1/4 STRUCTURE Silicon monolithic integrated circuits PRODUCT SERIES Bipolar stepping motor driver TYPE BD63875EFV FUNCTION ・PWM constant current controllable two H bridge driver ・Built-in translator circuit for CLK-IN control ・Full, Half, and Quarter step modes ・Mix decay control ○Absolute maximum ratings(Ta=25℃) Item Supply voltage Symbol VCC1,2 Limit Unit -0.2～+36.0 V ※1 W 1.45 Power dissipation Pd 4.70※2 W Input voltage for control pin VIN -0.2～+5.5 V RNF maximum voltage VRNF 0.7 V Maximum output current IOUT 1.5※3 A/phase Maximum output current(peak)※4 IOUTPEAK 2.0※3 A/phase Operating temperature range Topr -25～+85 ℃ Storage temperature range Tstg -55～+150 ℃ Junction temperature Tjmax +150 ℃ ※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃. ※2 4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃. ※3 Do not, however exceed Pd, ASO and Tjmax=150℃. ※4 Pulse width tw≦1ms, duty 20%. ○Recommended operating conditions (Ta=-25～+85℃) Item Symbol Min. Supply voltage VCC1,2 19 Output current IOUT ※5 Do not, however exceed Pd, ASO. Typ. 24 1.0 Max. 28 1.2※5 Unit V A/phase This product isn’t designed for protection against radioactive rays. . REV. A 2/4 ○Electrical characteristics (Unless otherwise specified, Ta=25℃, VCC1,2=24V) Item Symbol Min. Limit Typ. Whole Circuit current at standby ICCST 1.0 Circuit current ICC 2.5 Control input (CLK, CW_CCW, MODE0, MODE1, ENABLE, PS) H level input voltage VINH 2.0 L level input voltage VINL H level input current IINH 35 50 L level input current IINL -10 0 Output (OUT1A, OUT1B, OUT2A, OUT2B) Output ON resistance Output leak current Current control RNFXS input current RNFX input current VREF input current VREF input voltage range MTH input current MTH input voltage range Comparator threshold Minimum on time (Blank time) Unit Conditions 2.5 5.0 mA mA PS=L PS=H, VREF=3V 0.8 100 - V V μA μA VIN=5V VIN=0V Max. RON - 1.0 1.3 Ω ILEAK - - 10 μA IRNFS IRNF IVREF VREF IMTH VMTH VCTH tONMIN -2.0 -40 -2.0 0 -2.0 0 0.57 0.3 -0.1 -20 -0.1 -0.1 0.60 0.8 3.0 3.5 0.63 1.5 μA μA μA V μA V V μs REV. A IOUT=1.0A, Sum of upper and lower RNFXS=0V RNFX=0V VREF=0V MTH=0V VREF=3V C=1000pF, R=39kΩ 3/4 ○Package outline Product No. BD63875EFV Lot No. HTSSOP-B28 (Unit:mm) ○Block diagram ○Pin No. / Pin name Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Regulator CLK 15 9 GND CW_CCW 16 MODE0 18 Translator RESET MODE1 19 ENABLE 20 14 PS UVLO OVLO TSD VREF 13 ＋ － 2bit DAC OCP 7 VCC1 2 OUT1B OSC Predriver Blank time PWM control 3 RNF1 Control logic ＋ － RNF2S 25 CR 10 5 OUT1A ＋ － RNF1S 4 22 VCC2 24 OUT2A 27 OUT2B MTH 12 TEST 17 Mix decay control Pin name GND OUT1B RNF1 RNF1S OUT1A NC VCC1 NC GND CR NC MTH VREF PS NC : Non Connection 26 RNF2 1 GND REV. A Pin No. 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Pin name CLK CW_CCW TEST MODE0 MODE1 ENABLE NC VCC2 NC OUT2A RNF2S RNF2 OUT2B NC 4/4 ○Operation Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Power supply lines As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) GND potential The potential of GND pin must be minimum potential in all operating conditions. (4) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (6) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (7) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (8) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. (9) Ground Wiring Pattern When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (10) TEST pin Be sure to connect TEST pin to GND. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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