Package Information www.vishay.com Vishay Siliconix Case Outline for TDFN8 2 x 2 Index Area (D/2 x E/2) MILLIMETERS A A3 A1 (6) D 7 E 2 DIM. MIN. NOM. MAX. MIN. NOM. A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 - 0.05 0.000 - 0.002 A3 8 1 INCHES 0.152 REF MAX. 0.006 REF b 0.18 0.23 0.28 0.007 0.009 0.011 D 1.95 2.00 2.05 0.077 0.079 0.081 D2 0.75 0.80 0.85 0.030 0.031 0.033 3 6 e E 1.95 2.00 2.05 0.077 0.079 0.081 4 5 E2 1.40 1.45 1.50 0.055 0.057 0.059 K - 0.25 - - 0.010 - L 0.30 0.35 0.40 0.012 0.014 0.016 Top View 0.05 C (7) Side View D2 Note (1) All dimensions are in millimeters which will govern. (2) Max. package warpage is 0.05 mm. (3) Max. allowable burrs is 0.076 mm in all directions. (4) Pin #1 ID on top will be laser/ink marked. (5) Dimension applies to meatlized terminal and is measured between 0.20 mm and 0.25 mm from terminal tip. (6) Applied only for terminals. (7) Applied for exposed pad and terminals. b (5) 1 7 2 6 3 5 4 e E2 8 0.020 BSC ECN: T15-0301-Rev. B, 29-Jun-15 DWG: 5997 L Pin 1 Indicator (Optional) 0.50 BSC K K Bottom View Revison: 29-Jun-15 1 Document Number: 67493 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000