Package Information

Package Information
www.vishay.com
Vishay Siliconix
Case Outline for TDFN8 2 x 2
Index Area
(D/2 x E/2)
MILLIMETERS
A
A3
A1 (6)
D
7
E
2
DIM.
MIN.
NOM.
MAX.
MIN.
NOM.
A
0.50
0.55
0.60
0.020
0.022
0.024
A1
0.00
-
0.05
0.000
-
0.002
A3
8
1
INCHES
0.152 REF
MAX.
0.006 REF
b
0.18
0.23
0.28
0.007
0.009
0.011
D
1.95
2.00
2.05
0.077
0.079
0.081
D2
0.75
0.80
0.85
0.030
0.031
0.033
3
6
e
E
1.95
2.00
2.05
0.077
0.079
0.081
4
5
E2
1.40
1.45
1.50
0.055
0.057
0.059
K
-
0.25
-
-
0.010
-
L
0.30
0.35
0.40
0.012
0.014
0.016
Top View
0.05 C
(7)
Side View
D2
Note
(1) All dimensions are in millimeters which will govern.
(2) Max. package warpage is 0.05 mm.
(3) Max. allowable burrs is 0.076 mm in all directions.
(4) Pin #1 ID on top will be laser/ink marked.
(5) Dimension applies to meatlized terminal and is measured
between 0.20 mm and 0.25 mm from terminal tip.
(6) Applied only for terminals.
(7) Applied for exposed pad and terminals.
b (5)
1
7
2
6
3
5
4
e
E2
8
0.020 BSC
ECN: T15-0301-Rev. B, 29-Jun-15
DWG: 5997
L
Pin 1 Indicator
(Optional)
0.50 BSC
K
K
Bottom View
Revison: 29-Jun-15
1
Document Number: 67493
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000