SSF7008 68V N-Channel MOSFET Main Product Characteristics VDSS 68V RDS(on) 5.6mΩ(typ.) ID 84A ① TO- 220 Schematic Diagram Assignment Features and Benefits Marking and Pin Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery 175℃ operating temperature Lead free product Description It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications. Absolute Max Rating Parameter Max. ID @ TC = 25°C Symbol Continuous Drain Current, VGS @ 10V 84 ① ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 75 ① IDM Pulsed Drain Current ② 336 Power Dissipation ③ 200 W Linear Derating Factor 2.0 W/°C VDS Drain-Source Voltage 68 V VGS Gate-to-Source Voltage ± 20 V EAS Single Pulse Avalanche Energy @ L=0.3mH 437.4 mJ IAS Avalanche Current @ L=0.3mH 54 A -55 to + 175 °C PD @TC = 25°C TJ TSTG www.goodark.com Operating Junction and Storage Temperature Range Page 1 of 7 Units A Rev.1.0 SSF7008 68V N-Channel MOSFET Thermal Resistance Symbol Characteristics RθJC RθJA Typ. Max. Units Junction-to-case ③ — 0.75 ℃/W Junction-to-ambient (t ≤ 10s) ④ — 62 ℃/W Junction-to-Ambient (PCB mounted, steady-state) ④ — 40 ℃/W Electrical Characteristics @TA=25℃ Symbol Parameter V(BR)DSS Drain-to-Source breakdown voltage RDS(on) Static Drain-to-Source on-resistance VGS(th) Gate threshold voltage IDSS Drain-to-Source leakage current IGSS Gate-to-Source forward leakage Qg unless otherwise specified Min. Typ. Max. Units 68 — — V — 5.6 8 — 9.89 — 2 — 4 — 2.41 — — — 1 — — 50 — — 100 — — -100 Total gate charge — TBD — Qgs Gate-to-Source charge — TBD — Qgd Gate-to-Drain("Miller") charge — TBD — VGS = —V td(on) Turn-on delay time — 17.2 — VGS=10V, VDS=30V, tr Rise time — 16.4 — td(off) Turn-Off delay time — 79.7 — tf Fall time — 31.3 — ID = 2A Ciss Input capacitance — 5133 — VGS = 0V Coss Output capacitance — 376 — Crss Reverse transfer capacitance — 235 — mΩ Conditions VGS = 0V, ID = 250μA VGS=10V,ID = 30A TJ = 125℃ V VDS = VGS, ID = 250μA TJ = 125℃ μA VDS = 68V,VGS = 0V TJ = 125℃ nA VGS =20V VGS = -20V ID = —A, nC ns pF VDS=—V, RL=15Ω, RGEN=2.5Ω VDS = 25V ƒ = 1MHz Source-Drain Ratings and Characteristics Symbol IS ISM Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Min. Typ. Max. Units — — 84 ① A — — 336 A Conditions MOSFET symbol showing the integral reverse p-n junction diode. VSD Diode Forward Voltage — 0.80 1.3 V IS=68A, VGS=0V trr Reverse Recovery Time — 36.1 — nS TJ = 25°C, IF =68A, di/dt = Qrr Reverse Recovery Charge — 59.9 — nC 100A/μs www.goodark.com Page 2 of 7 Rev.1.0 SSF7008 68V N-Channel MOSFET Test Circuits and Waveforms Switch Waveforms: Notes: ①Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 75A. ②Repetitive rating; pulse width limited by max. junction temperature. ③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal resistance. ④The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C ⑤These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=175°C. www.goodark.com Page 3 of 7 Rev.1.0 SSF7008 68V N-Channel MOSFET Typical Electrical and Thermal Characteristics Figure 2. Gate to source cut-off voltage Figure 1: Typical Output Characteristics Figure 3. Drain-to-Source Breakdown Voltage vs. Figure 4: Normalized On-Resistance Vs. Case Temperature www.goodark.com Temperature Page 4 of 7 Rev.1.0 SSF7008 68V N-Channel MOSFET Typical Electrical and Thermal Characteristics Figure 5. Maximum Drain Current Vs. Case Figure 6.Typical Capacitance Vs. Drain-to-Source Temperature Voltage Figure7. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.goodark.com Page 5 of 7 Rev.1.0 SSF7008 68V N-Channel MOSFET Mechanical Data TO220 PACKAGE OUTLINE DIMENSION_GN E ФP A ϴ1 D D2 ФP1 ϴ3 ϴ2 D1 b1 b A1 ϴ4 L c e Symbol A A1 b b1 c D D1 D2 E E1 ФP Dimension In Millimeters Min Nom Max 1.300 2.200 2.400 2.600 1.270 1.270 1.370 1.470 0.500 15.600 28.700 9.150 9.900 10.000 10.100 10.160 3.600 - ФP 1 e L ϴ1 ϴ2 ϴ3 ϴ4 www.goodark.com 12.900 - 1.500 2.54BSC 13.100 13.300 70 - E1 Min 0.087 0.050 0.390 - Dimension In Inches Nom Max 0.051 0.094 0.102 0.050 0.054 0.058 0.020 0.614 1.130 0.360 0.394 0.398 0.400 0.142 - 0.508 0.059 0.1BSC 0.516 0.524 - 70 - 0 - 7 0 - - 7 - 30 - 50 70 90 - 30 - 10 30 50 Page 6 of 7 - Rev.1.0 SSF7008 68V N-Channel MOSFET Ordering and Marking Information Device Marking: SSF7008 Package (Available) TO220 Operating Temperature Range C : -55 to 175 ºC Devices per Unit Package Type Units/ Tube TO220 Tubes/Inner Box 50 20 Reliability Test Program Test Item Conditions High Temperature Reverse Bias(HTRB) High Temperature Gate Bias(HTGB) www.goodark.com Units/Inner Inner Box Boxes/Carton Box 1000 6 Duration Sample Size Tj=125℃ to 175℃ @ 80% of Max VDSS/VCES/VR 168 hours 500 hours 1000 hours 3 lots x 77 devices Tj=150℃ or 175℃ @ 100% of Max VGSS 168 hours 500 hours 1000 hours 3 lots x 77 devices Page 7 of 7 Units/Carton Box 6000 Rev.1.0