AOS Semiconductor Product Reliability Report AO7413, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AO7413. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO7413 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AO7413 uses advanced trench technology to provide excellent RDS(ON), low gate charge, and operation with gate voltages as low as 1.8V, in the small SC70 footprint. It can be used for a wide variety of applications, including load switching, low current inverters and low current DC-DC converters. It is ESD protected to 2KV HBM. -RoHS Compliant -Halogen Free Detailed information refers to datasheet. II. Die / Package Information: AO7413 Standard sub-micron Low voltage P channel Package Type SC70 Lead Frame Copper Die Attach Ag epoxy Bonding Wire Au wire Mold Material Epoxy resin with silica filler MSL (moisture sensitive level) Level 1 based on J-STD-020 Process Note * based on information provided by assembler and mold compound supplier III. Result of Reliability Stress for AO7413 Test Item Test Condition Time Point Lot Attribution Total Sample size Number of Failures MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB Temp = 150 °c, Vgs=100% of Vgsmax Standard - 4 lots 605pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 231pcs 0 3 lots JESD22A108 0 JESD22A108 220pcs 0 JESD22A110 77pcs / lot HTRB Temp = 150 °c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 3 lots 130 +/- 2°°c, 85%RH, 33.3 psi, Vgs = 100% of Vgs max 121°°c, 29.7psi, RH=100% 100 hrs 4 lots 96 hrs (Note A*) 3 lots 55 pcs / lot 165pcs 0 JESD22A102 -65°°c to 150°°c, air to air 250 / 500 cycles (Note A*) 4 lots 55 pcs / lot 220pcs 0 JESD22A104 (Note A*) 55 pcs / lot 231pcs 77pcs / lot HAST Pressure Pot Temperature Cycle Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 15 MTTF = 7435 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO7413). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 9 7 MTTF = 10 / FIT = 6.51 x 10 hrs = 7435 years / [2x3x2x77x500x258] = 15 Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s )] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 K = Boltzmann’s constant, 8.617164 X 10-5eV / K