PBB190

PBB190
Dual Single-Pole, Normally Closed
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
400
130
25
Units
VP
mArms / mADC

Features
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount, Tape & Reel Versions Available
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Description
PBB190 is a dual single-pole, normally closed
(1-Form-B) solid state relay with two independently
controlled switches that use optically coupled
MOSFET technology to provide 5000Vrms of input to
output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Dual single-pole OptoMOS relays provide a more
compact design solution than discrete single-pole
relays in a variety of applications by incorporating
both relays in a single 8-pin package.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Ordering Information
Part #
PBB190
PBB190S
PBB190STR
Description
8-Lead DIP (50/Tube)
8-Lead Surface Mount (50/Tube)
8-Lead Surface Mount (1,000/Reel)
Pin Configuration
+ Control - Switch #1
- Control - Switch #1
+ Control - Switch #2
- Control - Switch #2
1
8
2
7
3
6
4
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
90%
10%
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INTEGRATED CIRCUITS DIVISION
PBB190
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
LED Forward Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
(60 Seconds)
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
400
5
50
1
150
800
Units
VP
V
mA
A
mW
mW
5000
Vrms
8
-40 to +85
-40 to +125
kV
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current 1
Continuous
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
LED Forward Current
To Activate 3
To Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
2
Conditions
IF=0mA
IF=0mA, t=10ms
IF=0mA, IL=130mA
IF=2mA, VL=400VP
IF=5 mA, VL=10V
IF=5mA, VL=50V, f=1MHz
Symbol
Min
Typ
Max
Units
RON
ILEAK
-
-
130
±400
25
1
mArms / mADC
mAP
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-
11
1
2.5
-
0.38
0.35
1.2
-
2
1.4
10
3
-
IL
IL=130mA
IF=5mA
VR=5V
VF
IR
0.2
0.9
-
-
CI/O
-
IF
1
If both poles operate simultaneously, then the load current must be derated so that the package power dissipation value is not exceeded.
2
Measurement taken within 1 second of on-time.
3
For high temperature operation (>60ºC), a LED forward current of 4mA is recommended.
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A
ms
pF
mA
V
µA
pF
R02
INTEGRATED CIRCUITS DIVISION
PBB190
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
30
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
20
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
20
20
15
10
Device Count (N)
Device Count (N)
Device Count (N)
25
15
10
5
15
10
5
5
0
Typical LED Forward Current
to Activate
(N=50, IL=100mA)
0.714 0.716 0.718 0.720 0.722 0.724 0.726 0.728
0.838 0.920 1.002 1.084 1.166 1.248 1.330 1.412
Turn-On Time (ms)
Turn-Off Time (ms)
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=100mA)
Typical Blocking Voltage Distribution
(N=50, IF=2mA)
25
15
10
5
20
15
10
5
0
0
730
30
20
10
0
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Forward Voltage (V)
720
715
IF=10mA
IF=5mA
IF=2mA
1.1
-40
-20
0
20
40
60
Temperature (ºC)
80
100
3000
2000
0
50
Turn-On Time vs. Temperature
(IL=75mA)
5000
700
600
500
300
-40
10
20
30
40
LED Forward Current (mA)
50
Turn-Off Time vs. Temperature
(IL=75mA)
4500
IF=5mA
400
1.0
4000
0
10
20
30
40
LED Forward Current (mA)
Turn-Off Time (Ps)
1.2
495
1000
0
Turn-On Time (Ps)
1.3
470 475 480 485 490
Blocking Voltage (VP)
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
6000
800
1.4
5
460 465
725
900
1.5
10
14.5
710
1.6
15
5000
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
13.5 13.8 14.0 14.3
On-Resistance (:)
Turn-Off Time (Ps)
40
Turn-On Time (Ps)
LED Forward Current (mA)
735
13.3
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Forward Voltage
vs. LED Forward Current
50
20
0
13.0
0.29 0.32 0.35 0.38 0.41 0.44 0.47 0.50
LED Forward Current (mA)
LED Forward Voltage Drop (V)
25
Device Count (N)
Device Count (N)
20
Device Count (N)
0
0
1.235 1.240 1.245 1.250 1.255 1.260 1.265
LED Forward Voltage (V)
4000
IF=2mA
3500
3000
2500
2000
IF=5mA
1500
IF=2mA
-20
0
20
40
60
Temperature (ºC)
80
100
1000
-40
-20
0
20
40
60
Temperature (ºC)
80
100
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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INTEGRATED CIRCUITS DIVISION
PBB190
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
LED Forward Current to Activate
vs. Temperature
(IL=75mA)
20
0.55
0.50
0.45
0.40
17
16
15
14
-20
0
20
40
60
Temperature (ºC)
80
12
-40
100
Maximum Load Current
vs. Temperature
(IF=0mA)
0.14
-20
0
20
40
60
Temperature (ºC)
80
0.10
0.09
0.08
-40
-20
0
20
40
60
Temperature (ºC)
100
460
455
450
-20
0
20
40
60
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 5&6, 7&8
(IF=5mA, VL=400V)
250
200
150
100
Load Current (A)
80
60
40
20
0
100
150
Load Voltage (V)
80
100
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
100
50
2.0
1.0
120
0
1.5
50
445
Output Capacitance
vs. Load Voltage
(IF=5mA, f=1MHz)
140
Output Capacitance (pF)
80
465
440
-40
-0.5 0.0 0.5 1.0
Load Voltage (V)
300
470
Leakage (nA)
Blocking Voltage (VP)
0.11
-0.05
350
475
0.12
0.00
-0.15
-2.0 -1.5 -1.0
100
Typical Blocking Voltage
vs. Temperature
(IF=5mA)
480
0.13
0.05
-0.10
13
0.35
-40
Load Current (A)
0.10
18
Load Current (A)
0.60
Typical Load Current
vs. Load Voltage
(IF=0mA)
0.15
19
On Resistance (:)
LED Forward Current (mA)
0.65
On-Resistance
vs. Temperature
(IF=0mA, IL=75mA)
200
0.8
0.6
0.4
0.2
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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R02
INTEGRATED CIRCUITS DIVISION
PBB190
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PBB190 / PBB190S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
PBB190 / PBB190S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
PBB190
Mechanical Dimensions
PBB190
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
3.302 ± 0.051
(0.130 ± 0.002)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.127
(0.300 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
PBB190S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
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R02
INTEGRATED CIRCUITS DIVISION
PBB190
PBB190STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K0 =4.90
(0.193)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-PBB190-R02
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012