SSF7NS65UF 650V N-Channel MOSFET Main Product Characteristics VDSS 650V RDS(on) 0.6Ω (typ.) ID 7A ① TO-220F Marking and Pin Schematic Diagram Assignment Features and Benefits High dv/dt and avalanche capabilities 100% avalanche tested Low input capacitance and gate charge Low gate input resistance Lead free product Description The SSF7NS65UF series MOSFET is a new technology, which combines an innovative super junction technology and advance process. This new technology achieves low RDS(ON), energy saving, high reliability and uniformity, superior power density and space saving. Absolute Max Rating Symbol Parameter Max. ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 7 ① ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 5① IDM Pulsed Drain Current ② 28 Power Dissipation ③ 33 W Linear Derating Factor 0.264 W/°C VDS Drain-Source Voltage 650 V VGS Gate-to-Source Voltage ± 30 V EAS Single Pulse Avalanche Energy @ L=100mH 98 mJ IAS Avalanche Current @ L=100mH 1.4 A -55 to +150 °C PD @TC = 25°C TJ TSTG www.goodark.com Operating Junction and Storage Temperature Range Page 1 of 7 Units A Rev.1.0 SSF7NS65UF 650V N-Channel MOSFET Thermal Resistance Symbol Characteristics Typ. Max. Units RθJC Junction-to-case ③ — 3.8 ℃/W RθJA Junction-to-ambient (t ≤ 10s) ④ — 80 ℃/W Electrical Characteristics @TA=25℃ Symbol Parameter V(BR)DSS Drain-to-Source breakdown voltage RDS(on) unless otherwise specified Min. Static Drain-to-Source on-resistance Typ. Max. Units V 650 — — — 0.6 0.75 — 1.3 — — 0.64 0.9 — 1.5 — 2 — 4 — 2.2 — — — 1 — — 50 — — 100 — — -100 VGS(th) Gate threshold voltage IDSS Drain-to-Source leakage current IGSS Gate-to-Source forward leakage Qg Total gate charge — 13 — Qgs Gate-to-Source charge — 2.6 — Qgd Gate-to-Drain("Miller") charge — 3.1 — td(on) Turn-on delay time — 12 — tr Rise time — 7.5 — td(off) Turn-Off delay time — 30 — tf Fall time — 18 — Ciss Input capacitance — 500 — Coss Output capacitance — 24 — Crss Reverse transfer capacitance — 3 — Ω Ω V μA Conditions VGS = 0V, ID = 250μA VGS=10V,ID = 1A TJ = 125°C VGS=10V,ID = 2.8A TJ = 125°C VDS = VGS, ID = 250μA TJ = 125°C VDS =650V,VGS = 0V TJ = 125°C nA VGS =30V VGS = -30V ID = 5A, nC VDS=200V, VGS = 10V ns VGS=10V, VDS =400V, RGEN=10.2Ω,ID =1.5A VGS = 0V pF VDS = 100V ƒ = 1MHz Source-Drain Ratings and Characteristics Symbol IS ISM Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Min. Typ. Max. Units — — 7 ① A — — 28 A Conditions MOSFET symbol showing the integral reverse p-n junction diode. VSD Diode Forward Voltage — 0.8 1.2 V IS=2.8A, VGS=0V trr Reverse Recovery Time — 126 — nS TJ = 25°C, IF = 1.5A, Qrr Reverse Recovery Charge — 560 — nC di/dt = 100A/μs www.goodark.com Page 2 of 7 Rev.1.0 SSF7NS65UF 650V N-Channel MOSFET Test Circuits and Waveforms Switch Waveforms: Notes: ①Calculated continuous current based on maximum allowable junction temperature. ②Repetitive rating; pulse width limited by max. junction temperature. ③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal resistance. ④The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C www.goodark.com Page 3 of 7 Rev.1.0 SSF7NS65UF 650V N-Channel MOSFET Typical Electrical and Thermal Characteristics Figure 2. Gate to source cut-off voltage Figure 1: Typical Output Characteristics Figure 3. Drain-to-Source Breakdown Voltage Vs. Figure 4: Normalized On-Resistance Vs. Case Case Temperature www.goodark.com Temperature Page 4 of 7 Rev.1.0 SSF7NS65UF 650V N-Channel MOSFET Typical Electrical and Thermal Characteristics Figure 5. Maximum Drain Current Vs. Case Figure 6. Typical Capacitance Vs. Drain-to-Source Temperature Voltage Figure7.Drain-to-Source Voltage Vs. Gate-to-Source Voltage www.goodark.com Page 5 of 7 Rev.1.0 SSF7NS65UF 650V N-Channel MOSFET Mechanical Data TO220F PACKAGE OUTLINE DIMENSION_GN Symbol E E1 E2 A A1 A2 A3 c D D1 H1 e ФP ФP 1 ФP 2 ФP 3 L L1 L2 Q1 Q2 b1 b2 b3 www.goodark.com Dimension In Millimeters Min Nom Max 9.960 10.160 10.360 9.840 10.040 10.240 6.800 7.000 7.200 4.600 4.700 4.800 2.440 2.540 2.640 2.660 2.760 2.860 0.600 0.700 0.800 0.500 15.780 15.870 15.980 8.970 9.170 9.370 6.500 6.700 6.800 2.54BSC 3.080 3.180 3.280 1.400 1.500 1.600 0.900 1.000 1.100 0.100 0.200 0.300 12.780 12.980 13.180 2.970 3.170 3.370 0.830 0.930 1.030 o o o 3 5 7 o 43 1.180 0.760 - o 45 1.280 0.800 - o 47 1.380 0.840 1.420 Page 6 of 7 Min 0.392 0.387 0.268 0.181 0.096 0.105 0.024 0.621 0.353 0.256 0.121 0.055 0.035 0.004 0.503 0.117 0.033 o 3 o 43 0.046 0.030 - Dimension In Inches Nom 0.400 0.395 0.276 0.185 0.100 0.109 0.028 0.020 0.625 0.361 0.264 0.10BSC 0.125 0.059 0.039 0.008 0.511 0.125 0.037 o 5 o 45 0.050 0.031 - Max 0.408 0.403 0.283 0.189 0.104 0.113 0.031 0.629 0.369 0.268 0.129 0.063 0.043 0.012 0.519 0.133 0.041 o 7 o 47 0.054 0.033 0.056 Rev.1.0 SSF7NS65UF 650V N-Channel MOSFET Ordering and Marking Information Device Marking: SSF7NS65UF Package (Available) TO-220F Operating Temperature Range C : -55 to 150 ºC Devices per Unit Package Type Units/ Tube Tubes/Inner Box Units/Inner Inner Box Boxes/Carton Box Units/Carton Box TO-220F 50 20 1000 6000 6 Reliability Test Program Test Item Conditions Duration Sample Size High Temperature Reverse Bias(HTRB) High Temperature Gate Bias(HTGB) Tj=125℃ to 150℃ @ 80% of Max VDSS/VCES/VR 168 hours 500 hours 1000 hours 3 lots x 77 devices Tj=150℃@ 100% of Max VGSS 168 hours 500 hours 1000 hours 3 lots x 77 devices www.goodark.com Page 7 of 7 Rev.1.0