IX9907 High Voltage, Dimmable LED Driver with PFC Control INTEGRATED CIRCUITS DIVISION Features Description • Internal 650V, 2 power MOSFET • Single stage, primary control with PFC and dimming features • >90% efficiency • Power factor >98% • Wide operating voltage range • Digital soft-start • Foldback correction and cycle-by-cycle peak current control • Output over-current and over-voltage protection • Over-temperature protection • Under-voltage lockout The IX9907 is a quasi-resonant controller optimized for phase-cut dimmable, off-line LED applications. Precise PWM generation supports phase-cut dimming and power factor correction. Applications The IX9907 is available in a standard 8-pin SOIC package. The IX9907 incorporates an internal 650V power MOSFET. It has a wide voltage operating range and low power consumption. Multiple safety features ensure full system protection under fault conditions. With its strong feature set and low cost, the IX9907 is an excellent choice for quasi-resonant, off-line flyback LED bulb designs. • Incandescent Bulb Replacement • Solid State Lighting • Industrial and Commercial Lighting Ordering Information Part Description IX9907N IX9907NTR 8-Pin SOIC (100/Tube) 8-Pin SOIC (2000/Reel) IX9907 Functional Block Diagram VCC ZCV Ringing Suppress Blanking Reference Voltage Generator DRAIN Over-Voltage Protection Leading Edge Blanking Foldback Sense Amp VCC Monitor Over - Under Voltage Lockout Gate Control Control Logic SOURCE Over-Temp Sensor Soft-Start Control Foldback Correction VR Shorted Winding Detection LPF Analog Mux Leading Edge Blanking CS Leading Edge Blanking PFC GND DS-IX9907-R02 www.ixysic.com 1 IX9907 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 1.2 1.3 1.4 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 4 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Soft Start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 3.2 3.3 3.4 3.5 3.6 2 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Soldering Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Tape & Reel Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 www.ixysic.com R02 IX9907 INTEGRATED CIRCUITS DIVISION 1. Specifications 1.3 Pin Description 1.1 Package Pinout ZCV 1 8 GND VR 2 7 VCC CS 3 6 NC SOURCE 4 5 DRAIN Pin# Name 1 ZCV 2 VR Voltage sense CS Current sense (Internally connected to SOURCE) 3 4 Description Zero crossing SOURCE Power switch MOSFET source 5 DRAIN 6 NC Power switch MOSFET drain Not connected 7 VCC Controller power supply 8 GND Controller ground 1.2 Absolute Maximum Ratings Parameter Symbol Ratings Unit DRAIN Voltage VD 650 V DRAIN Current ID 1.7 A VCC Supply Voltage VCC -0.3 to 40 V VR Voltage VVR -0.3 to 5 V ZCV Voltage VZCV -0.3 to 5 V CS Voltage VCS -0.3 to 5 V VS -0.3 to 5 V IZCVmax SOURCE Voltage Maximum Current From ZCV Pin 3 mA Junction Temperature TJ - 40 to +150 °C Storage Temperature TSTG - 55 to +150 °C Thermal Impedance Junction to Ambient JA 125 °C/W Absolute maximum electrical ratings are at 25°C. R02 www.ixysic.com 3 IX9907 INTEGRATED CIRCUITS DIVISION 1.4 Electrical Characteristics TJ = - 25°C to +125°, VCC=18V unless otherwise noted. 1.4.1 Power Supply Parameter Conditions Supply Current in Normal Operation VCC Turn-On Threshold Symbol Minimum Typical Maximum Unit Power Switch OFF ICC - 1.8 2.9 mA - VCCon 17 18 19 V VCC Turn-Off Threshold - VCCoff 9.8 10.5 11.2 V VCC Turn-On/Off Hysteresis - VCChys - 7.5 - V Conditions Symbol Minimum Typical Maximum Unit Measured at VR Pin, IVR=0 VVR 4.8 5 5.2 V Conditions Symbol Minimum Typical Maximum Unit 1.4.2 Internal Voltage Reference Parameter Internal Reference Voltage 1.4.3 PWM Section Parameter VR Pull-Up Resistor - RVR 11 19 27 k PWM-OP Gain - GPWM 2.95 3 3.05 - Offset for Voltage Ramp - VPWM 0.7 0.77 0.85 V Maximum On-Time in Normal Operation - tonMax 22 30 41 s Symbol Minimum Typical Maximum Unit - VCSTH 0.97 1.03 1.09 V - tBLKCS 270 450 630 ns Conditions Symbol Minimum Typical Maximum Unit 1.4.4 Current Sense Parameter Current Sense Threshold Leading Edge Blanking Time Conditions 1.4.5 Soft Start Parameter Soft-Start Time - tSS 8.5 12 - ms Soft-Start Time Step - tSS-S - 3 - ms Internal Regulation Voltage at First Step - VSS1 - 1.76 - V Internal Regulation Voltage Step at Soft Start - VSS-S - 0.56 - V 4 www.ixysic.com R02 IX9907 INTEGRATED CIRCUITS DIVISION 1.4.6 Foldback Point Correction Conditions Symbol Minimum Typical Maximum Unit ZCV Current First Step Threshold Parameter - IZCV_FS 0.35 0.5 0.621 mA ZCV Current Last Step Threshold IZC = 2.3 mA, VVR = 3.0V IZCV_LS 1.3 1.85 2.3 mA VCSMF - 0.66 - V Conditions Symbol Minimum Typical Maximum Unit - VZCVCT 50 100 170 mV VZCVRS - 0.7 - V Minimum Ringing Suppression Time VZC > VZCRS tZCRS1 1.62 2.5 4.5 s Maximum Ringing Suppression Time VZC < VZCRS tZCRS2 - 42 - s - tOffMax 30 42 57.5 s Symbol Minimum Typical Maximum Unit CS Threshold Minimum 1.4.7 Digital Zero Crossing Parameter Zero Crossing Voltage Ringing Suppression Threshold Maximum Restart Time in Normal Operation 1.4.8 Protection Parameter Conditions VCC Overvoltage Threshold - VCCOVP 23 25 26 V Output Overvoltage Detection Threshold at the ZCV Pin - VZCVOVP 3.3 3.45 3.6 V s Blanking Time for Output Overvoltage Protection - tZCVOVP - 100 - Threshold for Short Winding Protection - VCSSW 1.58 1.68 1.78 V Blanking Time for Short Winding Protection - tCSSW - 190 - ns Temperature Increasing TJTSD - 140 - °C Symbol Minimum Typical Maximum Unit - 2.0 2.3 - 3.4 4 - 0.6 100 Thermal Shutdown Temperature 1.4.9 Output Switch Parameter Drain-Source On-State On-resistance Drain-Source Leakage Current R02 Conditions IDRAIN=50mA, TJ=25°C IDRAIN=50mA, TJ=125°C RDS(ON) VDRAIN=650V www.ixysic.com IDSS A 5 IX9907 INTEGRATED CIRCUITS DIVISION 2. Functional Description Figure 1 IX9907 Typical Application DOUT T1 DVCC R1 AC - + Q1 COUT RZCV1 CZCV Z1 CVCC SNUBBER RZCV2 Aux CIN IX9907 RIN1 CC ZCV DRAIN VCC VR GND LEDs SOURCE CS DVR CVR RIN2 2.1 Soft Start Once the main input voltage is applied, a rectified voltage will appear across CIN. VCC capacitor (CVCC) will be charged during the power-up phase of operation through an external transistor. Once VCC reaches VVCC_on (typically 18V), the device will RCS initiate a soft-start sequence. This is intended to minimize the electrical stresses on the device’s MOSFET power switch, DOUT, DVCC, and the transformer. The soft-start operates as shown in Figure 2. The duration of this soft-start is 12mS nominal and steps VCS, the current sense voltage, to four values, as shown. Figure 2 Start-Up VCS_SST (V) Maximum Current (Sense Voltage) During Soft-Start 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Time (ms) 6 www.ixysic.com R02 IX9907 INTEGRATED CIRCUITS DIVISION is 42s nominal. Turn-on of the power switch cannot occur during the suppression time, but does occur after a zero-crossing is detected. In the case of a missed zero-crossing, a maximum off-time is implemented. After the power switch has been off for 42s nominal (toffMax), it is turned back on. 2.2 Normal Operation Because the IX9907 employs quasi-resonant operation, its PWM switch-on is set by the zero crossing of the auxiliary winding voltage, and the switch-off is set by the current sense voltage. 2.2.1 Zero Crossing & Switch-On Determination 2.2.2 Switch-Off Determination The application example in Figure 1 shows that the voltage from the auxiliary winding is connected to the zero crossing pin, ZCV, through an RC network. This network provides a delay so that switch-on can occur at a voltage valley, thus enhancing efficiency. The required time delay, t, should be approximately one-fourth of the oscillation period (determined by the inductance of the transformer’s primary and the drain-source capacitance of the built-in power switch MOSFET) minus the propagation delay from zero-cross detect to power switch-on, tdelay. In the application circuit the primary current is sensed by RCS. The voltage across this resistor, VCS, is applied to the CS input of the device. It is processed internally (VCSINT = VCS(3) + 0.7V), and compared to the voltage at the VR pin, which is a scaled version of the rectified line voltage. When VCSINT > VR, the power switch is turned off. Leading-edge blanking is used to prevent a false trigger caused by the voltage spike across RCS at the moment of power switch turn-on. This blanking time, tBLKCS, is nominally 450nS. To prevent transformer saturation, a maximum on-time circuit is implemented. Max on-time for the power switch is 30s nominal. t OSC - – t delay t = ---------4 This time delay, t, should be matched by adjusting the RC network. t RC 2.2.3 Foldback Point Correction R ZCV1 = C ZCV --------------R ZCV2 When the AC line voltage increases, the power switch on-time decreases, which increases the operating frequency. As a result, with a constant primary current limit, the output power increases. To provide output power regulation with respect to line voltage, the internal foldback point correction circuit varies the VCS limit. The VCS limit is decreased in response to an increase in AC line voltage. The relationship between VCSMax and VIN is shown in Figure 3. After the power switch is turned off, its VDS will show some oscillation. This will also show on the ZCV input. To avoid a mis-triggered switch turn-on, a ringing suppression circuit is implemented. The suppression time has two values that depend on the voltage at ZCV. If VZCV is greater than 0.7V, then the time is 2.5s nominal. If VZCV is less than 0.7V, then the time Figure 3 VCSMax vs. VIN Variation of VCS Limit Voltage With Respect to VIN 1.1 VCSMax (V) 1.0 0.9 0.8 0.7 0.6 50 R02 100 150 200 250 300 VIN (V) www.ixysic.com 350 400 450 7 IX9907 INTEGRATED CIRCUITS DIVISION The variation in AC line voltage is sensed by way of the auxiliary winding and an internal clamp and current sense circuit. When the power switch is on, a negative voltage proportional to the line voltage is coupled to the auxiliary winding; the IX9907 will hold the ZCV pin very close to ground during this time. The line voltage is thus sensed indirectly through the current in RZCV1. This current is given by: V IN Na I ZCV = ---------------------------R ZCV1 Np The device uses IZCV to vary the VCS limit as shown in Figure 4. The actual implementation is digital and is shown below. Figure 4 VCS vs. IZC VCS vs. IZC 1.05 1.00 0.95 VCS (V) 0.90 0.85 0.80 0.75 0.70 0.65 0.60 200 600 1000 1400 IZC (µA) 2200 OVER-TEMPERATURE 2.2.4 Protection Functions If the die temperature exceeds 140°C, then the device will enter the Auto-Restart Mode. The IX9907 provides comprehensive protection features. They are summarized in the table below: Fault Condition 1800 VCC OVER-VOLTAGE / UNDER-VOLTAGE Action Taken Output Over-Voltage Power Switch Latched Off Shorted Winding Power Switch Latched Off Over-Temperature Auto-Restart Mode VCC Over-Voltage Power Switch Latched Off VCC Under-Voltage Auto-Restart Mode OUTPUT OVER-VOLTAGE During the power switch off-time the auxiliary winding voltage (VAUX) will swing positive and in proportion to the secondary voltage. VAUX is connected to ZCV through a resistor divider. If the voltage at ZCV exceeds a preset threshold (VZCVOVP) for longer than the blanking time (tZCVOVP), then the IC is latched off. The IX9907 continuously monitors the VCC voltage. In case of an over-voltage event, the power switch is turned off and VCC will begin to fall. Once VCC goes below VCCoff (10.5V nominal), and is recharged up to VCCon (18.0V nominal), the device initiates a new soft-start. For an under-voltage event the operation is the same except that the sequence begins with VCC < VCCoff so the power switch is off and VCC starts to be charged through an external transistor. This operation describes the Auto-Restart Mode. During Latch-Off Mode, the line voltage must be turned off and on again to begin normal operation. SHORTED WINDING If the voltage at CS exceeds a preset threshold (VCSSW) during the power switch on time the device is latched off. 8 www.ixysic.com R02 IX9907 INTEGRATED CIRCUITS DIVISION 3. Manufacturing Information 3.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification IX9907 MSL 1 3.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 3.3 Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles IX9907 260°C 30 seconds 3 3.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R02 www.ixysic.com 9 IX9907 INTEGRATED CIRCUITS DIVISION 3.5 Package Dimensions PCB Land Pattern 1.27 REF Pin 8 0.65 6.00 ± 0.20 0.40 min 1.27 max 3.90 ± 0.10 1.75 Pin 1 5.60 0.42 ± 0.09 4.90 ± 0.10 1.25 min 1.27 NOTES: 1. Complies with JEDEC Standard MS-012. 2. All dimensions are in millimeters. 3. Dimensions do not include mold flash or burrs 1.75 max 0.175 ± 0.075 3.6 Tape & Reel Dimensions 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P=8.00 (0.315) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specifications: DS-IX9907-R02 © Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 5/4/2016 10 www.ixysic.com R02