SSF6808A 68V N-Channel MOSFET FEATURES ID =84A Advanced trench process technology Ultra low Rdson, typical 5mohm High avalanche energy, 100% test Fully characterized avalanche voltage and current Lead free product BV=68V R DS (ON)=8mohm DESCRIPTION The SSF6808A is a new generation of middle voltage and high current N–Channel enhancement mode trench power MOSFET. This new technology increases the device reliability and electrical parameter repeatability. SSF6808A is assembled in high reliability and qualified assembly house. APPLICATIONS SSF6808A Top View (TO-263) Power switching application Absolute Maximum Ratings Parameter ID@Tc=25ْ C Max. Continuous drain current,VGS@10V 84 ID@Tc=100ْC Continuous drain current,VGS@10V 76 Units A Pulsed drain current ① 310 Power dissipation 180 W Linear derating factor 1.5 W/ْ C VGS Gate-to-Source voltage ±20 V dv/dt Peak diode recovery voltage 31 v/ns EAS Single pulse avalanche energy ② 400 mJ EAR Repetitive avalanche energy TBD IDM PD@TC=25ْC TJ TSTG Operating Junction and –55 to +175 Storage Temperature Range ْC Thermal Resistance Parameter Min. Typ. Max. RθJC Junction-to-case — 0.83 — RθJA Junction-to-ambient — — 62 Units ْC/W Electrical Characteristics @T J=25 ْC (unless otherwise specified) Parameter Min. Typ. Max. Units Test Conditions BVDSS Drain-to-Source breakdown voltage 68 — — V VGS=0V,ID=250μA RDS(on) Static Drain-to-Source on-resistance — 5 8 mΩ VGS=10V,ID=30A VGS(th) Gate threshold voltage 2.0 4.0 V VDS=VGS,ID=250μA IDSS IGSS Drain-to-Source leakage current Gate-to-Source forward leakage www.goodark.com — — 2 — — 10 — — 100 Page 1 of 5 VDS=68V,VGS=0V μA VDS=68V, VGS=0V,TJ=150ْC nA VGS=20V Rev.1.1 SSF6808A 68V N-Channel MOSFET Qg Gate-to-Source reverse leakage — — -100 Total gate charge — 90 — ID=30A VDD=30V VGS=-20V nC Qgs Gate-to-Source charge — 18 — Qgd Gate-to-Drain("Miller") charge — 28 — VGS=10V td(on) Turn-on delay time — 18.2 — VDD=30V Rise time — 15.6 — Turn-Off delay time — 70.5 — Fall time — 13.8 — VGS=10V Ciss Input capacitance — 3150 — VGS=0V Coss Output capacitance — 300 — Crss Reverse transfer capacitance — 240 — tr td(off) tf ID=2A ,RL=15Ω nS RG=2.5Ω VDS=25V pF f=1.0MHZ Source-Drain Ratings and Characteristics Parameter IS ISM Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) ① Min. Typ. Max. — — 84 Units MOSFET symbol A — — 310 Test Conditions showing the integral reverse p-n junction diode. VSD Diode Forward Voltage — — 1.3 V TJ=25ْC,IS=68A,VGS=0V ③ trr Reverse Recovery Time — 57 — nS TJ=25ْC,IF=68A Qrr Reverse Recovery Charge — 107 — nC di/dt=100A/μs ③ ton Forward Turn-on Time Intrinsic turn-on time is negligible (turn-on is dominated by Ls + LD) Notes: ① Repetitive rating; pulse width limited by max junction temperature. ② Test condition: L =0.3mH, ID = 37A, VDD = 30V. ③ Pulse width≤300μS, duty cycle≤1.5% ; RG = 25Ω Starting TJ = 25°C. EAS test circuit www.goodark.com Gate charge test circuit Page 2 of 5 Rev.1.1 SSF6808A 68V N-Channel MOSFET Switch Time Test Circuit Switch Waveforms Figure1: Transfer Characteristic Figure2:Capacitance Figure3:On Resistance vs. Junction Figure4:Breakdown Voltage vs. Junction Temperature Temperature www.goodark.com Page 3 of 5 Rev.1.1 SSF6808A 68V N-Channel MOSFET Figure5:Gate Charge Figure7:Safe Operation Figure6:Source-Drain Diode Forward Voltage Figure8:Max Drain Current vs. Junction Temperature Figure9:Transient Thermal Impedance Curve www.goodark.com Page 4 of 5 Rev.1.1 SSF6808A 68V N-Channel MOSFET TO-263 MECHANICAL DATA www.goodark.com Page 5 of 5 Rev.1.1