Reliability Report

AOS Semiconductor
Product Reliability Report
AOZ8212ACI-05,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOZ8212ACI-05.
Accelerated environmental tests are performed on a specific sample size, and then followed by
electrical test at end point. Review of final electrical test result confirms that AOZ8212ACI-05
passes AOS quality and reliability requirements. The released product will be categorized by the
process family and be routine monitored for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Reliability Stress Test Summary and Results
Reliability Evaluation
I. Product Description:
The AOZ8212ACI-05 is a two-line bi-directional transient voltage suppressor diode designed to
protect voltage sensitive electronics from high transient conditions and ESD.
This device incorporates two TVS diodes in a small SOT-23 package.
The small SOT-23 package makes it ideal for applications where PCB space is a premium. The
small size and high ESD protection makes it ideal for protecting voltage sensitive electronics from
high transient conditions and ESD.
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bonding
Mold Material
Moisture Level
AOZ8212ACI-05
Standard sub-micron
Two-line Bi-directional TVS Diode
SOT23
Bare Cu
Ag Epoxy
Cu wire
Epoxy resin with silica filler
Level 1
2
III. Reliability Stress Test Summary and Results
Test Item
Test Condition
Time
Point
Total
Sample
size
Number
of
Failures
Reference
Standard
HTRB
Temp = 150°C ,
Vdd=80% of Vbrmax
168 / 500 /
1000
hours
924 pcs
0
JESD22-A108
MSL
Precondition
168hr 85°C/85%RH +
3 cycle reflow@260°C
(MSL 1)
-
2772 pcs
0
JESD22-A113
HAST
130°C , 85%RH,
33.3 psia,
Vdd = 80% of Vbrmax
96 hours
924 pcs
0
JESD22-A110
Autoclave
121°C , 29.7psia,
RH=100%
96 hours
924 pcs
0
JESD22-A102
Temperature
Cycle
-65°C to 150°C ,
air to air,
250 / 500
cycles
924 pcs
0
JESD22-A104
Note: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 6.10
MTTF = 18700 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
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9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 6.10
9
MTTF = 10 / FIT = 18700 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
259
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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