CPC1976YX6

CPC1976YX6
Rapid Turn-On
AC Power Switch
INTEGRATED CIRCUITS DIVISION
Parameter
AC Operating Voltage
Load Current
On-State Voltage Drop
Blocking Voltage
Rating
20 - 240
2
1.25
600
Units
Vrms
Arms
VP (at IL = 2AP)
VP
CPC1976YX6 is an AC Solid State Switch utilizing
dual power SCR outputs. This device features Rapid
Turn-On (non-zero-cross) control of the output SCRs,
which makes it ideal for precisely switching AC loads
independent of the load voltage phase.
The optically coupled input and output circuits
provide 3750Vrms of isolation and noise immunity
between the control and load circuits. As a result, the
CPC1976YX6 is well suited for industrial environments
where electromagnetic interference would disrupt the
operation of plant facility communication and control
systems.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Description
Load Current up to 2Arms
600VP Blocking Voltage
High Surge Current: 20A
Rapid Turn-On (Non-Zero-Cross Turn-On)
5mA Sensitivity
Creepage Distance: 0.125" on Output Pins
DC Control, AC Output
Optically Isolated
TTL and CMOS Compatible
Low EMI and RFI Generation
High Noise Immunity
Machine Insertable, Wave Solderable
Approvals
• UL Recognized Component: File E69938
• CSA Certified Component: Certificate 1172007
Ordering Information
Applications
•
•
•
•
•
•
•
•
•
•
•
•
HVAC Control (Heating, Ventilation, Air Conditioning)
Lighting
Programmable Control
Process Control
Power Control Panels
Remote Switching
Gas Pump Electronics
Contactors
Large Relays
Solenoids
Motors
Heaters
Part #
CPC1976YX6
Description
4-Pin (8-Pin Body) SIP (25/Tube)
Pin Configuration
R
1
2
– LED + LED
3
4
AC Load AC Load
Rapid Turn-On (Non-Zero-Cross) Waveforms
Control
AC Load
Voltage
Load
Current
Voltage
Across
Relay
DS-CPC1976YX6-R02
www.ixysic.com
1
INTEGRATED CIRCUITS DIVISION
CPC1976YX6
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage (VDRM)
Reverse Input Voltage
Input Control Current
Peak (10ms)
di/dt Critical Rate of Rise
of On-State Current
Input Power Dissipation 1
Total Power Dissipation 2
ESD, Human Body Model
i2t for Fusing (1/2 Sine Wave, 60Hz)
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 20 mW / ºC
Ratings
600
5
50
1
Units
VP
V
mA
A
40
A/s
150
2400
4
3.5
3750
-40 to +85
-40 to +125
mW
mW
kV
A2s
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current, Continuous
Maximum Surge Current
Off State Leakage Current
On-State Voltage Drop
Critical Rate of Rise
Switching Speeds
Turn-on
Turn-off
Holding Current
Latching Current
Operating Frequency
Input Characteristics
Input Control Current to Activate 1
Input Drop-out Voltage
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
Conditions
Symbol
Min
Typ
Max
Units
VL=20-240Vrms
t < 16ms
VDRM
IL=2AP
-
IL
IPK
0.070
1000
1.1
1200
2
20
10
1.25
-
Arms
A
A
VP
V/s
ton
toff
IH
IL
20
20
-
500
0.5
75
100
500
s
cycle
mA
mA
Hz
60Hz
IF=5mA
VR=5V
IF
VF
IR
0.8
0.9
-
1.2
-
5
1.4
10
mA
V
V
A
-
CI/O
-
-
3
pF
IF = 5 mA, Resistive
VL=20V, 60Hz
-
ILEAK
dv/dt
For high-noise environments, or for high-frequency operation, use IF > 10mA.
www.ixysic.com
R02
INTEGRATED CIRCUITS DIVISION
CPC1976YX6
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
LED Forward Voltage Distribution
(N=50, IF=5mA)
35
30
25
25
20
15
10
Device Count (N)
25
Device Count (N)
Device Count (N)
30
LED Current to Operate Distribution
(N=50, VL=120VAC/60Hz)
20
15
10
1.25
1.26
1.27
1.28
1.29
LED Forward Voltage (V)
1.5
1.30
15
10
0
0
0
20
5
5
5
On-State Voltage Drop Distribution
(N=50, IF=5mA, IL=2AP)
1.7
1.9
2.1
2.3
LED Current (mA)
2.5
1.04
2.7
1.06
1.08
1.10
1.12
On-State Voltage Drop (V)
1.14
Typical Blocking Voltage Distribution
(N=50)
Device Count (N)
25
20
15
10
5
0
747
768
IF=50mA
IF=20mA
IF=10mA
IF=5mA
1.3
1.2
2.6
2.5
Holding Current (mA)
LED Current to Operate (mA)
LED Forward Voltage (V)
1.6
1.4
753 756 759 762 765
Blocking Voltage (VP)
LED Current to Operate
vs. Temperature (Resistive Load)
(IL=1A, f=60Hz)
LED Forward Voltage
vs. Temperature
1.5
750
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.1
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
Typical Turn-On Time
vs. LED Forward Current
80
100
Holding Current vs. Temperature
(RL=1.9:)
100
90
80
70
60
50
40
30
20
10
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Turn-On Time vs. Temperature
20
70
IF=5mA
Turn-On Time (Ps)
Turn-On Time (Ps)
60
50
40
30
20
15
IF=10mA
10
5
10
0
0
0
10
20
30
40
LED Forward Current (mA)
50
-40
-20
0
20
40
60
Temperature (ºC)
80
100
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R02
www.ixysic.com
3
INTEGRATED CIRCUITS DIVISION
CPC1976YX6
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
3
1.0
0.9
IL=2.5A
IL=2A
IL=1A
IL=0.5A
0.8
-40
-20
1
0
-1
-2
0.7
0
20
40
60
Temperature (ºC)
80
-3
-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0
Load Voltage (V)
100
850
800
750
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.5
-20
0
20
40
60
Temperature (ºC)
80
100
Maximum Non-Repetitive Surge Current
(Values Apply to TJ=50ºC Before Surge)
25
VL=600V
VL=400V
VL=200V
1000
100
10
1
20
15
10
5
0
0.1
700
1.0
-40
Load Current (AP)
Leakage Current (PA)
Blocking Voltage (VP)
900
1.5
2.0
10000
950
2.0
0.0
1.5
Leakage Current vs. Temperature
Blocking Voltage vs. Temperature
Maximum Load Current
vs. Temperature
(IF=5mA)
2.5
TA=+85ºC
TA=+25ºC
TA= -40ºC
2
1.1
Load Current (A)
Load Voltage (V)
1.2
Load Current vs. Load Voltage
(IF=5mA)
Load Current (Arms)
Load Voltage vs. Temperature
(IF=5mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.1
1
10
Time (ms)
100
1000
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
www.ixysic.com
R02
INTEGRATED CIRCUITS DIVISION
CPC1976YX6
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1976YX6
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1976YX6
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
R02
www.ixysic.com
5
INTEGRATED CIRCUITS DIVISION
CPC1976YX6
MECHANICAL DIMENSIONS
CPC1976YX6
21.082±0.381
(0.830±0.015)
PCB Hole Pattern
3.302±0.051
(0.130±0.002)
10.160±0.127
(0.400±0.005)
1.75
(0.069)
7º TYP
4 Places
Pin 1
1.778
(0.070)
0.762±0.076
(0.030±0.003)
2.540±0.127
(0.100±0.005)
4.572±0.127
(0.180±0.005)
10.160±0.127
(0.400±0.005)
5.080±0.127
(0.200±0.005)
1.651±0.102
(0.065±0.004)
5.080
(0.200)
10.160
(0.400)
1.016±0.127
(0.040±0.005)
Pin 1
1.150 DIA. x4
(0.045 DIA. x4)
0.381±0.013
(0.015±0.0005)
2.540
(0.100)
1.778
(0.070)
7º TYP
4 Places
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1976YX6-R02
©Copyright 2014, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
6/11/2014