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AS5171
High-Resolution On-Axis Magnetic
Angular Position Sensor
General Description
The AS5171 is a high-resolution angular position sensor for
precise absolute angle measurement. The AS5171 is available
with an analog output interface (AS5171A) or a digital output
interface (AS5171B).
Based on a Hall sensor technology, this device measures the
orthogonal component of the flux density (Bz) over a full-turn
rotation and compensates for external stray magnetic fields
with a robust architecture based on a 14-bit sensor array and
analog front-end (AFE). A sub-range can be programmed to
achieve the best resolution for the application. To measure the
angle, only a simple two-pole magnet rotating over the center
of the package is required. The magnet may be placed above
or below the device. The absolute angle measurement provides
an instant indication of the magnet’s angular position. The
AS5171 operates at a supply voltage of 5V, and the supply and
output pins are protected against overvoltage up to +20V. In
addition the supply pins are protected against reverse polarity
up to –20V.
The AS5171A and AS5171B are available in a SIP package
(System in Package). The package has integrated the AS5171
sensor die together with the decoupling capacitors necessary
to pass system level ESD and EMC requirements. No additional
components and PCB on the sensor side is needed. The product
is defined as SEooC (Safety Element out of Context) according
ISO26262.
Ordering Information and Content Guide appear at end of
datasheet.
Figure 1:
Typical Arrangement of AS5171 and a Magnet
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − General Description
Key Benefits and Features
The benefits and features of this device are listed below:
Figure 2:
Added Value of Using AS5171
Benefits
Features
• Resolve small angular excursion with high
accuracy
• 12-bit resolution @90° minimum arc
• Accurate angle measurement
• Low output noise, low inherent INL
• Higher durability and lower system costs (no
shield needed)
• Magnetic stray field immunity
• Enabler for safety critical applications
• Functional safety, diagnostics, dual redundant chip
version
• Suitable for automotive applications
• AEC-Q100 Grade 0 qualified
• SIP Package (sensor + decoupling capacitors
for ESD/EMC)
• System cost reduction – no PCB and additional
components are needed
Applications
The AS5171 is ideal for automotive applications like:
• Brake and Gas Pedals
• Throttle Valve and Tumble Flaps
• Steering Angle Sensors
• Chassis Ride
• EGR
• Fuel-Level Measurement Systems
• 2/4WD Switch
• Contactless Potentiometers
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − General Description
Block Diagram
The functional blocks of the AS5171A and AS5171B are shown
below:
Figure 3:
Functional Blocks of the AS5171A
VDD
Register Setting
LDO
Reverse Polarity Protection
VDD3V3
UART
OTP
Hall Sensors
OUT
Analog
Front-End
ATAN
(CORDIC)
14-bit A/D
Digital Filter
12-bit D/A
Linearizator
Driver
AGC
AS5171A
GND
Figure 4:
Functional Blocks of the AS5171B
VDD
Register Setting
LDO
Reverse Polarity Protection
VDD3V3
UART
OTP
Hall Sensors
OUT
Analog
Front-end
14-bit A/D
ATAN
(CORDIC)
Digital Filter
Linearizator
PWM
Driver
AGC
AS5171B
GND
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Pin Assignments
Pin Assignments
Figure 5:
AS5171A/B Pin Assignment (Top View, SiP)
AS5171
VDD
GND
OUT
Figure 6:
AS5171A/B Pin Description
Pin #
Pin Name
Pin Type
Description
Comments
1
VDD
Supply
Positive supply
5V supply – 100nF capacitor in SiP
Body
-
TP1
n.a.
Test pin
-
TP2
n.a.
Test pin
-
TP3
n.a.
Test pin
3
OUT
Analog output (AS5171A)
Digital output (AS5171B)
Output interface
-
TP4
n.a.
Test pin
-
VDD3V3
Supply
2
GND
Supply
SiP
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4.7nF capacitor in SIP Body
3.3V on-chip low-dropout (LDO)
output. 100nF capacitor in SIP Body
Ground
Connected to ground
ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Operating
Conditions is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Figure 7:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD
DC Supply Voltage at VDD pin
-20
20
V
Not operational
VOUT
External DC voltage at OUT pin
-0.3
20
V
Permanent
VDIFF
DC voltage difference between
VDD and OUT
-20
20
V
VREGOUT
DC voltage at the VDD3V3 pin
-0.3
5.0
V
Input Current (latch-up
immunity)
-100
100
mA
ISCR
AEC-Q100-004
Continuous Power Dissipation (TAMB = 70°C)
PT
Continuous power dissipation
66
mW
Calculated with
IDDmax=12mA;
VDD=5.5V
Electrostatic Discharge
ESDHBM on
Chip level
ESDHBM system
Electrostatic discharge HBM
±2
kV
AEC-Q100-002
Electrostatic discharge HBM on
VDD, Out and GND (outer
connects)
±4
kV
AEC-Q100-002
Temperature Ranges and Storage Conditions
TAMB
Operating temperature range
-40
150
°C
Ambient temperature
Programming@ Room
temperature
(25°C ± 20°C)
TaProg
Programming temperature
5
45
°C
TSTRG
Storage temperature range
-55
150
°C
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Absolute Maximum Ratings
Symbol
Parameter
TBODY
Package body temperature
RHNC
Relative humidity
non-condensing
MSL
Moisture sensitivity level
Min
Max
5
Units
Comments
260
°C
The reflow peak
soldering temperature
(body temperature) is
specified according to
IPC/JEDEC J-STD-020
“Moisture/Reflow
Sensitivity Classification
for Non-hermetic Solid
State Surface Mount
Devices.” The lead finish
for Pb-free leaded
packages is “Matte Tin”
(100% Sn)
85
%
Represents a maximum
floor life time of 168
hours
3
System Electrical and Timing Characteristics
All in this datasheet defined tolerances for external
components need to be assured over the whole operation
conditions range and also over lifetime.
Overall condition: TAMB = -40°C to 150°C, VDD=4.5V to 5.5V;
Components spec; unless otherwise noted
Figure 8:
Operating Conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
4.5
5.0
5.5
V
3.45
3.6
V
VDD
Positive supply voltage
VREG
Regulated voltage
VDD3V3 should not be loaded
by any external DC current
3.3
IDD_A
Supply current AS5171A
AGC=255 (no magnet placed);
no output load; no short circiut
4
12
mA
lDD_B
Supply current AS5171B
AGC=255 (no magnet placed);
no output load; no short circiut
4
10
mA
ISTART
Supply current at start-up
VREG = 2.25V
10
mA
Start-up time
Functional mode
10
ms
TSUP
2.5
5
TAMB= -40°C to 150°C, VDD = 4.5 – 5.5V (5Voperation),
Magnetic Characterization; unless otherwise noted
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Absolute Maximum Ratings
Figure 9:
Electrical System Characteristics
Symbol
Parameter
CRES
Core resolution
ARES
Analog resolution
(AS5171A)
DRES
Digital resolution
(AS5171B)
Conditions
Min
Typ
Range > 90°
Max
Unit
14
bit
12
bit
12
bit
INLopt
Integral non-linearity
(optimum)
Best aligned reference magnet(1)
at 25°C over full turn 360°
-0.5
0.5
deg
INLtemp
Integral non-linearity
(optimum)
Best aligned reference magnet(1)
over temperature -40°C to 150°C
over full turn 360°
-0.9
0.9
deg
INL
Integral non-linearity
Best aligned reference magnet(1)
over temperature -40°C to 150°C
over full turn 360º and
displacement
-1.4
1.4
deg
ON
Output noise peak to peak
Static conditions - filter on
1
LSB
ST
Sampling time
125
μs
Note(s):
1. Reference magnet: NdFeB, 6 mm diameter, 2.5 mm thickness
Figure 10:
Power Management – Supply Monitor - Timing
Symbol
Parameter
VDDUVTH
VDDUVTL
Min
Typ
Max
Unit
VDD undervoltage upper
threshold
3.5
4.0
4.5
V
VDD undervoltage lower
threshold
3.0
3.5
4.0
V
VDDUH
VDD undervoltage
hysteresis
300
500
900
mV
UVDT
VDD undervoltage
detection time
Time devices detects
undervoltage VDD< VDDUVTH
10
50
250
μs
UVRT
Undervoltage recovery
time
Time device return into normal
mode from failure band
VDD > VDDUVTH
10
50
250
μs
VDDOVTH
VDD overvoltage upper
threshold
6.0
6.5
7.0
V
ams Datasheet
[v1-02] 2016-Apr-25
Conditions
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AS5171 − Absolute Maximum Ratings
Symbol
Min
Typ
Max
Unit
VDD overvoltage lower
threshold
5.5
6.0
6.5
V
VDDOH
VDD overvoltage
hysteresis
300
500
900
V
OVDT
VDD overvoltage
detection time
Time devices detects
overvoltage VDD> VDDOVTL
500
1000
2000
μs
OVRT
VDD overvoltage
recovery time
Time device return into normal
mode from failure band VDD <
VDDOVTL
500
1000
2000
μs
TDETWD
WatchDog error
detection time
Time device detects oscillator
failure till output is in failure
band
12
ms
VDDOVTL
Parameter
Conditions
TAMB = -40°C to 150°C, VDD = 4.5V to 5.5V, unless otherwise
noted.
Two-pole cylindrical diametrically magnetized source:
Figure 11:
Magnetic Characteristics
Symbol
Bz
BzE
Disp(1)
Parameter
Conditions
Min
Orthogonal magnetic
field strength
Required orthogonal
component of the magnetic
field strength measured at the
package surface along a circle
of 1.25 mm
MFER = 0
Orthogonal magnetic
field strength – extended
mode
Required orthogonal
component of the magnetic
field strength measured at the
package surface along a circle
of 1.25mm
MFER = 1
Displacement radius
Offset between defined
device center and magnet
axis. Dependent on the
selected magnet.
Typ
Max
Unit
30
70
mT
10
90
mT
0.5
mm
Note(s):
1. Reference magnet: NdFeB, 6 mm diameter, 2.5 mm thickness
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Absolute Maximum Ratings
Figure 12:
Electrical and Timing Characteristics Analog Output (AS5171A)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
INLOS
INL output stage
-6
+6
LSB
DNLOS
DNL output stage
-5
+5
LSB
RERR(1)
Ratiometricity error
Between 4% and 96% of VDD
-0.5%
0.5%
VDD
BVPU
Output voltage broken
VDD with pull-up
resistor
Pull-up resistor must be in the
specified range
(see Figure 32)
96
100
%VDD
BGPD
Output voltage broken
ground with pull-down
resistor
Pull-down resistor must be in
the specified range
(see Figure 32)
0
4
%VDD
OSSCG
Output short-circuit
current GND
OUT = GND
-20
-10
-5
mA
OSSCV
Output short-circuit
current VDD
OUT = VDD
5
10
20
mA
OSSDT
Output short-circuit
detection time
OUT = GND or OUT = VDD
20
200
600
μs
OSSRT
Output short-circuit
recovery time
2
5
20
ms
OLCH
Output level clamping
high
Output current at OUT pin
-3 mA
OLCL
Output level clamping
low
Output current at OUT pin
3 mA
OSPSR
Output stage positive
step response (driver
only)
96
%VDD
4
%VDD
From 0 to 90%VDD, measured
at OUT pin, with
RPUOUT = 4.7kΩ,
CLOAD = 1nF, VDD = 5V
250
μs
OSNSR
Output stage negative
step response (driver
only)
From VDD to 10%VDD,
measured at OUT pin, with
RPUOUT = 4.7kΩ,
CLOAD = 1nF, VDD = 5V
250
μs
OSTD
Output stage
temperature drift
of value at mid code, info
parameter not tested in
production
0.2
%
-0.2
Note(s):
1. For each code the ratiometricity error is defined as follows:
VOUTRATE=((VOUTact – (VOUTtyp*(VDDact/ VDDtyp)))/VDDtyp)*100
Where:
- VOUTact is the actual output voltage
- VOUTtyp is the typical output voltage
- VDDact is the actual supply voltage
- VDDtyp is the typical supply voltage
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Absolute Maximum Ratings
Figure 13:
Electrical and Timing Characteristics PWM Output (AS5171B)
Symbol
Parameter
PWMSSOCG
Short-circuit output
current
PWMSSOCV
Conditions
Min
Typ
Max
Unit
OUT = GND
-20
-10
-5
mA
Short-circuit output
current
OUT = VDD
5
10
20
mA
PWMSSDT
PWM short-circuit
detection time
OUT = GND or
OUT = VDD
5
% PWM
clock cycle
PWMSSRT
PWM short circuit
recovery time
% PWM
clock cycle
6
BKPWMVOH
PWM output voltage
high in broken condition
Broken VDD or broken
GND, OUT = high,
PWMVOH=VDD-VOUT
RPU = 10kΩ or
RPD = 10kΩ
BKPWMVOL
PWM output voltage low
in broken condition
Broken VDD or broken
GND, OUT = low,
RPU = 10kΩ or
RPD = 10kΩ
PWMF7
PWM frequency
PWMFR = 111
112.5
125
137.5
Hz
PWMF6
PWM frequency
PWMFR = 110
180
200
220
Hz
PWMF5
PWM frequency
PWMFR = 101
225
250
275
Hz
PWMF4
PWM frequency
PWMFR = 100
360
400
440
Hz
PWMF3
PWM frequency
PWMFR = 011
450
500
550
Hz
PWMF2
PWM frequency
PWMFR = 010
720
800
880
Hz
PWMF1
PWM frequency
PWMFR = 001
900
1000
1100
Hz
PWMF0
PWM frequency
PWMFR = 000
1800
2000
2200
Hz
PWMVOH
PWM output voltage
level high
IOUT = 5 mA,
PWMVOH = VDD - VOUT
0
0.4
V
PWMVOL
PWM output voltage
level high
IOUT = 5 mA
0
0.4
V
PMM slew rate fast
Between 25% and 75%
of VDD,
RPUOUT = 4.7kΩ,
CLOUT1 = 4.7nF,
PWMSR = 0
1
4
V/μs
PWMSRF
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0
0.4
V
0
0.4
V
2
ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Absolute Maximum Ratings
Symbol
PWMSRS
Parameter
PMM slew rate slow
Conditions
Between 25% and 75%
of VDD,
RPUOUT = 4.7kΩ,
CLOUT1 = 4.7nF,
PWMSR = 1
Min
Typ
Max
Unit
0.5
1
2
V/μs
Figure 14:
Electrical and Timing Characteristics UART Interface
Symbol
Parameter
UARTVIH
UART high level input voltage
UARTVIL
UART low level input voltage
UARTVOH
UART high level output voltage
UARTVOL
UART low level output voltage
UARTBRLIM(1)
UART baud rate
Conditions
Min
Typ
Max
70
%VDD
30
VDD-0.5
2400
Unit
%VDD
V
0.5
V
9600
Baud
Note(s):
1. Typ. error 1%. Indirect tested.
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Detailed Description
Detailed Description
The AS5171 is a Hall-based rotary magnetic position sensor
using a CMOS technology. The lateral Hall sensor array converts
the magnetic field component perpendicular to the surface of
the chip into a voltage.
The signals coming from the Hall sensors are first amplified and
filtered before being converted by the analog-to-digital
converter (ADC). The output of the ADC is processed by the
CORDIC block (Coordinate-Rotation Digital Computer) to
compute the angule and magnitude of the magnetic field
vector. The sensor and analog front-end (AFE) section works in
a closed loop alongside an AGC to compensate for temperature
and magnetic field variations. The calculated magnetic field
strength (MAG), the automatic gain control (AGC) and the angle
can be read through the output pin (OUT) in UART mode.
The magnetic field coordinates provided by the CORDIC block
are fed to a digital filter which reduces noise. A linearization
block generates the transfer function, including linearization.
The AS5171 is available with two different output interfaces:
analog ratiometric (AS5171A) or digital PWM (AS5171B).
The output of the AS5171 can be programmed to define a
starting position (zero angle) and a stop position (maximum
angle). An embedded linearization algorithm allows reducing
the system INL error due, for example, to mechanical
misalignment, magnet imperfections, etc.
The AS5171 can be programmed through the OUTpin with a
UART interface which allows writing an on-chip non-volatile
memory (OTP) where the specific settings are stored. The
AS5171 can be programmed by the ams programming tool,
both at the component and board level.
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Register Description
Register Description
The register description for AS5171A/B are explained below:
• Descriptions and Settings with Analog are supported by
AS5171A
• Descriptions and Settings with PWM are supported by
AS5171B
Figure 15:
Non-Volatile Memory Register Description
Address
Bit Position
Field
0x0A
7:0
CUSTID0
Customer ID byte 0
0x0B
7:0
CUSTID1
Customer ID byte 1
0x0C
7:0
CUSTID2
Customer ID byte 2
0x0D
7:0
CUSTID3
Customer ID byte 3
0
PWMINV
PWM inverted
1
PWMSR
PWM slew rate
(0 = PWM slew rate fast PWMSRF,
1 = PWM slew rate slow PWMSRS)
3:2
DIGOS
Digital output stage
(00 = PWM push-pull
01 = PWM pull-down
10 = PWM pull-up)
It applies to the AS5171B only
6:4
RBKDEB
Analog read-back debouncing
7
n.a.
Not used
0
FBS
Failure band selection (0 = lower failure band,
1 = upper failure band)
2:1
HYST
Hysteresis across the brake point
4:3
QUAD
Quadrant selection
7:5
PWMFR
PWM frequency selection
1:0
PWMRTH
PWM rising threshold tbd
3:2
PWMFTH
PWM falling threshold tbd
7:4
n.a.
Not used
4:0
n.a.
Not used
5
n.a.
Not used
6
n.a.
Not used
7
n.a.
Not used
0x0E
0x0F
0x10
Description
0x11
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Register Description
Address
Bit Position
Field
Description
3:0
n.a
No use. Default 0
6:4
n.a
No use. Default 0
3:0
n.a
No use. Default 0
6:4
n.a
No use. Default 0
0x12
0x13
0x14
7:0
CLMPH
Clamping level high
Reg 0x14[0] =LSB
Reg 0x15[3]=MSN
CLMPL
Clamping level low
Reg 0x15[4] =LSB
Reg 0x16[7]=MSN
3:0
0x15
7:4
0x16
7:0
0x17
7:0
0x18
7:0
PPOFFSET
Post processing offset
Reg 0x17[0] =LSB
Reg 0x19[3]=MSB
PPGAIN
Post processing gain
Reg 0x19[4] =LSB
Reg 0x1B[3]=MSB
3:0
0x19
7:4
0x1A
7:0
4:0
0x1B
7:5
0x1C
7:0
BP
Break point
Reg 0x1B[5] =LSB
Reg 0x1D[2]=MSB
2:0
0x1D
0x1E
Page 14
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3
MFER
Magnetic field extended range (1 = Bz, 0 = BzE)
4
AER
Angle extended range (set to 1 if the maximum
angle excursion is smaller than 22 degree)
6:5
FILTER
7
CUSLOCK
7:0
SIGN
Post processing filter
Customer settings lock
Signature
ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Register Description
Figure 16:
Volatile Memory Register Description
Address
Bit Position
0x22
7:0
Field
R/W
R/W
DAC12IN
3:0
R/W
Description
Input word of the 12-bit output DAC
(Reg0x23[3] = MSB, Reg0x22[0] = LSB)
4
DAC12INSEL
R/W
DAC 12 input buffer selection
5
DSPRN
R/W
Digital signal processing reset
6
GLOAD
R/W
Enable of gload
7
-
-
Not used
ANGLECORDIC
R
Angle of the CORDIC output block.
(Reg0x33[5] = MSB, Reg0x32[0] = LSB)
7:6
-
-
Not used
0x34
7:0
MAG
R
CORDIC magnitude
0x35
7:0
AGC
R
AGC value
0x36
7:0
ANGLEFILTER
R
Angle of the digital filter output block
(Reg0x37[3] = MSB, Reg0x36[0] = LSB)
-
-
Not used
0x23
0x32
7:0
5:0
0x33
0x37
3:0
0x37
7:4
Figure 17:
Special Functions
Address
Bit Position
0x60
7:0
0x61
7:0
0x62
7:0
0x63
7:0
Field
P2F
BURNOTP
ams Datasheet
[v1-02] 2016-Apr-25
Description
Pass-to-Function, see UART
Permanently burn OTP, see UART
Page 15
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AS5171 − Register Description
UART Interface
The AS5171 is equipped with a UART interface, which allows
reading and writing the registers as well as permanently
programming the non-volatile memory (OTP). By default
(factory setting, customer_ lock = 0) the AS5171 is in the
so-called Communication Mode and the UART is connected at
the output pin (OUT). In this mode, the device is in open-drain
mode and therefore a pull-up resistor has to be connected on
the output.
The UART interface allows reading and writing two consecutive
addresses. The standard UART sequence consists of four frames.
Each frame begins with a start bit (START), which is followed by
8 data bits (D[0:7]), one parity bit (PAR), and a stop bit (STOP),
as shown in Figure 18.
Figure 18:
UART Frame
START
D[0]
D[1]
D[2]
D[3]
D[4]
D[5]
D[6]
D[7]
PAR
STOP
The PAR bit is even parity calculated over the data bits (D[0:7]).
Each frame is transferred from LSB to MSB.
The four frames are shown in Figure 19.
Figure 19:
UART Frame Sequence
Frame Number
D[7]
1
2
D[6]
D[5]
D[4]
D[3]
D[2]
D[1]
D[0]
0x55
R/W
ADDRESS
3
DATA1
4
DATA2
The first frame is the synchronization frame and consists of
D[0:7] = 0x55 followed by the parity bit (PAR=0) and the stop
bit. This frame synchronizes the baud rate between the AS5171
and the host microcontroller.
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ams Datasheet
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AS5171 − Register Description
The second frame contains the read/write command (D[7] = 0
Write, D[7] = 1 Read) and the address of the register (D[6:0] =
ADDRESS).
The content of the third and fourth frames (DATA1 and DATA2)
will be written to or read from the location specified by
ADDRESS and ADDRESS+1, respectively.
Figure 20 and Figure 21 show examples of read and write.
Figure 20:
Example of Write (Reg[0x22] = 0x18, Reg[0x23] = 0xA2)
0x55*
0x22
0x18
0xA2
PAR
STOP
PAR
STOP
START
WRITE
PAR
STOP
START
MSB
PAR
STOP
START
START
LSB
0 1 0 1 0 1 0 1 0 0 1 0 0 1 0 0 0 1 0 0 0 1 0 0 0 0 1 1 0 0 0 0 1 0 0 1 0 0 0 1 0 1 1 1
Figure 21:
Example of Read (Reg[0x2B], Reg[0x2C])
Content of
register 0x2B
MSB
READ
PAR
STOP
START
MSB
PAR
STOP
START
START
LSB
0 1 0 1 0 1 0 1 0 0 1 0 1 1 0 1 0 1 0 1 1 1 0
Content of
register 0x2C
1 0
1
PAR
STOP
0x2B
PAR
STOP
START
0x55
Exiting Communication Mode
Communication mode is exited and operational mode is
entered with a Pass-to-function (P2F) command, by writing to
the virtual registers 0x60 and 0x61:
P2F: write(0x60) = 0x70, write(0x61) = 0x51
No more commands can be sent after sending this command,
because the device is permanently placed in operational mode.
Programming OTP Registers
The BURNOTP command writes the OTP registers with their
programmed values. The command is issued by writing to
virtual registers 0x62 and 0x63:
BURNOTP: write(0x62) = 0x70, write(0x63) = 0x51.
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Register Description
Customer ID
A specific identifier chosen by the user can be stored in the
non-volatile memory. This identifier consists of 4 bytes and can
be stored in the locations CUSTID0, CUSTID1, CUSTID2, and
CUSTID3.
Output Linear Transfer Function
A linear transfer function controls the state of the output in
response to the absolute orientation of the external magnet.
The parameters which control this function are shown in
Figure 22.
To calculate this settings into the corresponding sensor
settings, ams provides a programming tool, specific DLL or the
complete source code. For more information, please contact
ams.
Figure 22:
Transfer Function Control Parameters
Symbol
Parameter
Resolution [bit]
T1
Mechanical angle starting point
14
T2
Mechanical angle stop point
14
OT1
Output at the starting point (T1)
12
OT2
Output at the stop point (T2)
12
CLMPL
Clamping level low
12
CLMPH
Clamping level high
12
BP
Breakpoint
14
As shown in the Figure 23, the parameters T1, T2, OT1, and OT2
define the input-to-output linear transfer function. The
dedicated programmer for the AS5171 uses the parameters
from Figure 22 to generate the corresponding settings CLMPL,
CLMPH, PPOFFSET, PPGAIN and BP (see Figure 23).
The clamping level parameters CLMPL and CLMPH define the
absolute minimum and maximum level of the output. Both
clamping levels can be set with the 12 LSBs out of the 12-bit
output resolution. CLMPL and CLMPH must always be set
outside of the lower and upper diagnostic failure band defined
by the output broken wire voltage (see Figure 23: BGPD and
BVPU).
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AS5171 − Register Description
Figure 23:
Output Transfer Function
Measured angle
Mechanical range
Max out
Upper failure band
BVPU
Upper clamping band
CLMPH
OT2
OT1
CLMPL
Lower clamping band
BGPD
Lower failure band
Mechanical angle
T1
T2
BP
Electrical range
The breakpoint BP sets the discontinuity point where the
output jumps from one clamping level to the other. It is strongly
recommended to set the breakpoint at the maximum distance
from the start and stop position (T1 and T2). To handle the case
of a full turn, a hysteresis function across the breakpoint can be
used to avoid sudden jumps between the lower and upper
clamping level.
Figure 24:
Hysteresis Setting
HYST
Hysteresis LSBs
00
0
01
56
10
91
11
137
The hysteresis LSB is based on the core resolution (14-bit).
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Register Description
The AS5171 features a programmable digital filter. As shown in
Figure 25 in a static condition (no change of the input), the
static error band is ±0.5 LSB (at 12-bit resolution). Whenever an
input step occurs, the output (measured angle) follows the
input (mechanical angle) entering a certain error band within
the step response time. From the time when the output is within
the static error band the output takes 1000 ms to settle to the
static error band achieving again ±0.5 LSB output noise. The
filter is not usable in 360° range, if the Hysteresis setting is on.
Figure 25:
Step Response
Measured Angle
Dynamic
Error Band
Static Error Band
Input
Output
response
Static Error Band
Sampling
Frequency
time
Step Response
Time
1000ms
It is possible to optimize the step response time versus the
dynamic error band with the FILTER setting.
Figure 26:
FILTER Setting
FILTER
Dynamic Error Band [LSB]
Step Response
Time [µs]
00
Filter off
Not applicable
01
23
5 CORDIC cycles
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ams Datasheet
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AS5171 − Register Description
Multiple Quadrants
The multiple quadrants option allows repeating the same
output control parameters up to 4 times over the full turn
rotation as shown in the Figure 28, Figure 29, and Figure 30. The
QUAD parameter sets the number of quadrants, as shown in the
Figure 27.
Figure 27:
Number of Quadrants
QUADEN
Number of Quadrants
00
Single
01
Double
10
Triple
11
Quadruple
Figure 28:
Dual Quadrant Mode
Measured angle
Max out
BVPU
CLMPH
Upper failure band
Upper clamping band
CLMPL
Lower clamping band
BGPD
Lower failure band
360
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Register Description
Figure 29:
Triple Quadrant Mode
Measured angle
Max out
BVPU
CLMPH
Upper failure band
Upper clamping band
CLMPL
Lower clamping band
BGPD
Lower failure band
360
Figure 30:
Quadruple Quadrant Mode
Measured angle
Max out
BVPU
CLMPH
Upper failure band
Upper clamping band
CLMPL
Lower clamping band
BGPD
Lower failure band
360
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Register Description
Extended Magnetic Input Range
The magnetic input field range can be boosted with the MFER
bit. The extended magnetic field allows increasing the
maximum air gap between the AS5171 and the magnet.
Analog Output (AS5171A)
The AS5171A provides a linear analog ratiometric output signal.
The output buffer features a push-pull analog output stage
which can be loaded with a pull-down or a pull-up resistor. The
output voltage represents the angular orientation of the
magnet above the AS5171A on a linear absolute scale and is
ratiometric to VDD.
PWM Output (AS5171B)
The AS5171B has a PWM output. With the DIGOS setting, the
PWM output stage can be programmed as a push-pull,
pull-down, or pull-up driver. The duty-cycle of each pulse is
proportional to the absolute angular position of the external
magnet.
The PWM signal consists of a frame of 4096 clock periods as
shown in Figure 31. The PWM frame begins with a certain
number of clocks high, defined by the CLMPL, which is followed
by the electrical angle information. The frame ends with a
certain number of clock pulses low, as defined by the CLMPH.
It is possible to invert the frame using the PWMINV setting.
Figure 31:
Pulse Width Modulation Frame
n
1
2
3
4
5
PWM period
Mechanical angle
CMPL
Electrical angle
CMPH
The PWMFR setting sets the duration of the PWM frequency.
The PWMSR setting chooses between fast and slow steps.
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[v1-02] 2016-Apr-25
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AS5171 − Register Description
Diagnostic and Functional Safety
AS5171 can be used in safety critical applications. For this
reason, AS5171 is developed as SEooC (Safety element out of
context) according the ISO26262, which assumed safety goals
and assumed ASIL level.
The assumption of use (AoU) and the robust embedded
self-diagnostic, to achieve a high ASIL level in the application,
are described in the AS5171 safety manual.
For additional information regarding the ISO26262 flow at ams
and the SEooC relevant documents (e.g. FMEDA, safety manual,)
please contact the ams technical support for magnetic position
sensors.
Figure 32:
Diagnostic Table
SM
Safety Mechanism
SM1
Watchdog failure
No, if a watchdog error is detected, the
sensor provides the error information
till a sensor reset happens
Output is going into HIZ -->
failure band (depending on
output resistor)
SM2
Offset compensation
not complete
Yes, if the offset is below the specified
threshold, sensor recovers the output
Output is forced in failure band.
Depending on FBS setting
SM3
CORDIC overflow
Yes, if the magnetic input field is below
the specified threshold, sensor
recovers the output
Output is forced in failure band.
Depending on FBS setting
SM4
Magnetic input field
too high/too low
Yes, if the magnetic field is inside the
specific range, after the recovery time
the sensor leave the failure
Output is forced in failure band.
Depending on FBS setting
SM5
Vreg undervoltage
Yes
Hi-z: Failure band related to the
out load
SM6
Reverse polarity
Yes, if reverse polarity issue is solved.
No direct safety mechanism, it’s a
protection!
Hi-z: Failure band related to the
out load
SM7
VDD overvoltage
Yes, if the VDD is below the specified
threshold.
Hi-z: Failure band related to the
out load
SM8
VDD undervoltage
Yes, if the VDD is above the specified
threshold
Hi-z: Failure band related to the
out load
SM9
Broken VDD
Yes
Hi-z: Failure band related to the
out load
SM10
ADC check
No, sensor stays in failure band till the
Sensor is resetting.
Hi-z: Failure band related to the
out load
SM11
Analog read fail
Yes
Hi-z: Failure band related to the
out load
SM12
Short circuit
Yes
Hi-z: Failure band related to the
out load
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Recoverable
Safe State
ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Register Description
SM
Safety Mechanism
Recoverable
Safe State
SM13
Signature
No, sensor stays in failure band till the
sensor is resetting
Hi-z: Failure band related to the
out load
SM14
Broken GND
Yes
Hi-z: Failure band related to the
out load
The FBS setting allows selecting the failure band (lower or
upper) when the output goes into diagnostic mode.
Diagnostic Explanations
For a detailed explanation of the diagnostic and the SPFM
please contact the ams application team for magnetic position
sensor.
Analog Read Fail (SM11)
This safety mechanism operates differently for AS5171A
(analog) and AS5171B (digital):
• For AS5171B readout failure: After a falling edge there
must be a rising edge after a defined time.
In case this is not respected output driver is kept in high
impedance. After a certain time this condition is checked
again.
The readout mechanism for AS5171B is defined by PWMRTH
and PWMFTH, which set the maximum timeout period to wait
for a falling/rising before triggering an error condition,
according to the figures below.
Figure 33:
PWMRTH Conditions
PWMRTH
Delay (μs)
0
0
PWM Read Back rise disabled
0
1
24-28
1
0
56-60
1
1
112-120
Figure 34:
PWMFTH Conditions
PWMFTH
Delay (μs)
0
0
PWM Read Back fall disabled
0
1
24-28
1
0
56-60
1
1
112-120
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[v1-02] 2016-Apr-25
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AS5171 − Register Description
• For AS5171A readout failure: Comparison of the analog
output information versus the digital information of the
sensor. If the difference is too high output driver is kept in
high impedance. After a certain time this condition is
checked again.
The readout mechanism for AS5171A is defined by RDBCKDEB,
which set the maximum timeout period to wait before
triggering an error condition, according to the tables below.
Figure 35:
AS5171A Readout Mechanisms
RDBCKDEB02
RDBCKDEB01
RDBCKDEB00
CORDIC
Cycles(1)
Note
0
0
0
0
Analog Read Back disabled
0
0
1
1
0
1
0
2
0
1
1
4
1
0
0
8
1
0
1
16
1
1
0
32
1
1
1
64
Note(s):
1. 1 CORDIC cycle typ.:111μs
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Application Information
Application Information
Signature Calculation
The OTP of AS5171A and AS5171B uses a BIST technique with
Multiple Input Signature Register circuits.
To activate this BIST a calculation of the Signature Byte is
necessary and has to store into the OTP during the
programming sequence.
For calculating the signature byte the content of the whole
memory (0x02 to 0x1D) has to be read.
Out of this information the following calculation has to be done.
Byte: 0x02 = data2
….
Byte: 0x1D = data29
Unsigned int signature (unsigned int * content)
{
unsigned int misr,misr_shift,misr_xor,misr_msb;
misr = 0;
for (int i=0; i<28; i++) {
misr_shift = (misr<<1);
misr_xor = (misr_shift ^ content[i])%256;
misr_msb = misr/(128);
if (misr_msb == 0)
misr = misr_xor;
else
misr = (misr_xor ^ 29)%256;
}
return misr;
}
content= {,data2,data3,data4,data5,data6,
data7,data8,data9,data10,data11,
data12,data13,data14,data15,data16,
data17,data18,data19,data20,data21,data22,
data23,data24,data25,data26,data27,data28,data29};
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Application Information
Programming Parameter
The programming has to be performed in communication
mode. If the cust_lock=0, the sensor starts in communication
mode.
The following procedure and the block diagram are showing
the common 2 point calibration. For special calibration
procedure:
AS5171A: Analog output driver calibration
AS5171A/AS5171B: Linearization.
Please go in contact with the ams application team.
Burn and Verification of the OTP Memory
1.
Power on cycle
2. Move magnet to the first mechanical start position
3. Reset the DSP. Writing 0x20 into Reg(0x0023)
4. Read out the measured angle from ANGLECORDIC
register: T1 Value
5. Moving of magnet to the second mechanical position
(stop position)
6. Read out the measured angle from ANGLECORDIC
register: T2 Value
7. Write T1,T2 and all other transfer parameter into the
DLL: Calculation of GAIN, Offset, BP, Clamping
8. Write reg(0x000A) to reg (0x001E) with the custom
settings and the calculated values from point 7. -->
AS5171 Settings
9. Read reg(0x000A) to reg (0x001E) ---> Read register
step 1
10. Comparison of AS5171 settings with content of read
register step 1
11. If point 10 is correct: Decision: pass 2 function
(measurement verification) or programming.
Programming sequence starts with point 12.
12. Write reg(0x000A) to reg (0x001E) with the custom
settings and the calculated values from point 7 +
customer lock Bit. --> AS5171 Settings_Prog
13. Read reg(0x0000) to reg (0x001D) ---> Read register
step 2
14. Calculation of Signature Byte out of Read register step
2 content: Signature Byte
15. Write 8Bit Signature to reg(0x001E)
16. Write reg(0x000A) to reg (0x001E) with the custom
settings and the calculated values from point 7 +
customer lock Bit + Signature byte. --> AS5171 Settings_
Prog_final
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Application Information
17. Read reg(0x000A) to reg (0x001E) ---> Read register
step 3
18. Comparison of AS5171 Settings_Prog_final with
content of read register step 3
19. If point 18 is correct, start the OTP burn procedure by
writing: Reg(0x0062)=0x70 and Reg(0x0063)=0x51
20. Programming procedure is complete after 10ms
21. Clear the memory content writing 0x00 into reg
(0x001E)
22. Write Reg0x23=0x40 to set the threshold for the guard
band test (1)
23. 5ms wait time to refresh the non-volatile memory
content with the OTP content
24. Read reg(0x000A) to reg (0x001E) ---> Read register
step 4
25. If content from reg (0x001E) compares with content
from “Signature Byte” refresh was successful
26. Comparison of AS5171 Settings_Prog_final with
content of read register step 4. Mandatory: guard band
test (1).
27. If point 26 fails, the test with the guard band (1) was not
successful and the device is incorrectly programmed. A
reprogramming is not allowed.
28. Clear the memory content writing 0x00 into reg
(0x001E)
29. Write Reg0x23=0x00to set the threshold for the guard
band test (1)
30. 5ms wait time to refresh the non-volatile memory
content with the OTP content
31. Read reg(0x000A) to reg (0x001E) ---> Read register
step 5
32. If content from reg (0x001E) compares with content
from “Signature Byte” refresh was successful
33. Comparison of AS5171 Settings_Prog_final with
content of read register step 5. Mandatory: guard band
test (1)
34. If point 33 fails, the test with the guard band (1) was not
successful and the device is incorrectly programmed.
A reprogramming is not allowed.
35. Reset of the device. After power on the Sensor starts in
functional mode
Note(s):
1. Guard band test:
Restricted to temperature range: 25 °C ± 20 °C
Right after the programming procedure (max. 1 hour with same
Conditions 25°C ± 20 °C)
Same VDD voltage
The guard band test is only for the verification of the burned OTP fuses during
the programming sequence.
A use of the guard band in other cases is not allowed.
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Application Information
Figure 36:
OTP Memory Burn and Verification Flowchart
Start
Write
Reg(0x0062) = 0x70
Reg(0x0063) =0x51
Move to mechanical
start position
Wait 10ms
Reset DSP
Write reg
(0x0023) = 0x10
Write
Reg0x1E= 0x00
Write 0x00 into signature
byte
Read Cordic Value 1
14 Bit value
Read
Reg 0x33[5]=MSB
Reg 0x32[0]=LSB
Write
Reg0x23= 0x40
Set Guardband 1
Move to mechanical
end position
Wait 5ms
Reset DSP
Write reg
(0x0023) = 0x10
Read
Reg 0x0A
To
Reg 0x1E
Read Cordic Value 2
14 Bit value
Read
Reg 0x33[5]=MSB
Reg 0x32[0]=LSB
Reg 0x1F = 0x00
Power on cycle
Start OTP burning procedure
correct
Read register Step 3
Read content of signature
byte
Not correct
DLL Calculation for Gain;
Offset; BP; Clamping
Write parameter
into DLL and
calculate the OTP
values
Verify 3
Not correct
Comparison of written content
(Content A) with content of
Read Register Step 3
Mandatory Guardband Test
correct
AS5171 Settings
Write Reg 0x0A
to
Write Reg 0x1E
Read Registers Step 1
Read
Reg 0x0A
To
Reg 0x1E
Comparison of written
content (Reg 0x0A to Reg
0x1E) with content of Read
Register Step 1
Verify 1
Programming or
Pass2Function
Programming
Pass2Function
Guardbandtest fails.
Wrong programming
Reprogramming not allowed
Write
Reg0x1E= 0x00
Write
Reg0x23= 0x00
Not correct
RESET
Wait 5ms
Write 0x00 into signature
byte
Set Guardband 2
correct
correct
correct
Read
Reg 0x0A
To
Reg 0x1E
Read register Step 4
pass2function
Measurement
Verification
Read content of signature
byte
Reg 0x1E = 0x00
Programming
Not correct
Verify 5
Not correct
Comparison of written content
(Content A) with content of Read
Register Step 4
MANDATORY GUARDBAND-TEST
correct
Write customer content +
customer lock Bit
Page 30
Document Feedback
Write Reg 0x0A
to
Write Reg 0x1E
Reading of full OTP content
(customer area and ams
area)
Read
Reg 0x00
To
Reg 0x1D
Signature Byte calculation
Calculate Signature
8 Bit Signature Byte
Write
Reg 0x1E
Writing again the full
customer area content +
signature byte (Content A)
Write
Reg 0x0A
To
Reg 0x1E
Read Registers Step 2
Read
Reg 0x0A
To
Reg 0x1E
Comparison of written
content (Content A) with
content of Read Register
Step 2
Verify 2
Reset
Guardbandtest fails.
Wrong programming
Reprogramming not allowed
END
Correct: Device in
functional mode
Not correct
Reset
ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Application Information
Recommended Application Diagrams and
Built-In Capacitors
Figure 37:
Application with Pull-Down Load Resistor
AS5171 SIP Package electrical drawing
VDD
TP4
VDD3V3
OUT
ECU
VDD
OUT
AS5171
Sensor DIE
C1
C2
TP1
TP2
TP3
C3
CL
R LPD
GND
GND
Figure 38:
Application with Pull-Up Load Resistor
AS5171 SIP Package electrical drawing
VDD
TP4
VDD3V3
OUT
ECU
VDD
R LPU
OUT
AS5171
Sensor DIE
C1
C2
TP1
TP3
TP2
GND
C3
CL
GND
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[v1-02] 2016-Apr-25
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AS5171 − Application Information
Figure 37 and Figure 38 show the recommended schematic in
the application. C1, C2 and C3 are Built-in capacitors in the SIP
Package as shown in Figure 42.
C1
C3
C2
Figure 39:
SIP Components
The built-in capacitors are ceramic multilayer type X8R. The
capacitors build for high temperature applications up to 150°C
Components Spec
Figure 40:
SIP Components and Recommended ECU Components for AS5171A
Component
Symbol
Min
Typ
Max
Unit
Notes
SIP Component
VDD buffer capacitor
C1
90
100
110
nF
Included in the SIP
VDD3V3 regulator capacitor
C2
90
100
110
nF
Included in the SIP
OUT load capacitor (sensor PCB)
C3
4,23
4.7
5,17
nF
Included in the SIP
ECU Component
OUT load capacitor (ECU)
CL
0
33
nF
OUT pull-up resistance
RLPU
4
10
kΩ
OUT pull-down resistance
RLPD
4
10
kΩ
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Application Information
Figure 41:
SIP Components and Recommended ECU Components for AS5171 B With PWM
Component
Symbol
Min
Typ
Max
Unit
Notes
SIP Component
VDD buffer capacitor
C1
90
100
110
nF
Included in the SIP
VDD3V3 regulator capacitor
C2
90
100
110
nF
Included in the SIP
OUT load capacitor (sensor PCB)
C3
4,23
4.7
5,17
nF
Included in the SIP
ECU Component
CL
0
33
nF
OUT pull-up resistance
RLPU
1
10
kΩ
OUT pull-down resistance
RLPD
1
10
kΩ
OUT load capacitor (ECU)
Information Regarding Manufacturability of
AS5171A and AS5171B
For the SiP Package which is used for AS5171A and AS5171B,
please refer to the following document (available upon
request):
Application Note SiP Dual Mold Package
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Package Drawings & Mark ings
Package Drawings & Markings
Figure 42:
Packaging Outline Drawing (SiP)
1,90 ±0,15
0,40 ±0,05
0,60 ±0,10
25,34 ±0,15
12° ±2°
,20
+0 ,30
-0
0
,3
+0,10
1,10 - 0,20
+0,25
10,60 - 0,20
+0,20
0,65 - 0,15
4,85 ±0,15
A
12° ±2°
1,75 BSC
12° ±2°
5,92 ±0,15
12° ±2°
1,27 BSC
+0,05
0,60 - 0,15
B
R0
+0,25
7,05 - 0,20
0,60 ±0,10
2,10 ±0,15
+0,10
0,35 - 0,05
0,90 ±0,10
2,54 BSC
View A
+0,20
1,44 - 0,15
5,31 ±0,15
2,53 ±0,10
RoHS
1,60
Green
1,60 ID)
cav.
1,57
0,90
1,90
2,60
1,65
tom
(bot
2,47
View B
Note(s):
1. All dimensions are nominal are in millimeters.
2. Tolerances shown represent expected values and are to be verified. Tolerances will be guaranteed prior to production release.
3. Ejector pin marks with max. depth 0,1 mm to be expected on the package backside.
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Package Drawings & Markings
Marking
Figure 43:
PCB Guidelines
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Package Drawings & Mark ings
Figure 44:
Package Marking
AS5171A
XXXXX
@@
AS5171B
XXXXX
@@
Figure 45:
Packaging Code
Page 36
Document Feedback
XXXXX
@@
TC_5 Tracecode
Sublot Identifier
ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Ordering & Contact Information
Ordering & Contact Information
Figure 46:
Ordering Information
Ordering Code
Package
Marking
Delivery Form
Delivery Quantity
AS5171A-HSIT
SiP
AS5171A
13” Tape & Reel in dry pack
3000 pcs/reel
AS5171B-HSIT
SiP
AS5171B
13” Tape & Reel in dry pack
3000 pcs/reel
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8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
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ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-02] 2016-Apr-25
Page 39
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AS5171 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Page 40
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Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-02] 2016-Apr-25
AS5171 − Revision Information
Revision Information
Changes from 1-01 (2016-Feb-17) to current revision 1-02 (2016-Apr-25)
Page
Removed Linearization section
Added Figure 1
1
Updated Figure 15
13
Updated test above Figure 25
20
Updated Figure 26
20
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
ams Datasheet
[v1-02] 2016-Apr-25
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AS5171 − Content Guide
Content Guide
1
2
2
3
General Description
Key Benefits and Features
Applications
Block Diagram
4
Pin Assignments
5
6
Absolute Maximum Ratings
System Electrical and Timing Characteristics
12
Detailed Description
13
16
17
17
18
18
21
23
23
23
24
25
25
Register Description
UART Interface
Exiting Communication Mode
Programming OTP Registers
Customer ID
Output Linear Transfer Function
Multiple Quadrants
Extended Magnetic Input Range
Analog Output (AS5171A)
PWM Output (AS5171B)
Diagnostic and Functional Safety
Diagnostic Explanations
Analog Read Fail (SM11)
27
27
28
28
31
Application Information
Signature Calculation
Programming Parameter
Burn and Verification of the OTP Memory
Recommended Application Diagrams and Built-In Capacitors
Components Spec
Information Regarding Manufacturability of AS5171A
and AS5171B
32
33
Page 42
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34
35
Package Drawings & Markings
Marking
37
38
39
40
41
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
ams Datasheet
[v1-02] 2016-Apr-25