Transient Voltage Suppression Diodes Surface Mount – 600W > SMBJ-HR Series SMBJ-HR Series RoHS Pb e3 Description Uni-directional The SMBJ-HR High Reliability series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Bi-directional Features • Excellent clamping capability • Low incremental surge resistance • Typical IR less than 1µA above 12V • For surface mounted applications to optimize board space • Low profile package • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact) • ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2) • EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4) • Built-in strain relief Agency Approvals AGENCY AGENCY FILE NUMBER E128662/E230531 Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10/1000µs Waveform (Fig.2)(Note 1), (Note 2) PPPM 600 W Power Dissipation on Infinite Heat Sink at TA=50OC PM(AV) 5.0 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) IFSM 100 A Maximum Instantaneous Forward Voltage at 50A for Unidirectional Only (Note 4) VF 3.5V/5.0 V TJ , TSTG -65 to 150 °C Typical Thermal Resistance Junction to Lead RuJL 20 °C/W Typical Thermal Resistance Junction to Ambient RuJA 100 °C/W Operating Junction and Storage Temperature Range Notes: 1. Non-repetitive current pulse , per Fig. 4 and derated above TA = 25OC per Fig. 3. • Fast response time: typically less than 1.0ps from 0V to BV min • 600W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01% • VBR @TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient) • Glass passivated chip junction • High temperature soldering guaranteed: 260°C/40 seconds at terminals • Plastic package has underwriters laboratory flammability 94V-O • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen free and RoHS compliant • 2nd level interconnect is Pb-free per IPC/JEDEC J-STD-609A.01 Applications 2. Mounted on copper pad area of 0.2x0.2” (5.0 x 5.0mm) to each terminal. TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. _ 200V and VF<5.0V for VBR > _ 201V. 4. VF<3.5V for VBR < Functional Diagram Bi-directional Cathode Anode Uni-directional 1 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/28/15 Transient Voltage Suppression Diodes Surface Mount – 600W > SMBJ-HR Series Electrical Characteristics (T =25°C unless otherwise noted) A Part Number (Uni) Part Number (Bi) SMBJ5.0A-HR SMBJ6.0A-HR SMBJ6.5A-HR SMBJ7.0A-HR SMBJ7.5A-HR SMBJ8.0A-HR SMBJ8.5A-HR SMBJ9.0A-HR SMBJ10A-HR SMBJ11A-HR SMBJ12A-HR SMBJ13A-HR SMBJ14A-HR SMBJ15A-HR SMBJ16A-HR SMBJ17A-HR SMBJ18A-HR SMBJ20A-HR SMBJ22A-HR SMBJ24A-HR SMBJ26A-HR SMBJ28A-HR SMBJ30A-HR SMBJ33A-HR SMBJ36A-HR SMBJ40A-HR SMBJ43A-HR SMBJ45A-HR SMBJ48A-HR SMBJ51A-HR SMBJ54A-HR SMBJ58A-HR SMBJ60A-HR SMBJ64A-HR SMBJ70A-HR SMBJ75A-HR SMBJ78A-HR SMBJ85A-HR - SMBJ5.0CA-HR SMBJ6.0CA-HR SMBJ6.5CA-HR SMBJ7.0CA-HR SMBJ7.5CA-HR SMBJ8.0CA-HR SMBJ8.5CA-HR SMBJ9.0CA-HR SMBJ10CA-HR SMBJ11CA-HR SMBJ12CA-HR SMBJ13CA-HR SMBJ14CA-HR SMBJ15CA-HR SMBJ16CA-HR SMBJ17CA-HR SMBJ18CA-HR SMBJ20CA-HR SMBJ22CA-HR SMBJ24CA-HR SMBJ26CA-HR SMBJ28CA-HR SMBJ30CA-HR SMBJ33CA-HR SMBJ36CA-HR SMBJ40CA-HR SMBJ43CA-HR SMBJ45CA-HR SMBJ48CA-HR SMBJ51CA-HR SMBJ54CA-HR SMBJ58CA-HR SMBJ60CA-HR SMBJ64CA-HR SMBJ70CA-HR SMBJ75CA-HR SMBJ78CA-HR SMBJ85CA-HR SMBJ90CA-HR SMBJ100CA-HR SMBJ110CA-HR SMBJ120CA-HR SMBJ130CA-HR SMBJ150CA-HR SMBJ160CA-HR SMBJ170CA-HR Marking UNI BI KE KG KK KM KP KR KT KV KX KZ LE LG LK LM LP LR LT LV LX LZ ME MG MK MM MP MR MT MV MX MZ NE NG NK NM NP NR NT NV - AE AG AK AM AP AR AT AV AX AZ BE BG BK BM BP BR BT BV BX BZ CE CG CK CM CP CR CT CV CX CZ DE DG DK DM DP DR DT DV DX DZ EE EG EK EM EP ER Breakdown Voltage VBR (Volts) @ IT MIN MAX Test Current IT (mA) 6.40 6.67 7.22 7.78 8.33 8.89 9.44 10.00 11.10 12.20 13.30 14.40 15.60 16.70 17.80 18.90 20.00 22.20 24.40 26.70 28.90 31.10 33.30 36.70 40.00 44.40 47.80 50.00 53.30 56.70 60.00 64.40 66.70 71.10 77.80 83.30 86.70 94.40 100.00 111.00 122.00 133.00 144.00 167.00 178.00 189.00 7.00 7.37 7.98 8.60 9.21 9.83 10.40 11.10 12.30 13.50 14.70 15.90 17.20 18.50 19.70 20.90 22.10 24.50 26.90 29.50 31.90 34.40 36.80 40.60 44.20 49.10 52.80 55.30 58.90 62.70 66.30 71.20 73.70 78.60 86.00 92.10 95.80 104.00 111.00 123.00 135.00 147.00 159.00 185.00 197.00 209.00 10 10 10 10 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Reverse Stand off Voltage VR (Volts) 5.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 33.0 36.0 40.0 43.0 45.0 48.0 51.0 54.0 58.0 60.0 64.0 70.0 75.0 78.0 85.0 90.0 100.0 110.0 120.0 130.0 150.0 160.0 170.0 Note: 1. For bidirectional type having VR of 10 volts and less, the IR limit is double. 2. 100% High Temperature Storage Life test and Reflow Simulation. 3. 100% HTRB(High Temperature Reverse Bias). For Unidirectional, 150OC/100%VR/96hours, for Bidirectional, 150OC/100%VR/192hrs(96hours for each direction for Bidirectional). 4. IR measured at room temperature +25OC 5. Each lot of parts will pass group B test requirement. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/28/15 2 Maximum Clamping Voltage VC @ Ipp (V) Maximum Peak Pulse Current Ipp (A) Maximum Reverse Leakage IR @ VR (µA) 9.2 10.3 11.2 12.0 12.9 13.6 14.4 15.4 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103.0 113.0 121.0 126.0 137.0 146.0 162.0 177.0 193.0 209.0 243.0 259.0 275.0 65.3 58.3 53.6 50.0 46.6 44.2 41.7 39.0 35.3 33.0 30.2 28.0 25.9 24.6 23.1 21.8 20.6 18.6 16.9 15.5 14.3 13.3 12.4 11.3 10.4 9.3 8.7 8.3 7.8 7.3 6.9 6.5 6.2 5.9 5.3 5.0 4.8 4.4 4.1 3.7 3.4 3.1 2.9 2.5 2.3 2.2 800 800 500 200 100 50 20 10 5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Agency Approval X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Transient Voltage Suppression Diodes Surface Mount – 600W > SMBJ-HR Series Group B Test Requirement Screen Method Condition Requirement Surge test 10/1000 µs Peak Pluse Waveform Maximum clamping Voltage (VC) @ Peak Plus Current (IPP) Sample Size 45 perform 10x Accept 0 failures Burn - In (HTRB) MIL -STD-750, Method 1038.5 Applied voltage 100% VR@150°C Sample size 45 340 hours (680 hours for bi-direction products, each direction 340 hours) Accept 0 failures IR@VR, V(BR)@IT Sample size 45 Accept 0 failures Electrical test -- I-V Curve Characteristics Bi-directional Uni-directional Ipp Vc VBR VR Vc VBR VR V IR VF IT IR IT VR VBR Vc V Ipp Ipp PPPM VR VBR VC IR VF IT IR Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT) Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current) Reverse Leakage Current -- Current measured at VR Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Voltage Transients PPPM-Peak Pulse Power (kW) 100 Voltage or Current Voltage Across TVS Current Through TVS 10 1 0.2x0.2" (5.0x5.0mm) Copper Pad Area 0.1 Time 0.000001 0.00001 0.0001 0.001 td-Pulse Width (sec.) continues on next page. 3 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/28/15 Transient Voltage Suppression Diodes Surface Mount – 600W > SMBJ-HR Series Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued) A Figure 3 - Pulse Derating Curve Figure 4 - Pulse Waveform 150 IPPM- Peak Pulse Current, % IRSM Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % 100 80 60 40 20 0 0 25 50 75 100 125 150 tr=10µsec Half Value IPPM IPPM ( ) 2 50 0 TA-Ambient temperature (ºC) td 1.0 0 2.0 3.0 4.0 Figure 6 - Steady State Power Dissipation Derating Curve 10000 PM(AV), Steady State Power Dissipation (W) 6 Bi-directional V=0V 1000 Cj (pF) 10/1000µsec. Waveform as defined by R.E.A t-Time (ms) Figure 5 - Typical Junction Capacitance Uni-directional V=0V Uni-directional @VR 100 Bi-directional @VR 10 Tj=25C f=1.0MHz Vsig=50mVp-p 1 1.0 10.0 100.0 VBR - Reverse Breakdown Voltage (V) 100 80 60 40 20 0 10 100 Number of Cycles at 60 Hz © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/28/15 4 3 2 1 0 25 50 75 100 125 TA - Ambient Temperature (ºC) 120 1 5 0 1000.0 Figure 7 - Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional Only IFSM - Peak Forward Surge Current (A) Peak Value IPPM 100 175 TJ=25°C Pulse Width(td) is defined as the point where the peak current decays to 50% of IPPM 4 150 175 Transient Voltage Suppression Diodes Surface Mount – 600W > SMBJ-HR Series Soldering Parameters Pre Heat Lead–free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Ramp-up TL Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds tL 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 280°C Critical Zone TL to TP Ts(max) Ramp-down Ts(min) ts Preheat 25˚C Peak Temperature (TP) +0/-5 tp TP Temperature (T) Reflow Condition t 25˚C to Peak Time (t) °C Environmental Specifications Physical Specifications High Temp. Storage JESD22-A103 HTRB JESD22-A108 Temperature Cycling JESD22-A104 Weight 0.003 ounce, 0.093 grams Case JEDEC DO214AA. Molded plastic body over glass passivated junction MSL JEDEC-J-STD-020, Level 1 Polarity Color band denotes cathode except Bidirectional H3TRB JESD22-A101 Terminal Matte Tin-plated leads, Solderable per JESD22-B102 RSH JESD22-B106 Dimensions DO-214AA (SMB J-Bend) Dimensions Cathode Band (for Uni-directional products only) C B H D F E G J K L Millimeters Min Max Min Max 0.077 0.086 1.950 2.200 B 0.160 0.180 4.060 4.570 C 0.130 0.155 3.300 3.940 A A Inches D 0.084 0.096 2.130 2.440 E 0.030 0.060 0.760 1.520 F - 0.008 - 0.203 G 0.205 0.220 5.210 5.590 H 0.006 0.012 0.152 0.305 I 0.089 - 2.260 - J 0.085 - 2.160 - K - 0.107 - 2.740 L 0.085 - 2.160 - I Solder Pads (all dimensions in mm) 5 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/28/15 Transient Voltage Suppression Diodes Surface Mount – 600W > SMBJ-HR Series Part Numbering System SMBJ Part Marking System XXX C A -HR F Cathode Band High Reliability 5% VOLTAGE TOLERANCE BI-DIRECTIONAL XX VOLTAGE SERIES YMXXX (for uni-directional products only) Littelfuse Logo Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Packaging Part number Component Package SMBJxxxXX-HR DO-214AA Packaging Option Quantity 3000 Tape & Reel - 12mm tape/13” reel Packaging Specification EIA STD RS-481 Tape and Reel Specification 0.157 (4.0) 0.47 (12.0) Cathode 0.315 (8.0) 0.059 DIA (1.5) Cover tape 13.0 (330) 0.80 (20.2) Arbor Hole Dia. 0.49 (12.5) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/28/15 Dimensions are in inches (and millimeters). Direction of Feed 6