Datasheet

Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCG-HR series
SMCG-HR Series
RoHS
Pb e3
Description
The SMCG-HR series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(TA=25 C unless otherwise noted)
O
Parameter
Symbol
Value
Unit
Peak Pulse Power Dissipation at
TA=25ºC by 10/1000µs waveform
(Fig.2)(Note 1), (Note 2)
PPPM
1500
W
Power Dissipation on infinite heat
sink at TA=50OC
PM(AV)
6.5
W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3)
IFSM
200
A
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
only
VF
3.5
V
TJ , TSTG
-65 to 150
°C
Typical Thermal Resistance Junction
to Lead
RuJL
15
°C/W
Typical Thermal Resistance Junction
to Ambient
RuJA
75
°C/W
Operating Junction and Storage
Temperature Range
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above TA = 25OC per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
• High-Reliability upscreened for critical
applications require higher
reliability performance
and low infant mortality
failures.
• Excellent clamping
capability
• Low incremental surge
resistance
• Typical IR less than 1µA
above 12V
• For surface mounted
applications to optimize
board space
• L bend lead forming gives
best solderbility for Hi
reliability application
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
15kV(Air), 8kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2 (IEC801-2)
• EFT protection of data
lines in accordance with
IEC 61000-4-4 (IEC801-4)
• Built-in strain relief
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• 1500W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• VBR @TJ= VBR@25°C x (1+αT
x (TJ - 25)) (αT:Temperature
Coefficient, typical value is
0.1%)
• Glass passivated chip
junction
• High temperature
soldering guaranteed:
260°C/10 seconds at
terminals
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260°C
• Matte tin lead–free plated
• Halogen free
• RoHS compliant with
exemption 7a and 7c-I
• 2nd level interconnect is
Pb-free per IPC/JEDEC
J-STD-609A.01
Applications
TVS devices are ideal for the protection of I/O Interfaces,
VCC bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic applications.
Functional Diagram
Bi-directional
Cathode
Anode
Uni-directional
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/09/15
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCG-HR series
Electrical Characteristics
Part
Number
(Uni)
Part
Number
(Bi)
SMCG5.0A-HR
SMCG6.0A-HR
SMCG6.5A-HR
SMCG7.0A-HR
SMCG7.5A-HR
SMCG8.0A-HR
SMCG8.5A-HR
SMCG9.0A-HR
SMCG10A-HR
SMCG11A-HR
SMCG12A-HR
SMCG13A-HR
SMCG14A-HR
SMCG15A-HR
SMCG16A-HR
SMCG17A-HR
SMCG18A-HR
SMCG20A-HR
SMCG22A-HR
SMCG24A-HR
SMCG26A-HR
SMCG28A-HR
SMCG30A-HR
SMCG33A-HR
SMCG36A-HR
SMCG40A-HR
SMCG43A-HR
SMCG45A-HR
SMCG48A-HR
SMCG51A-HR
SMCG54A-HR
SMCG58A-HR
SMCG60A-HR
SMCG64A-HR
SMCG70A-HR
SMCG75A-HR
SMCG78A-HR
SMCG85A-HR
SMCG90A-HR
SMCG100A-HR
SMCG110A-HR
SMCG120A-HR
SMCG5.0CA-HR
SMCG6.0CA-HR
SMCG6.5CA-HR
SMCG7.0CA-HR
SMCG7.5CA-HR
SMCG8.0CA-HR
SMCG8.5CA-HR
SMCG9.0CA-HR
SMCG10CA-HR
SMCG11CA-HR
SMCG12CA-HR
SMCG13CA-HR
SMCG14CA-HR
SMCG15CA-HR
SMCG16CA-HR
SMCG17CA-HR
SMCG18CA-HR
SMCG20CA-HR
SMCG22CA-HR
SMCG24CA-HR
SMCG26CA-HR
SMCG28CA-HR
SMCG30CA-HR
SMCG33CA-HR
SMCG36CA-HR
SMCG40CA-HR
SMCG43CA-HR
SMCG45CA-HR
SMCG48CA-HR
SMCG51CA-HR
SMCG54CA-HR
SMCG58CA-HR
SMCG60CA-HR
SMCG64CA-HR
SMCG70CA-HR
SMCG75CA-HR
SMCG78CA-HR
SMCG85CA-HR
SMCG90CA-HR
SMCG100CA-HR
SMCG110CA-HR
SMCG120CA-HR
Marking
UNI
BI
GDE
GDG
GDK
GDM
GDP
GDR
GDT
GDV
GDX
GDZ
GEE
GEG
GEK
GEM
GEP
GER
GET
GEV
GEX
GEZ
GFE
GFG
GFK
GFM
GFP
GFR
GFT
GFV
GFX
GFZ
GGE
GGG
GGK
GGM
GGP
GGR
GGT
GGV
GGX
GGZ
GHE
GHG
BDE
BDG
BDK
BDM
BDP
BDR
BDT
BDV
BDX
BDZ
BEE
BEG
BEK
BEM
BEP
BER
BET
BEV
BEX
BEZ
BFE
BFG
BFK
BFM
BFP
BFR
BFT
BFV
BFX
BFZ
BGE
BGG
BGK
BGM
BGP
BGR
BGT
BGV
BGX
BGZ
BHE
BHG
Reverse
Stand off
Voltage VR
(Volts)
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10.0
11.0
12.0
13.0
14.0
15.0
16.0
17.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
33.0
36.0
40.0
43.0
45.0
48.0
51.0
54.0
58.0
60.0
64.0
70.0
75.0
78.0
85.0
90.0
100.0
110.0
120.0
Breakdown
Voltage VBR
(Volts) @ IT
MIN
MAX
Test
Current
IT
(mA)
6.40
6.67
7.22
7.78
8.33
8.89
9.44
10.00
11.10
12.20
13.30
14.40
15.60
16.70
17.80
18.90
20.00
22.20
24.40
26.70
28.90
31.10
33.30
36.70
40.00
44.40
47.80
50.00
53.30
56.70
60.00
64.40
66.70
71.10
77.80
83.30
86.70
94.40
100.00
111.00
122.00
133.00
7.00
7.37
7.98
8.60
9.21
9.83
10.40
11.10
12.30
13.50
14.70
15.90
17.20
18.50
19.70
20.90
22.10
24.50
26.90
29.50
31.90
34.40
36.80
40.60
44.20
49.10
52.80
55.30
58.90
62.70
66.30
71.20
73.70
78.60
86.00
92.10
95.80
104.00
111.00
123.00
135.00
147.00
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Maximum
Clamping
Voltage VC
@ Ipp
(V)
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113.0
121.0
126.0
137.0
146.0
162.0
177.0
193.0
Maximum Maximum
Agency
Peak
Reverse
Approval
Pulse
Leakage IR
Current Ipp
@ VR
(A)
(µA)
163.0
145.7
134.0
125.0
116.3
110.3
104.2
97.4
88.3
82.5
75.4
69.8
64.7
61.5
57.7
54.4
51.4
46.3
42.3
38.6
35.7
33.1
31.0
28.2
25.9
23.3
21.7
20.6
19.4
18.2
17.3
16.1
15.5
14.6
13.3
12.4
11.9
11.0
10.3
9.3
8.5
7.8
800
800
500
200
100
50
20
10
5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Note:
1. For bidirectional type having VR of 10 volts and less, the IR limit is double.
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/09/15
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCG-HR series
Screen Process
100% vision inspection
MIL-STD-750 method 2074
100%High Temperature Storage Life (168hrs,175C)
MIL-STD-750 method 1031
100% X-RAY inspection
MIL-STD-750 method 2076
100% Temperature cycle test (-55-150C, 20 cycles, dwell time 15 min)
MIL-STD-750 method 1051
100% Reflow (2x)
JEDEC J-STD-020
100% surge test (2x)
MIL-STD-750 method 4066
100% HTRB(150C, Bias=VR(80% breakdown voltage), 96hrs),for Bidirection products, 96hrs for each direction
MIL–STD–750 method 1038
Final electrical test( 100% 3 sigma limit, 100% dynamic test and PAT
limit)
MIL-STD-750 method 4016.4021.4011
Note: Up-screen program can be specified by customer’s request via contacting Littelfuse service
Group B Test Requirement
Screen
Method
Condition
Requirement
Surge Test
10/1000 µS Peak
Pluse Waveform
Maximum Clamping
Voltage (VC) @ Peak
Plus Current (IPP)
Sample Size 45 Perform 10x
Accept 0 Failures
Burn - In
(HTRB)
MIL - STD - 750,
Method 1038.5
Applied Voltage
100% VR@150°C
Sample Size 45
For Unidirectional, 150C/VR/340hours, for Bidirectional, 150C/ VR
/680hrs(340hours for each direction)
Accept 0 Failures
Electrical
Tests
--
IR@VR, V(BR)@IT
Sample Size 45
Accept 0 Failures
I-V Curve Characteristics
Bi-directional
Uni-directional
Ipp
Vc VBR VR
IR VF
IT
V
Vc VBR VR
IT
IR
Ipp
PPPM
VR
VBR
VC
IR
VF
IR
IT
VR VBR Vc
V
Ipp
Peak Pulse Power Dissipation -- Max power dissipation
Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage -- Maximum voltagethat flows though the TVS at a specified test current (IT)
Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current)
Reverse Leakage Current -- Current measured at VR
Forward Voltage Drop for Uni-directional
continues on next page.
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/09/15
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCG-HR series
Ratings and Characteristic Curves (T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Figure 2 - Peak Pulse Power Rating
100
PPPM-Peak Pulse Power (kW)
Voltage Transients
Voltage or Current
Voltage Across TVS
Current Through TVS
TJ initial = Tamb
10
1
0.1
0.001
0.01
150
IPPM- Peak Pulse Current, % IRSM
Peak Pulse Power (PPP) or Current (IPP)
Derating in Percentage %
100
80
60
40
20
0
25
50
75
100 125 150
TJ - Initial Junction Temperature (ºC)
Uni-directional V=VR
100
Bi-directional V=VR
10
100
VBR - Reverse Breakdown Voltage(V)
Half Value
IPPM IPPM
( )
2
50
0
Transient Thermal Impedance (°C/W)
Cj(pF)
Bi-directional V=0V
1
Peak Value
IPPM
100
10/1000µsec. Waveform
as defined by R.E.A
td
0
1.0
2.0
3.0
4.0
Figure 6 - Typical Transient Thermal Impedance
Uni-directional V=0V
10
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
t-Time (ms)
100000
10000
tr=10µsec
175
Figure 5 - Typical Junction Capacitance
1
10
Figure 4 - Pulse Waveform
Figure 3 - Peak Pulse Power Derating Curve
1000
1
td-Pulse Width (ms)
Time
0
0.1
1000
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
1000
TP - Pulse Duration (s)
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/09/15
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCG-HR series
IFSM - Peak Forward Surge Current (A)
Figure 7 - Maximum Non-Repetitive Peak Forward
Surge Current Uni-Directional Only
200
180
160
140
120
100
80
60
40
20
0
1
10
100
Number of Cycles at 60 Hz
Soldering Parameters
Lead–free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 120 secs
Ramp-up
TL
Average ramp up rate (Liquidus Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Time (min to max) (ts)
60 – 150 seconds
Peak Temperature (TP)
260
Time within 5°C of actual peak
Temperature (tp)
30 seconds
+0/-5
tp
TP
Temperature (T)
Reflow Condition
Ts(max)
Ts(min)
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Physical Specifications
Ramp-down
ts
Preheat
25˚C
t 25˚C to Peak
Time (t)
°C
Ramp-down Rate
tL
Critical Zone
TL to TP
Environmental Specifications
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Weight
0.007 ounce, 0.21 grams
Thermal Shock
JESD22-A106
Case
JEDEC DO-215AB. Molded plastic body
over glass passivated junction
MSL
JEDEC-J-STD-020, Level 1
Polarity
Color band denotes positive end
(cathode) except Bidirectional.
H3TRB
JESD22-A101
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102
RSH
JESD22-A111
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/09/15
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCG-HR series
Dimensions
DO-215AB (SMCG)
Inches
Dimensions
Cathode Band
A
C
A
B
H
N
D
F
E
I
Seating Plane
G
Dimensions in inches and (millimeters)
K
J
L
M
Solder Pads
Part Numbering System
Millimeters
Min
Max
Min
Max
0.115
0.125
2.920
3.170
B
0.260
0.280
6.600
7.110
C
0.220
0.245
5.590
6.220
D
0.075
0.095
1.900
2.410
E
0.038
0.058
0.970
1.470
F
-
0.020
-
0.510
G
0.380
0.400
9.640
10.160
H
0.024
0.040
0.610
1.020
I
0.006
0.016
0.150
0.410
J
-
0.050
-
1.270
K
-
0.310
-
7.870
L
-
0.050
-
1.270
M
-
0.125
-
3.170
N
0.002
0.008
0.050
0.200
Part Marking System
SMCG xxx C A -HR
Cathode Band
F
(for Uni-directional products only)
High Reliability
5% VBR VOLTAGE TOLERANCE
XXX
BI-DIRECTIONAL
YMXXX
VR VOLTAGE
Littelfuse Logo
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
XXX: Lot Code
SERIES
Packaging
Part number
Component
Package
SMCGxxxXX-HR
DO-215AB
Packaging
Option
Quantity
1500
Tape & Reel – 24mm tape /13” reel
Packaging
Specification
EIA STD RS-481
Tape and Reel Specification
0.157
(4.0)
Cathode
0.945
(24.0)
0.472
(12.0)
0.059 DIA
(1.5)
Cover tape
13.0 (330)
0.800 (20.2)
Arbor Hole Dia.
0.960
(24.4)
Dimensions are in inches
(and millimeters).
Direction of Feed
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/09/15