135
0.139
0.077
0.081
0.055
0.063
0.039
0.049
0.154
0.161
1.574 ± 0.008
0.303
0.318
0.153
0.161
0.084
0.092
0.088
0.096
0.044
0.052
0.010 max
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13