IX9908 High Voltage, Dimmable LED Driver with PFC Control INTEGRATED CIRCUITS DIVISION Features Description • Single Stage, Primary Control with PFC and Dimming Features • >90% Efficiency • Power Factor >98% • Wide Operating Voltage Range: Up to 600V • Digital Soft-Start • Cycle-by-Cycle Peak Current Control The IX9908 is a quasi-resonant controller optimized for phase-cut dimmable, off-line LED applications. Precise PWM generation supports phase-cut dimming and power factor correction. The product features a wide operating range, up to 600V, and low power consumption. Multiple safety features ensure full system protection in failure situations. The IX9908, with its strong feature set and low cost, is an excellent choice for quasi-resonant flyback LED bulb designs. Applications • Incandescent Bulb Replacement • Solid State Lighting • Industrial and Commercial Lighting Ordering Information Part Description IX9908N IX9908NTR 8-Pin SOIC (100/Tube) 8-Pin SOIC (2000/Reel) IX9908 Example Application T1 DVCC DOUT SNUBBER RZCV1 AC - + COUT CZCV CVCC Aux CIN RZCV2 VCC Q1 ZCV HV GD LEDs IX9908 RIN1 RIN2 DS-IX9908-R02 VR GND CS CC RCS DVR CVR www.ixysic.com 1 IX9908 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 1.2 1.3 1.4 1.5 1.6 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Internal Supply Voltage During Start-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Soft-Start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 3.2 3.3 3.4 3.5 3.6 2 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Soldering Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Tape & Reel Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 www.ixysic.com R02 IX9908 INTEGRATED CIRCUITS DIVISION 1. Specifications 1.3 Pin Description 1.1 Package Pinout Pin# Name 1 ZCV VCC 2 VR Voltage Sense 3 CS Current Sense NC 4 GD Gate Drive Output 5 HV High Voltage Input 6 NC Not Connected 7 VCC Controller Power Supply 8 GND Controller Ground ZCV 1 8 GND VR 2 7 CS GD 3 6 4 5 HV Zero Crossing 1.4 Recommended Operating Range 1.2 Absolute Maximum Ratings Parameter Description Note: Within the recommended operating range, the IC operates as described in the functional description. Symbol Ratings Unit HV Voltage VHV 600 V VCC Supply Voltage VCC -0.3 to 40 V VR Voltage VVR -0.3 to 5 V ZCV Voltage VZC -0.3 to 5 V VCC Supply Voltage CS Voltage VCS -0.3 to 5 V Junction Temperature GD Voltage VOUT -0.3 to 40 V Maximum Current from ZCV Pin IZCmax 3 mA Junction Temperature TJ - 40 to +125 °C Storage Temperature TSTG - 55 to +150 °C Absolute maximum electrical ratings are at 25°C. Limit Values Parameter Symbol Unit Min Max VCC 10.5 18 V TJ - 25 + 125 °C 1.5 Thermal Characteristics Parameter Thermal Impedance (Junction to Ambient) Symbol Rating Units JA 125 °C/W Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R02 www.ixysic.com 3 IX9908 INTEGRATED CIRCUITS DIVISION 1.6 Electrical Characteristics TJ = - 25°C to +125° 1.6.1 Power Supply Note: The electrical characterization involves the spread of values within the specified supply voltage and junction temperature range TJ from - 25°C to +125°C. Typical values represent the median values, which are related to 25°C. If not otherwise stated, a supply voltage of VCC=18V is assumed. Parameter VCC Charge Current Maximum Input Current of Startup Cell Leakage Current of Startup Cell Supply Current in Normal Operation VCC Turn-On Threshold VCC Turn-Off Threshold VCC Turn-On/Off Hysteresis Conditions Symbol Minimum Typical Maximum VCC=0V ICCcharge1 Unit - - 35 VCC=VCCon -0.2V ICCcharge2 - - 35 VCC=VCCon -0.2V IHV - - 35 VHV=610V @ TJ=100°C IHV - 0.2 50 A GD Low ICCNM - 1.8 2.9 mA - VCCon 17 18 19 V - VCCoff 9.8 10.5 11.2 V - VCChys - 7.5 - V mA mA 1.6.2 Internal Voltage Reference Parameter Internal Reference Voltage Conditions Symbol Minimum Typical Maximum Unit Measured at VR Pin, IVR=0 VVR 4.8 5 5.2 V 1.6.3 PWM Section Conditions Symbol Minimum Typical Maximum Unit VR Pull-Up Resistor Parameter - RVR 14 23 33 k PWM-OP Gain - GPWM 2.95 3 3.05 - Offset for Voltage Ramp - VPWM 0.63 0.7 0.77 V Maximum On-Time in Normal Operation - tonMax 22 30 41 s Conditions Symbol Minimum Typical Maximum Unit Current Sense Threshold - VCSTH 0.97 1.03 1.09 V Leading Edge Blanking Time - tBLKCS 200 330 460 ns Conditions Symbol Minimum Typical Maximum Unit 1.6.4 Current Sense Parameter 1.6.5 Soft Start Parameter Soft-Start Time - tSS 8.5 12 - ms Soft-Start Time Step - tSS-S - 3 - ms Internal Regulation Voltage at First Step - VSS1 - 1.76 - V Internal Regulation Voltage Step at Soft Start - VSS-S - 0.56 - V 4 www.ixysic.com R02 IX9908 INTEGRATED CIRCUITS DIVISION 1.6.6 Foldback Point Correction Conditions Symbol Minimum Typical Maximum Unit ZCV Current First Step Threshold Parameter - IZC_FS 0.35 0.5 0.621 mA ZCV Current Last Step Threshold IZC = 2.3 mA, VVR = 3.0V IZC_LS 1.3 1.85 2.3 mA VCSMF - 0.66 - V Conditions Symbol Minimum Typical Maximum Unit - VZCCT 50 100 170 mV VZCRS - 0.7 - V Minimum Ringing Suppression Time VZC > VZCRS tZCRS1 1.62 2.5 4.5 s Maximum Ringing Suppression Time VZC < VZCRS tZCRS2 - 42 - s - tOffMax 30 42 57.5 s Symbol Minimum Typical Maximum Unit CS Threshold Minimum 1.6.7 Digital Zero Crossing Parameter Zero Crossing Voltage Ringing Suppression Threshold Maximum Restart Time in Normal Operation 1.6.8 Protection Parameter Conditions VCC Overvoltage Threshold - VCCOVP 24 25 26 V Output Overvoltage Detection Threshold at the ZCV Pin - VZCVOVP 3.55 3.7 3.87 V s Blanking Time for Output Overvoltage Protection - tZCVOVP - 100 - Threshold for Short Winding Protection - VCSSW 1.60 1.68 1.78 V Blanking Time for Short Winding Protection - tCSSW - 190 - ns Over-Temperature Protection - TJTSP - 140 - °C Symbol Minimum Typical Maximum Unit 1 V V 1.6.9 Gate Drive Parameter Conditions Output Voltage at Logic Low VCC=18V, IOUT=10mA VGATElow - - Output Voltage at Logic High VCC=18V, IOUT= -10mA VGATEhigh 9 10 - VCC=9V, IOUT=10mA VGATEasd - - 1 V Rise Time COUT=1nF, VGD=2V to 8V trise - 117 - ns Fall Time COUT=1nF, VGD=8V to 2V tfall - 27 - ns Output Voltage Active Shut-Down R02 www.ixysic.com 5 IX9908 INTEGRATED CIRCUITS DIVISION 2. Functional Description Vcc Ringing Suppress Blanking ZCV High Voltage Startup HV Gate Control GD Vcc Vcc Monitor Over - Under Voltage Lockout Reference Voltage Generator Over-Voltage Protection Leading Edge Blanking Foldback Sense Amp Control Logic Over-Temp Sensor Soft-Start Control Foldback Correction VR Shorted Winding Detection LPF Analog Mux GND Leading Edge Blanking CS Leading Edge Blanking PFC Figure 1. IX9908 Block Diagram 2.1 Internal Supply Voltage During Start-Up The IX9908 integrates a high voltage startup cell. This cell provides a constant current to charge the VCC capacitor (CVCC) during the Power-up phase of operation. Once the main input voltage is applied, a rectified voltage will be across CIN. VVCC_on VVCC_off The start-up cell will sense this voltage, and source a constant current of approximately 10 mA to CVCC. This current will remain until VCC reaches VVCC_on or 18V nominal. It will then be switched off, and a soft start sequence will begin. VCC will then sag as the CVCC capacitor supplies current to power the device, and is not yet receiving energy from the auxiliary winding. Once the output voltage is high enough the auxiliary winding will provide energy to CVCC and the VCC voltage will reach a constant value. This value depends on the output load and transformer characteristics. tstartup = tstartup VCC_on • CVCC ICC_CHARGE Figure 2. Start-Up 6 www.ixysic.com R02 IX9908 INTEGRATED CIRCUITS DIVISION 2.2 Soft-Start Once VCC reaches VVCC_on (typically 18V), the device will initiate a soft-start sequence. This is intended to minimize the electrical stresses on Q1, DOUT, DVCC, and the transformer. The soft-start operates as shown in Figure 3. The duration of this soft-start is 12mS nominal and steps VCS, the current sense voltage, to four values, as shown. VCS_SST (V) Maximum Current (Sense Voltage) During Soft-Start 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 suppression circuit is implemented. The suppression time has two values that depend on the voltage at ZCV. If VZCV is greater than 0.7V, then the time is 2.5S nominal. If VZCV is less than 0.7V, then the time is 42S nominal. Turn-on of Q1 can not occur during the suppression time, but does occur after a zero-crossing is detected. In the case of a missed zero-crossing, a maximum off-time is implemented. After Q1 has been off for 42S nominal (toffMax), it is turned back on. 2.3.2 Switch-Off Determination In the application circuit, the primary current is sensed by RCS. The voltage across this resistor, VCS, is applied to the CS input of the device. It is processed internally, and compared to the voltage at the VR pin, which is a scaled version of the rectified line voltage. When the following relation is true, the power switch, Q1, is turned off. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Time (ms) V CS 3 + 0.7V VR Figure 3. Soft-Start Leading-edge blanking is used to prevent a false trigger caused by the voltage spike across RCS at the moment of Q1 turn-on. This blanking time, tBLKCS , is nominally 330nS. To prevent transformer saturation, a maximum on-time circuit is implemented. Max on-time for Q1 (GD=H) is 30S nominal. 2.3 Normal Operation Because the IX9908 employs quasi-resonant operation, its PWM switch-on is set by the zero crossing of the auxiliary winding voltage, and the switch-off is set by the current sense voltage. 2.3.1 Zero Crossing & Switch-On Determination As the application schematic on Page 1 shows, the voltage from the auxiliary winding is connected to the zero crossing pin, ZCV, through an RC network. This network provides a delay so that switch-on can occur at voltage valley thus enhancing efficiency. The required time delay, t, should be approximately one-fourth of the oscillation period (determined by transformer primary inductor and drain-source capacitance of Q1) minus the propagation delay from zero-cross detect to Q1 switch-on, tdelay . t t = OSC - tdelay 4 This time delay, t, should be matched by adjusting the RC network. tRC = CZCV (RZCV1 // RZCV2) After Q1 is turned off, its VDS will show some oscillation. This will also show on the ZCV input. To avoid a mis-triggered Q1 turn-on, a ringing R02 www.ixysic.com 7 IX9908 INTEGRATED CIRCUITS DIVISION 2.3.3 Foldback Point Correction 2.3.4 Protection Functions When the AC line voltage increases, the Q1 on-time decreases, which increases the operating frequency. As a result, with a constant primary current limit, the output power increases. To provide output power regulation with respect to line voltage, the internal foldback point correction circuit varies the VCS limit. The VCS limit is decreased in response to an increase in AC line voltage. The relationship between VCSMax and VIN is shown in Figure 4. Variation of VCS Limit Voltage With Respect to VIN 1.1 Fault Condition Output Over-Voltage Shorted Winding Over-Temperature VCC Over-Voltage VCC Under-Voltage Action Taken GD Latched Off GD Latched Off Auto-Restart Mode Auto-Restart Mode Auto-Restart Mode OUTPUT OVER-VOLTAGE During the Q1 off-time the auxiliary winding voltage (VAUX) will swing positive and in proportion to the secondary voltage. VAUX is connected to ZCV through a resistor divider. If the voltage at ZCV exceeds a preset threshold (VZCVOVP) for longer than the blanking time (tZCVOVP), then the IC is latched off. 1.0 VCSMax (V) The IX9908 provides comprehensive protection features. They are summarized in the table below: 0.9 0.8 0.7 0.6 50 100 150 200 250 300 VIN (V) 350 400 SHORTED WINDING 450 If the voltage at CS exceeds a preset threshold (VCSSW) during Q1 on time the device is latched off. Figure 4. VCSMax vs. VIN The variation in AC line voltage is sensed by way of the auxiliary winding and an internal clamp and current sense circuit. When Q1 is on, a negative voltage proportional to the line voltage is coupled to the auxiliary winding; the IC will hold the ZCV pin very close to ground during this time. The line voltage is thus sensed indirectly through the current in RZCV1. This current is given by: IZCV = VIN • Na RZCV1 • Np The device uses IZCV to vary the VCS limit as shown in Figure 4. The actual implementation is digital and is shown below: VCS vs. IZC 1.05 If the die temperature exceeds 140°C, then the device will enter the Auto-Restart Mode. VCC OVER-VOLTAGE / UNDER-VOLTAGE The IC continuously monitors the VCC voltage. In case of an over-voltage, Q1 is turned off (GD=L) and VCC will begin to fall. Once VCC goes below VVCC_off (10.5V nominal), the startup circuit is activated, and begins to charge CVCC. When VCC exceeds VVCC_on (18.0V nominal), the device initiates a new soft-start. For an under-voltage the operation is the same except that the sequence begins with VCC < VVCC_off so GD=L and the startup circuit is activated. This operation describes the Auto-Restart Mode. During Latch-Off Mode, VCC also cycles between VVCC_off and VVCC_on, but GD remains low, and no soft-start is initiated. The line voltage must be turned off and on again to begin normal operation. 1.00 0.95 0.90 VCS (V) OVER-TEMPERATURE 0.85 0.80 0.75 0.70 0.65 0.60 200 600 1000 1400 IZC (µA) 1800 2200 Figure 5. VCS vs. IZC 8 www.ixysic.com R02 IX9908 INTEGRATED CIRCUITS DIVISION 3. Manufacturing Information 3.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating IX9908N MSL 1 3.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 3.3 Soldering Profile This product has a maximum body temperature and time rating for lead-free reflow processes as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time IX9908N 260°C for 30 seconds 3.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R02 www.ixysic.com 9 IX9908 INTEGRATED CIRCUITS DIVISION 3.5 Package Dimensions 1.27 (0.050) 3.80 - 4.00 (0.150 - 0.157) Note 4 5.80 - 6.20 (0.228 - 0.244) 5.40 (0.213) Dimensions mm MIN - mm MAX (inches MIN - inches MAX) Pin 1 0.31 - 0.51 (0.012 - 0.020) x8 1.27 (0.05) 6x 4.80 - 5.00 (0.189 - 0.197) Note 3 1.25 MIN (0.049 MIN) 1.55 (0.061) 0.60 (0.024) Recommended PCB Land Pattern 0.10 - 0.25 (0.004 - 0.010) 0.10 - 0.25 (0.004 - 0.010) 0º - 8º 0.40 - 1.27 (0.016 - 0.050) 1.75 MAX (0.069 MAX) A 0.25 (0.010) Gauge Plane Seating Plane A NOTES: 1. All dimensions are in mm (inches). 2. This package conforms to JEDEC Standard MS-012, Variation AA, Rev. F. 3. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end. 4. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 5. Pin location tolerance = 0.10mm, pin tolerances are non-cumulative. 6. Dimensions in inches are calculated from mm, and are provided for convenience. 3.6 Tape & Reel Dimensions 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P=8.00 (0.315) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specifications: DS-IX9908-R02 © Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 10/2/2015 10 www.ixysic.com R02